FR2368868A7 - Dispositif a semi conducteurs en forme de boitier - Google Patents

Dispositif a semi conducteurs en forme de boitier

Info

Publication number
FR2368868A7
FR2368868A7 FR7731267A FR7731267A FR2368868A7 FR 2368868 A7 FR2368868 A7 FR 2368868A7 FR 7731267 A FR7731267 A FR 7731267A FR 7731267 A FR7731267 A FR 7731267A FR 2368868 A7 FR2368868 A7 FR 2368868A7
Authority
FR
France
Prior art keywords
box
conductive device
shaped semi
metal element
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7731267A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
ATES Componenti Elettronici SpA
SGS ATES Componenti Elettronici SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ATES Componenti Elettronici SpA, SGS ATES Componenti Elettronici SpA filed Critical ATES Componenti Elettronici SpA
Application granted granted Critical
Publication of FR2368868A7 publication Critical patent/FR2368868A7/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
    • H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)

Abstract

La présente invention concerne un dispositif à semi conducteurs en forme de boîtier. Il est caractérisé par le fait qu'il comporte un diffuseur de chaleur un élément métallique relativement étendu englobé dans le corps en plastique et au moins deux des broches sortant de l'un des côtés du corps, l'élément métallique et les broches étant réalisés en une seule pièce, en une tôle métallique. L'invention s'applique en électronique.
FR7731267A 1976-10-21 1977-10-18 Dispositif a semi conducteurs en forme de boitier Expired FR2368868A7 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT2234876 1976-10-21

Publications (1)

Publication Number Publication Date
FR2368868A7 true FR2368868A7 (fr) 1978-05-19

Family

ID=11195025

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7731267A Expired FR2368868A7 (fr) 1976-10-21 1977-10-18 Dispositif a semi conducteurs en forme de boitier

Country Status (5)

Country Link
US (1) US4209798A (fr)
DE (1) DE2747393A1 (fr)
FR (1) FR2368868A7 (fr)
GB (1) GB1581285A (fr)
SE (1) SE437900B (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330683A (en) * 1980-12-03 1982-05-18 Bell Telephone Laboratories, Incorporated Encapsulation for semiconductor device
US4642419A (en) * 1981-04-06 1987-02-10 International Rectifier Corporation Four-leaded dual in-line package module for semiconductor devices
CA1200619A (fr) * 1982-02-16 1986-02-11 William S. Phy Cadre de montage de circuit integre a dissipation de la chaleur amelioree
IT1213259B (it) * 1984-12-18 1989-12-14 Sgs Thomson Microelectronics Gruppo a telaio di conduttori per circuiti integrati con capacita' di termodispersione incrementata, erelativo procedimento.
US4706811A (en) * 1986-03-03 1987-11-17 General Motors Corporation Surface mount package for encapsulated tape automated bonding integrated circuit modules
FR2615325A1 (fr) * 1987-05-15 1988-11-18 Neiman Sa Procede pour la realisation de composants de puissance destines a l'industrie automobile
JPH0691174B2 (ja) * 1988-08-15 1994-11-14 株式会社日立製作所 半導体装置
US4970579A (en) * 1988-09-21 1990-11-13 International Business Machines Corp. Integrated circuit package with improved cooling means
US4961107A (en) * 1989-04-03 1990-10-02 Motorola Inc. Electrically isolated heatsink for single-in-line package
JP2816244B2 (ja) * 1990-07-11 1998-10-27 株式会社日立製作所 積層型マルチチップ半導体装置およびこれに用いる半導体装置
EP0588491A3 (fr) * 1992-08-14 1994-11-30 Texas Instruments Inc Cadre de conducteur pour circuits intégrés et procédé pour améliorer la dissipation de chaleur.
US5457071A (en) * 1993-09-03 1995-10-10 International Business Machine Corp. Stackable vertical thin package/plastic molded lead-on-chip memory cube
EP0669651A1 (fr) * 1994-02-28 1995-08-30 AT&T Corp. Procédé et appareil pour refroidir des composants électroniques
US6326687B1 (en) 1998-09-01 2001-12-04 Micron Technology, Inc. IC package with dual heat spreaders
US6247940B1 (en) * 1999-08-23 2001-06-19 Avaya Technology Corp. Connector having improved high-voltage surge performance
US6351385B1 (en) * 2000-09-26 2002-02-26 Thomson Licensing, S.A. Heat sink for integrated circuit packages
US20060192273A1 (en) * 2005-02-25 2006-08-31 Texas Instruments Incorporated Integrated circuit package and method of manufacture thereof
DE102006035876A1 (de) * 2006-08-01 2008-02-07 Infineon Technologies Ag Chip-Modul, Verfahren zur Herstellung eines Chip-Moduls und Mehrfachchip-Modul
US9484320B2 (en) * 2012-04-27 2016-11-01 Freescale Semiconductor, Inc. Vertically packaged integrated circuit
DE102014117943B4 (de) * 2014-12-05 2022-12-08 Infineon Technologies Austria Ag Vorrichtung mit einer Leiterplatte und einem Metallwerkstück
JP6891904B2 (ja) * 2017-02-06 2021-06-18 富士電機株式会社 半導体モジュール、電気自動車およびパワーコントロールユニット

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3391426A (en) * 1965-10-22 1968-07-09 Motorola Inc Molding apparatus
US3548927A (en) * 1968-11-29 1970-12-22 Intern Electronic Research Co Heat dissipating retainer for electronic component
US3628483A (en) * 1970-03-20 1971-12-21 Amp Inc Method of making power frame for integrated circuit
US3654695A (en) * 1970-07-29 1972-04-11 Texas Instruments Inc Method of making an electronic module
US3670215A (en) * 1970-09-28 1972-06-13 Staver Co Inc The Heat dissipator for integrated circuit
GB1334173A (en) * 1971-06-02 1973-10-17 Redpoint Ltd Twisted vane heat sink
US3611061A (en) * 1971-07-07 1971-10-05 Motorola Inc Multiple lead integrated circuit device and frame member for the fabrication thereof
US3723833A (en) * 1971-07-19 1973-03-27 Rca Corp Heat sinking of semiconductor integrated circuit devices
US3958075A (en) * 1974-11-11 1976-05-18 Gentron Corporation High power thick film circuit with overlapping lead frame
US4004195A (en) * 1975-05-12 1977-01-18 Rca Corporation Heat-sink assembly for high-power stud-mounted semiconductor device
US4054901A (en) * 1975-10-14 1977-10-18 Thermalloy, Inc. Index mounting unitary heat sink apparatus with apertured base
US4093971A (en) * 1976-12-10 1978-06-06 Burroughs Corporation D-I-P On island

Also Published As

Publication number Publication date
SE7711731L (sv) 1978-04-22
US4209798A (en) 1980-06-24
DE2747393A1 (de) 1978-04-27
SE437900B (sv) 1985-03-18
GB1581285A (en) 1980-12-10

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