GB2199775A - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- GB2199775A GB2199775A GB8800382A GB8800382A GB2199775A GB 2199775 A GB2199775 A GB 2199775A GB 8800382 A GB8800382 A GB 8800382A GB 8800382 A GB8800382 A GB 8800382A GB 2199775 A GB2199775 A GB 2199775A
- Authority
- GB
- United Kingdom
- Prior art keywords
- heat sink
- strip
- sheet
- aluminium
- fingers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 8
- 239000004411 aluminium Substances 0.000 claims abstract description 8
- 238000007743 anodising Methods 0.000 claims abstract description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000002048 anodisation reaction Methods 0.000 description 1
- 239000000549 coloured material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
An anodised heat sink for cooling electronic components if manufactured by pre-anodising a sheet or strip of aluminium or aluminium alloy, and stamping the heat sink from the pre-anodised sheet or strip. The anodising results in a dark coloured heat sink having enhanced heat loss by radiation; Fingers 8, 9 of the heat sink may be straight (as shown), or twisted. <IMAGE>
Description
Heat Sink
This invention relates to heat sinks and has particular, but not exclusive, reference to dark coloured heat sinks.
It is known to manufacture heat sinks of aluminium or an aluminium alloy by pressing the heat sink from a sheet or strip of alloy. It is also known to vary the surface of such heat sinks by anodising to enhance the ability of the heat sink to remove heat by radiation from electronic components cooled by the heat sink.
The anodising step is expensive and often costs as much as, if not more than, the material costs and other processing costs of the heat sink itself.
By the present invention there is provided a method of manufacturing a heat sink comprising the steps of pre-anodising a sheet or strip of aluminium or an aluminium alloy and stamping the heat sink from the pre-anodised sheet.
The sheet or strip may be coloured black or a very dark colour, particularly dark blue or any other colour.
The present invention also provides a heat sink of aluminium or an aluminium alloy, the heat sink having been manufactured by stamping from a sheet or strip in which the sheet or strip is pre-anodised prior to stamping. The heat sink may be substantially U-shaped in section, each leg of the U being in the form of a series of fingers. The fingers may be twisted to lie in planes at an angle to the plane of the legs.
The pre-anodisation process may comprise a black anodising process to produce a black sheet.
By way of example embodiments of the present invention will now be described with reference to the accompanying drawings, of which:
Figure 1 is a strip of aluminium with a stamped
portion removed;
Figure 2 is a perspective view of one form of heat
sink in accordance with the present invention;
Figure 3 is a plan view of Figure 2 along the lines
of arrow III; and
Figure 4 is a plan view of an alternative form of
heat sink configuration.
Referring to Figure 1 this shows a strip of aluminium 1 which has on its upper surface 2 and lower surface 3 a black anodised layer. The window 4 in the strip is where a heat sink has been stamped from the strip. A typical heat sink is shown in Figure 2.
Referring to Figure 2 this shows a heat sink of generally U-shape having a base 5 with a pair of upstanding legs 6, 7. Each leg is formed of a series of fingers 8, 9.
The heat sink is formed in a single operation by stamping the sink from the strip shown in Figure 1. If required, holes may be prvided in the base as at 10.
In an alternative form of the invention the fingers are twisted to lie at an angle to the main plane of the legs as is shown in Figure 4, where the fingers 11, 12 are twisted to be inclined to the main planes of the legs.
It will be appreciated that the act of cutting the fingers exposes unanodised material. However, it has been found that the exposure of unanodised layers has very little effect on the overall efficiency of the heat sink.
It has also unexpectedly been found that, in addition to the lack of effect of the unanodised sides of the fingers, the whole operation can be carried out without damaging the pre-anodised layer to such an extent that it is no longer effective.
By very dark colour as used herein, is meant a colour which has a significant advantage in radiating heat compared to a metallic coloured material.
Claims (6)
1. A method of manufacturing a heat sink comprising the steps of pre-anodising a sheet or strip of aluminium or an aluminium alloy and stamping the heat sink from the pre-anodised sheet.
2. A heat sink of aluminium or an aluminium alloy, the heat sink having been manufactured by stamping from a sheet or strip in which the sheet or strip is pre-anodised prior to stamping.
3. A heat sink as claimed in Claim 2 or when manufactured by the method of Claim 1 which is substantially 'U' shaped in cross section, each leg of the 'U' being in the form of a series of fingers.
4. A heat sink as claimed in Claim 3 in which the fingers are twisted to lie in planes at an angle to the plane of the legs.
5. A heat sink as claimed in Claim 2, 3 or 4 which is coloured black or a very dark colour.
6. A method of manufacturing a heat sink substantially as herein described with reference to and as illustrated by the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8700842A GB8700842D0 (en) | 1987-01-15 | 1987-01-15 | Heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB8800382D0 GB8800382D0 (en) | 1988-02-10 |
| GB2199775A true GB2199775A (en) | 1988-07-20 |
Family
ID=10610708
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8700842A Pending GB8700842D0 (en) | 1987-01-15 | 1987-01-15 | Heat sink |
| GB8800382A Pending GB2199775A (en) | 1987-01-15 | 1988-01-08 | Heat sink |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8700842A Pending GB8700842D0 (en) | 1987-01-15 | 1987-01-15 | Heat sink |
Country Status (1)
| Country | Link |
|---|---|
| GB (2) | GB8700842D0 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5311928A (en) * | 1993-06-28 | 1994-05-17 | Marton Louis L | Heat dissipator |
| GB2300974A (en) * | 1995-05-16 | 1996-11-20 | Redpoint Thermalloy Ltd | Heatsinks having fin members joined to a base |
| GB2300975A (en) * | 1995-05-16 | 1996-11-20 | Redpoint Thermalloy Ltd | Heatsinks having fin members joined to a base |
| GB2313073A (en) * | 1996-05-16 | 1997-11-19 | Redpoint Thermalloy Ltd | A method and apparatus for manufacturing heatsink devices |
| GB2358916A (en) * | 1999-12-07 | 2001-08-08 | Sunonwealth Electr Mach Ind Co | Heat dissipating device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB720297A (en) * | 1951-01-03 | 1954-12-15 | Ekco Products Company | Improvements in or relating to the fabrication of drawn tin plated articles |
| US3572428A (en) * | 1969-01-29 | 1971-03-23 | Motorola Inc | Clamping heat sink |
| GB1334173A (en) * | 1971-06-02 | 1973-10-17 | Redpoint Ltd | Twisted vane heat sink |
| GB1361566A (en) * | 1972-03-10 | 1974-07-30 | Staver Co | Heat dissipator for use with semiconductors |
| US4054901A (en) * | 1975-10-14 | 1977-10-18 | Thermalloy, Inc. | Index mounting unitary heat sink apparatus with apertured base |
-
1987
- 1987-01-15 GB GB8700842A patent/GB8700842D0/en active Pending
-
1988
- 1988-01-08 GB GB8800382A patent/GB2199775A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB720297A (en) * | 1951-01-03 | 1954-12-15 | Ekco Products Company | Improvements in or relating to the fabrication of drawn tin plated articles |
| US3572428A (en) * | 1969-01-29 | 1971-03-23 | Motorola Inc | Clamping heat sink |
| GB1334173A (en) * | 1971-06-02 | 1973-10-17 | Redpoint Ltd | Twisted vane heat sink |
| GB1361566A (en) * | 1972-03-10 | 1974-07-30 | Staver Co | Heat dissipator for use with semiconductors |
| US4054901A (en) * | 1975-10-14 | 1977-10-18 | Thermalloy, Inc. | Index mounting unitary heat sink apparatus with apertured base |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5311928A (en) * | 1993-06-28 | 1994-05-17 | Marton Louis L | Heat dissipator |
| GB2300974A (en) * | 1995-05-16 | 1996-11-20 | Redpoint Thermalloy Ltd | Heatsinks having fin members joined to a base |
| GB2300975A (en) * | 1995-05-16 | 1996-11-20 | Redpoint Thermalloy Ltd | Heatsinks having fin members joined to a base |
| GB2300974B (en) * | 1995-05-16 | 1999-12-29 | Redpoint Thermalloy Ltd | A heatsink and a method of forming the same |
| GB2313073A (en) * | 1996-05-16 | 1997-11-19 | Redpoint Thermalloy Ltd | A method and apparatus for manufacturing heatsink devices |
| GB2313073B (en) * | 1996-05-16 | 1999-05-26 | Redpoint Thermalloy Ltd | A method and an apparatus for manufacturing heatsink devices |
| GB2358916A (en) * | 1999-12-07 | 2001-08-08 | Sunonwealth Electr Mach Ind Co | Heat dissipating device |
| GB2358916B (en) * | 1999-12-07 | 2003-07-09 | Sunonwealth Electr Mach Ind Co | Heat-dissipating device and method for manufacturing a housing of the heat-dissipating device |
Also Published As
| Publication number | Publication date |
|---|---|
| GB8800382D0 (en) | 1988-02-10 |
| GB8700842D0 (en) | 1987-02-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4879891A (en) | Method of manufacturing heat sink apparatus | |
| US4884331A (en) | Method of manufacturing heat sink apparatus | |
| US5844312A (en) | Solderable transistor clip and heat sink | |
| EP0989606A3 (en) | Power module substrate, method of producing the same, and semiconductor device including the substrate | |
| CA2186978A1 (en) | A contact spring | |
| US5422789A (en) | Printed circuit board component mounting device | |
| US5499450A (en) | Method of manufacturing a multiple pin heatsink device | |
| GB2286922A (en) | Pin type radiating fin andprocess for manufacturing same | |
| ES2173907T3 (en) | METHOD AND APPARATUS FOR THE MANUFACTURE OF HIGH DENSITY HEAT HEAT SINKS. | |
| MY110985A (en) | A process and an apparatus for forming a rpofile element | |
| GB2199775A (en) | Heat sink | |
| US20020043359A1 (en) | Heat sink for electronic parts and manufacture thereof | |
| JPH06181396A (en) | Heat pipe system cooling device for circuit board | |
| JP2570832Y2 (en) | Heat sink for semiconductor | |
| JP3453612B2 (en) | Manufacturing method of pin fin heat sink | |
| KR19990014818A (en) | Heat sink and assembly method | |
| EP1015836B1 (en) | Heat sink including pedestal | |
| JPS62193162A (en) | Method for depression of lead frame | |
| JP2001308231A (en) | Electronic component radiator and method of manufacturing it | |
| US20030049928A1 (en) | Method of manufacturing heat dissipation device | |
| KR950034716A (en) | Method for manufacturing heat sinks, devices for heat sinks, and heat-generating parts cooling devices | |
| JP3674552B2 (en) | Thermally conductive plate material and method of manufacturing heat sink assembly | |
| DE19832450A1 (en) | Heat sink for surface mounted power semiconductor device | |
| FR2806154A1 (en) | Heat dissipating device has housing that includes central area and fins, with slit formed in between each two adjacent fins, and mounting plate with fan that is secured to housing | |
| JP4215927B2 (en) | Electronic component heatsink |