GB1334173A - Twisted vane heat sink - Google Patents

Twisted vane heat sink

Info

Publication number
GB1334173A
GB1334173A GB1334173DA GB1334173A GB 1334173 A GB1334173 A GB 1334173A GB 1334173D A GB1334173D A GB 1334173DA GB 1334173 A GB1334173 A GB 1334173A
Authority
GB
United Kingdom
Prior art keywords
heat sink
fins
blank
edges
june
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
REDPOINT Ltd
Original Assignee
REDPOINT Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by REDPOINT Ltd filed Critical REDPOINT Ltd
Publication of GB1334173A publication Critical patent/GB1334173A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49568Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacture Of Motors, Generators (AREA)

Abstract

1334173 Bending cutters REDPOINT Ltd 1 June 1972 [2 June 1971] 18683/71 Heading B3W [Also in Division H1] The fins 2 of a heat sink for a semi-conductor device are formed by a series of slits along the edge of a metal blank and are simultaneously twisted to reduce the degree of cross-radiation between fins while minimizing the amount of metal removed from the heat sink. Preferably the fins 2 are then bent out of the plane of the blank, and as shown this may be done on two edges to provide a U-shaped heat sink. Fins 2 may similarly be provided on four or more edges of a heat sink, and two such sinks may be nested together. The fins are formed by placing the blank on two spaced dies having saw-toothed profiles and pressing a mating pair of dies down on to the blank to slit and twist its edges.
GB1334173D 1971-06-02 1971-06-02 Twisted vane heat sink Expired GB1334173A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1868371 1971-06-02

Publications (1)

Publication Number Publication Date
GB1334173A true GB1334173A (en) 1973-10-17

Family

ID=10116629

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1334173D Expired GB1334173A (en) 1971-06-02 1971-06-02 Twisted vane heat sink

Country Status (1)

Country Link
GB (1) GB1334173A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4095253A (en) * 1975-11-29 1978-06-13 Hitachi, Ltd. Single in-line high power resin-packaged semiconductor device having an improved heat dissipator
US4209798A (en) * 1976-10-21 1980-06-24 Sgs-Ates Componenti Elettronici S.P.A. Module for integrated circuits
US4345267A (en) * 1980-03-31 1982-08-17 Amp Incorporated Active device substrate connector having a heat sink
US4481525A (en) * 1982-08-12 1984-11-06 Anthony D. Calabro Heat dissipator for integrated circuit chips
GB2199775A (en) * 1987-01-15 1988-07-20 Marston Palmer Ltd Heat sink
US6273186B1 (en) 2000-03-13 2001-08-14 Satcon Technology Corporation Low-cost, high density, staggered pin fin array
US6634421B2 (en) 2000-03-10 2003-10-21 Satcon Technology Corporation High performance cold plate for electronic cooling
US7017655B2 (en) 2003-12-18 2006-03-28 Modine Manufacturing Co. Forced fluid heat sink
US7159649B2 (en) 2004-03-11 2007-01-09 Thermal Corp. Air-to-air heat exchanger

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4095253A (en) * 1975-11-29 1978-06-13 Hitachi, Ltd. Single in-line high power resin-packaged semiconductor device having an improved heat dissipator
US4209798A (en) * 1976-10-21 1980-06-24 Sgs-Ates Componenti Elettronici S.P.A. Module for integrated circuits
US4345267A (en) * 1980-03-31 1982-08-17 Amp Incorporated Active device substrate connector having a heat sink
US4481525A (en) * 1982-08-12 1984-11-06 Anthony D. Calabro Heat dissipator for integrated circuit chips
GB2199775A (en) * 1987-01-15 1988-07-20 Marston Palmer Ltd Heat sink
US6634421B2 (en) 2000-03-10 2003-10-21 Satcon Technology Corporation High performance cold plate for electronic cooling
US6273186B1 (en) 2000-03-13 2001-08-14 Satcon Technology Corporation Low-cost, high density, staggered pin fin array
US7017655B2 (en) 2003-12-18 2006-03-28 Modine Manufacturing Co. Forced fluid heat sink
US7159649B2 (en) 2004-03-11 2007-01-09 Thermal Corp. Air-to-air heat exchanger

Similar Documents

Publication Publication Date Title
GB1334173A (en) Twisted vane heat sink
CA942130A (en) Tool for deep drawing, punching or the like
IL34351A0 (en) Stamping arrangement with electro-mechanically adjustable punching tools
JPS5511702A (en) Automaticcchippdischarge punching tool
GB1116245A (en) Staple blank and staple element strip
GB973449A (en) A method of manufacturing metal boxes
GB1022902A (en) Improvements in or relating to methods of manufacturing cutting blades, particularly for hair-clippers, and blades manufactured by these methods
GB1408444A (en) Punching tools
ES329435A1 (en) Procedure and device for formation of stamped pieces. (Machine-translation by Google Translate, not legally binding)
GB1083297A (en) Frame corner joint
GB1476083A (en) Steel band closures
ES399059A1 (en) Manufacturing procedure of a resistant heating element and resistant element as well obtained. (Machine-translation by Google Translate, not legally binding)
JPS542068A (en) Manufacture for semiconductor device
FR2318287A1 (en) Skid prevention grating with intersecting slotted bars - has slits between adjacent carrier bar apices curved in opposte sense
FR93556E (en) Stamping process in particular for making deep containers from thin metal sheets as well as articles conforming to those obtained or a similar process.
CA847020A (en) Combined cutting, punching and bending tool
GB1208638A (en) Press tool
GB1361401A (en) Punching tool
GB1329655A (en) Sliding clasp fastener
CA975550A (en) Coolants for metal cutting works
FR1533754A (en) Compression tool for electrical connectors or the like, electrical connectors thus obtained and their various applications
AU425740B2 (en) Method of manufacturing twist drills or similar tools, and tools, especially twist drills produced by same
ES146852U (en) Pulley for belt trapezoidal. (Machine-translation by Google Translate, not legally binding)
ES297254A1 (en) Refrigeration installation (Machine-translation by Google Translate, not legally binding)
CA821751A (en) Casing fastening machine with adjustable crimping die

Legal Events

Date Code Title Description
PS Patent sealed
PE20 Patent expired after termination of 20 years