DE3212442C2 - - Google Patents

Info

Publication number
DE3212442C2
DE3212442C2 DE3212442A DE3212442A DE3212442C2 DE 3212442 C2 DE3212442 C2 DE 3212442C2 DE 3212442 A DE3212442 A DE 3212442A DE 3212442 A DE3212442 A DE 3212442A DE 3212442 C2 DE3212442 C2 DE 3212442C2
Authority
DE
Germany
Prior art keywords
housing
line
connections
line connections
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3212442A
Other languages
German (de)
English (en)
Other versions
DE3212442A1 (de
Inventor
Dennis Lawndale Calif. Us Meddles
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Americas Corp
Original Assignee
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Corp USA filed Critical International Rectifier Corp USA
Publication of DE3212442A1 publication Critical patent/DE3212442A1/de
Application granted granted Critical
Publication of DE3212442C2 publication Critical patent/DE3212442C2/de
Granted legal-status Critical Current

Links

Classifications

    • H10W70/481—
    • H10W74/111—
    • H10W72/5524—
    • H10W72/932—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Packaging Frangible Articles (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE19823212442 1981-04-06 1982-04-02 Gehaeuseanordnung mit paarweise miteinander ausgerichteten leitungsanschluessen, insbesondere zur kapselung von halbleiterbauteilen Granted DE3212442A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/251,268 US4642419A (en) 1981-04-06 1981-04-06 Four-leaded dual in-line package module for semiconductor devices

Publications (2)

Publication Number Publication Date
DE3212442A1 DE3212442A1 (de) 1982-11-04
DE3212442C2 true DE3212442C2 (cg-RX-API-DMAC10.html) 1992-08-06

Family

ID=22951202

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823212442 Granted DE3212442A1 (de) 1981-04-06 1982-04-02 Gehaeuseanordnung mit paarweise miteinander ausgerichteten leitungsanschluessen, insbesondere zur kapselung von halbleiterbauteilen

Country Status (5)

Country Link
US (1) US4642419A (cg-RX-API-DMAC10.html)
JP (2) JPS57177548A (cg-RX-API-DMAC10.html)
DE (1) DE3212442A1 (cg-RX-API-DMAC10.html)
FR (1) FR2503454B1 (cg-RX-API-DMAC10.html)
GB (1) GB2096394B (cg-RX-API-DMAC10.html)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT8224533A0 (it) * 1982-12-01 1982-12-01 Ora Sgs Microelettronica Spa S Contenitore in metallo e resina ad elevata affidabilita' per dispositivo a semiconduttore.
JPS5996844U (ja) * 1982-12-21 1984-06-30 日本インタ−ナショナル整流器株式会社 半導体装置用リ−ドフレ−ム
JPH073848B2 (ja) * 1984-09-28 1995-01-18 株式会社日立製作所 半導体装置
JPS63201347U (cg-RX-API-DMAC10.html) * 1987-06-17 1988-12-26
DE4031051C2 (de) * 1989-11-14 1997-05-07 Siemens Ag Modul mit mindestens einem Halbleiterschaltelement und einer Ansteuerschaltung
JP2745933B2 (ja) * 1992-02-17 1998-04-28 日本電気株式会社 Ｔａｂ−集積回路
US5337216A (en) * 1992-05-18 1994-08-09 Square D Company Multichip semiconductor small outline integrated circuit package structure
USD353575S (en) 1993-03-29 1994-12-20 Cornell Dubilier Electronics, Inc. Flatpack capacitor
US5798287A (en) * 1993-12-24 1998-08-25 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Method for forming a power MOS device chip
DE69321966T2 (de) * 1993-12-24 1999-06-02 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania Leistungs-Halbleiterbauelement
DE69321965T2 (de) * 1993-12-24 1999-06-02 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania MOS-Leistungs-Chip-Typ und Packungszusammenbau
TW354859B (en) * 1994-02-07 1999-03-21 Siemens Ag A storage unit of semiconductor assembled of multi-memory chips and its manufacturing method a semiconductor memory system is composed with several single memory chips or different designed memory units
US5647124A (en) * 1994-04-25 1997-07-15 Texas Instruments Incorporated Method of attachment of a semiconductor slotted lead to a substrate
EP0697728B1 (en) * 1994-08-02 1999-04-21 STMicroelectronics S.r.l. MOS-technology power device chip and package assembly
JP3426801B2 (ja) * 1995-08-15 2003-07-14 株式会社ミツバ 電子部品
US6476549B2 (en) * 2000-10-26 2002-11-05 Mu-Chin Yu Light emitting diode with improved heat dissipation
US7573159B1 (en) 2001-10-22 2009-08-11 Apple Inc. Power adapters for powering and/or charging peripheral devices
DE102008048259B4 (de) * 2008-09-22 2024-10-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Gehäuse für ein optoelektronisches Bauteil, seitlich emittierendes Bauteil mit einem Gehäuse und Verfahren zur Herstellung eines Gehäuses
DE102010038988A1 (de) * 2009-08-05 2011-02-10 Continental Teves Ag & Co. Ohg Sensoranordnung und Chip mit zusätzlichen Befestigungsbeinen
US20130081845A1 (en) * 2011-09-30 2013-04-04 Edward Siahaan Housing for electronic components
JP6058353B2 (ja) * 2012-11-02 2017-01-11 株式会社東芝 半導体装置
KR102015966B1 (ko) 2016-06-30 2019-08-29 유겐가이샤 쇼난 엔지니어링 마그넷식 칩 컨베이어
US11923344B2 (en) 2021-11-11 2024-03-05 Wolfspeed, Inc. Compact power module
US12150258B2 (en) 2022-05-04 2024-11-19 Wolfspeed, Inc. Dual inline power module

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3522490A (en) * 1965-06-28 1970-08-04 Texas Instruments Inc Semiconductor package with heat conducting mounting extending from package on side opposite conductor extensions
NL157456B (nl) * 1968-07-30 1978-07-17 Philips Nv Halfgeleiderinrichting in een isolerende kunststofomhulling.
US3668299A (en) * 1971-04-29 1972-06-06 Beckman Instruments Inc Electrical circuit module and method of assembly
JPS495388A (cg-RX-API-DMAC10.html) * 1972-05-01 1974-01-18
US3839660A (en) * 1973-02-05 1974-10-01 Gen Motors Corp Power semiconductor device package
US4023053A (en) * 1974-12-16 1977-05-10 Tokyo Shibaura Electric Co., Ltd. Variable capacity diode device
FR2368868A7 (fr) * 1976-10-21 1978-05-19 Ates Componenti Elettron Dispositif a semi conducteurs en forme de boitier
US4203792A (en) * 1977-11-17 1980-05-20 Bell Telephone Laboratories, Incorporated Method for the fabrication of devices including polymeric materials
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof

Also Published As

Publication number Publication date
FR2503454A1 (fr) 1982-10-08
DE3212442A1 (de) 1982-11-04
GB2096394A (en) 1982-10-13
US4642419A (en) 1987-02-10
FR2503454B1 (fr) 1986-04-04
GB2096394B (en) 1985-02-20
JPS6444645U (cg-RX-API-DMAC10.html) 1989-03-16
JPS57177548A (en) 1982-11-01

Similar Documents

Publication Publication Date Title
DE3212442C2 (cg-RX-API-DMAC10.html)
DE69204754T2 (de) Klemmleiste für gedruckte Leiterplatten.
DE10232566B4 (de) Halbleiterbauteil
DE69829120T2 (de) Anschlussblock für Federdrähte für Kommunikationsverbinder
DE3544838C2 (cg-RX-API-DMAC10.html)
AT398254B (de) Chipträger sowie anordnung von solchen chipträgern
DE3883805T2 (de) An der Oberfläche montierbarer elektrischer Stecker.
DE69317741T2 (de) Doppelt lesbarer SIMM-Sockel für Anwendungen hoher elektrischer Signalgeschwindigkeit
DE2455619A1 (de) Steckverbinder-anordnung
DE69931430T2 (de) Modularer Verbinder für hohe Übertragungsgeschwindigkeiten
DE1615691A1 (de) Vielfach-Steckverbinder und Verfahren zu seiner Herstellung
DE19747105A1 (de) Bauelement mit gestapelten Halbleiterchips
DE3706953A1 (de) Filtersteckverbinder
DE2230337A1 (de) Elektrische verbinderanordnung
DE3600447A1 (de) Entkopplungskondensator und verfahren zu seiner herstellung
DE102015104185A1 (de) Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
DE3854437T2 (de) Chipkondensator.
DE19651549B4 (de) Anschlußrahmen und Chipgehäuse
DE2232928A1 (de) Elektrische mehrkomponentenvorrichtung
DE3104441A1 (de) Steckverbinderbuchse fuer anschlussstifte
DE60224860T2 (de) Klemmenblock und Kabelverbinder
DE3730662C2 (cg-RX-API-DMAC10.html)
DE4213251A1 (de) Halbleiterbaustein und verfahren zu dessen herstellung sowie behaelter zur ummantelung eines halbleiterelements
DE19739958A1 (de) Mit Filter versehener Adapter und Verbinder
DE69609921T2 (de) Herstellungsverfahren einer halbleiteranordnung geeignet zur oberflächenmontage

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8125 Change of the main classification

Ipc: H01L 23/48

D2 Grant after examination
8363 Opposition against the patent
8366 Restricted maintained after opposition proceedings
8305 Restricted maintenance of patent after opposition
D4 Patent maintained restricted
8339 Ceased/non-payment of the annual fee