JP2570832Y2 - Heat sink for semiconductor - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink for a semiconductor, and more particularly to a heat sink for a semiconductor mounted on a printed circuit board.

[0002]

Conventional printed circuit board mounting type semiconductor heat sink is 7 to 8, respectively in FIGS. 9 to 10
A conventional example is shown . Among them, the conventional example shown in FIGS.
A heat sink body 53 having a plurality of fins 54;
Of the lower end surface of the heat sink body 53 of FIG.
Heat sink fixing solder terminal 59 provided above
And a configuration including Reference numeral 58 is for fixing a semiconductor.
Shows the screw holes. The pre-processor shown in FIGS.
Heat sinks for semiconductors mounted on printed circuit boards
Solder to the board via the soldering terminal 59 for fixing the sink
It is designed to be fixed by the cliff. Where the cooling target
The target semiconductor is attached to a flat portion of the heat sink body 53 except for the fins 54 . Also,
9 and 10 show another conventional example. 9 to 1
In the case of No. 0, the heat
Heat sink fixing instead of solder fixing terminal 59 for link fixing
Screw holes 60 are provided.
Screw the heat sink body 53 to the substrate via the hole 60
It is configured to be.

[0003]

An invention is, however, in the conventional printed circuit board mounting type semiconductor heat sink, since the solid <br/> constant was fixed using screws or soldered terminal,
Process becomes more during installation, and, in the case of soldering the terminal type, peeling of the printed circuit board copper foil was a disadvantage that occurs especially due to vibration or the like and floating mounting there. Therefore, complicated management during assembly, also when cutting the excess after terminal soldering, generated wear of the blade of the cutting machine, this is the process, management, in terms of equipment, etc., the price increases Was a factor.

[0004] Further , the number of semiconductors to be cooled is such that the semiconductors are mounted only on the flat portions excluding the fins.
The heat sink also becomes more when the semiconductor number number attached is limited to cooling Ru plurality Oh, can not efficiently cooled.

[0005]

The object of the present invention is to improve the disadvantages of the prior art, and in particular, to reduce the time and labor required for mounting on a printed circuit board and to mount a large number of semiconductors to be cooled simultaneously and effectively. It is an object of the present invention to provide a semiconductor heat sink for a printed circuit board, which has a good performance.

[0006]

According to the present invention, a semiconductor device is mounted.
A heat sink body 3 having a plurality of fins projecting Bei capable formed and toward the outside, and a engagement means for attaching the heat sink body 3 on the printed board 5
In the semiconductor heat sink described above, the above-mentioned engaging means is connected to the above-mentioned printed circuit board 5 of the heat sink body 3 .
Locking grooves formed on the opposing surface along the printed circuit board 5
And the resin embedded fixing device fitted into the locking groove.
Be configured. And the above-mentioned resin embedded type fixing tool,
Slide locking portion that engages with the locking groove of the heat sink body 3
1C and a print base connected to the slide locking portion 1C.
A protruding locking portion 1A protruding toward the plate 5;
It is provided integrally with the tip of the stop 1A and is pre-installed on the printed circuit board.
And a locking portion having a J-shaped cross section that engages with the locking hole 5A provided . This aims to achieve the above-mentioned object.

[0007]

1 and 2 show a first embodiment of the present invention.
It will be described based on. In FIGS. 1 and 2, reference numeral 3
It is formed so that it can be equipped with a semiconductor and is protruded outward.
2 shows a heat sink body having a plurality of fins 4. This
The heatsinks body 3, the heatsink body 3
Equipped with engagement means for attaching to the printed circuit board 5
ing. This engaging means is provided on the heat sink body 3 as described above.
Along the printed board 5 facing the printed board 5
And a resin fitted into the locking groove
And a fixture 1 made of an embedded type . this
The resin-embedded fixture 1 is a heat sink
A slide locking portion 1C that engages with the locking groove of the body 3;
Connected to the ride lock 1C and connected to the printed circuit board 5 described above.
The projecting locking portion 1A protruding toward the
A printed circuit board 5 which is provided integrally at the tip of A
And a locked portion 1B having a J-shaped cross section that engages with a locking hole 5A provided in advance .

In this embodiment, the heat sink body 3 is shown in FIG.
4 fins 4 are provided at equal intervals as shown in, it is supported integrally by the lower end base portion 3A of the Figure 1. The central portion of the lower surface side in FIG. 1 of the heatsink body 3, the resin constituting the main part of the engagement means described above
An embedded fixture 1 is detachably provided. This tree
As described above , the embedding-type fixed fixture 1 made of fat includes the slide locking portions 1C, 1C fitted into the locking grooves formed in the heat sink body 3. In addition, this resin embedded type fixed
The tool 1 is, as described above, a locking hole 5A of the printed circuit board 5.
Has engaged the locking portion 1A, the engaging portion 1B of the tip portion is handled as a single plate somewhat is bent during assembly, after insertion completion of the printed circuit board 5 As shown in FIG. 2, it is in a somewhat open state and is locked to the printed circuit board 5.

In the present embodiment, the fins 4 located at both ends of the heat sink body 3 have semiconductors 6, 6 to be cooled detachably attached thereto by a clip-shaped holding member 7 having a U-shaped cross section and having a spring effect. Fixed.

For this reason, in this embodiment, the fixing method is not to use screws or soldering terminals as a fixing method .
Since the embedded fixing device 1 is used and the structure is inserted into the locking groove of the printed circuit board from the side, there is an advantage that the mounting is completed in a single step and the floating management after the mounting can be simplified. Moreover, those of the sub come structure described above, the fixing threaded hole or requires terminal mounting processing solderability, had caused the high prices, in the structure of this embodiment, push shape In the case of the fixture, it is only necessary to insert the fixture from the side after the heat sink is formed, and the structure can be simplified. Further, since the fins 4 have an upward structure, a large number of flat portions can be ensured, and the semiconductor 6 to be cooled can be placed at an arbitrary place in an arbitrary number by the number of the press fittings 7.
There is an advantage that it can be fixed and attached.

[0011]

Second Embodiment Next, a second embodiment will be described with reference to FIGS. In the second embodiment, while the engaging portion 1B which is locked to the printed circuit board 5 of the resin implantable fastener 1 of the first embodiment described above is adapted to open on one side It is characterized in that it opens on both sides. In this case, inside the two engaged portion 1B,
Abutting members 5D, 5D having a spring effect for abutting against the inner wall of the locking hole 5A of the printed circuit board 5 when opened;
Thereby, the movement to the left and right in FIG. 4 is suppressed. Other configurations are the same as those of the first embodiment.

Also in the second embodiment, the first embodiment
In addition to having the same functions and effects as the embodiment ,
Lateral movement of the embedded resin fixture 1 to the left and right is suppressed.
In this respect, the seismic resistance has been enhanced.

[0013]

Next, a modification of the present invention will be described with reference to FIGS. This modification is characterized in that the engaging means disclosed in the first and second embodiments is formed integrally with the heat sink body 3 using the same member as the heat sink body 3.

[0014] In this case, Kakarigote stage, 5 to 6, is composed of a printed circuit board mounting ChoIzururi 2 in cross-section is formed in an inverted T-shape. Other configurations are the same as those of the first embodiment.

The modifications shown in FIGS. 5 and 6 have the advantage that the work of assembling the resin-made embedded fixture 1 in each of the above-mentioned embodiments becomes unnecessary. Others
The structure and the like of the heat sink body 3 are the same as those of the first embodiment.

[0016]

Since the present invention is constructed and functions as described above, according to the present invention, the mounting of the heat sink body on the printed circuit board is facilitated, so that the mounting operation can be performed quickly and smoothly, and at the same time, the heat sink can be mounted. It is possible to provide an unprecedented practical heat sink for semiconductors in which a large number of semiconductors to be cooled can be simultaneously and quickly attached to the main body.

[Brief description of the drawings]

1 is a cross-sectional view showing a first embodiment of the present invention.

FIG. 2 is an explanatory view showing a mounting state of FIG.

3 is a cross-sectional view showing a second embodiment.

4 is an explanatory view showing a mounting state of FIG.

FIG. 5 is a sectional view showing a modification of the present invention .

6 is an explanatory view showing a mounting state of FIG.

7 is a front view showing a conventional example.

FIG. 8 is a bottom view of FIG. 7;

9 is a front view showing another conventional example.

FIG. 10 is a is a bottom view of FIG.

[Explanation of symbols]

Reference Signs List 1 embedded resin fixture 1A protruding locking portion 1B locked portion 1C sliding locking portion 3 heat sink body 4 fin 5 printed circuit board 5A locking hole 5D contact member 6 cooled semiconductor

Continued on the front page (72) Inventor Masahiro Sonoki 3-20-4 Nishi-Shimbashi, Minato-ku, Tokyo Japan Electric Engineering Co., Ltd. (72) Shunji Kawano 3-20-4 Nishi-Shimbashi, Minato-ku, Tokyo Japan Electric Engineering Co., Ltd. (56) References JP-A-60-116248 (JP, U) JP-A-3-8448 (JP, U) JP-A-3-51889 (JP, U)

Claims (2)

(57) [Scope of request for utility model registration] 1. A heat sink body 3 having a plurality of fins formed so as to be equipped with a semiconductor and protruding outward, and the heat sink body 3 is mounted on a printed circuit board 5.
And a semiconductor heat sink having an engaging means for attaching .
There are a pre Kigakarigo means, formed along the printed circuit board 5 on the opposite surfaces of the printed circuit board 5 of the heatsink body 3
Locking groove and resin embedded type fitted into this locking groove
And the resin-embedded fixing tool is attached to the heat sink body 3.
A slide locking portion 1C that engages with the locking groove,
It is connected to the locking portion 1C and protrudes toward the printed circuit board 5.
Protruding locking portion 1A, and a tip portion of this protruding locking portion 1A
Is provided integrally with the printed circuit board and is provided in advance.
A heat sink for a semiconductor, comprising a locked portion having a J-shaped cross section that engages with the locking hole 5A . 2. A heat sink body 3 having a plurality of fins formed so as to be equipped with a semiconductor and projecting outward, and the heat sink body 3 is mounted on a printed circuit board 5.
And a semiconductor heat sink having an engaging means for attaching .
There are a pre Kigakarigo means, formed along the printed circuit board 5 on the opposite surfaces of the printed circuit board 5 of the heatsink body 3
Locking groove and resin embedded type fitted into this locking groove
And the resin-embedded fixing tool is engaged with the printed circuit board 5.
A slide locking portion 1C that engages with the groove, and the slide locking portion
Connected to the printed circuit board 5
And the tip of the projecting locking portion 1A.
A member provided physically and provided in advance on the printed circuit board 5
Locked portion having a V-shaped cross section which is locked by protruding from the stop hole 5A.
1B and the tip of the projection locking portion 1A.
The end is aligned with the center of the V-shaped bottom inside the locked portion 1B.
And was a body linked to the structure, the respective units of the V-shaped locked portion 1B projecting locking portion 1A
Between the locking holes 5A of the printed circuit board 5
A contact having a spring effect to contact the inner wall of the locking hole 5A
Semiconductor heat sink, wherein the member 5D, equipped with 5D.