JPH087668Y2 - Heat sink support structure - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a support structure for a heat sink for heat dissipation in mounting a printed circuit board.

[0002]

2. Description of the Related Art Semiconductors used in electronic devices need to be operated at a certain temperature or lower in order to achieve their predetermined performance. Therefore, conventionally, the semiconductor is mounted on a heat sink for heat dissipation formed of a material having a large thermal conductivity such as copper or aluminum to cool the semiconductor, but the heat sink serves as a structure of the device and has the maximum cooling effect. Must be put in place to get. With the high-density mounting of devices, many semiconductors are mounted on a printed board, and inevitably a heat sink is also mounted on the printed board.

FIG. 13 shows an example of a support structure for a heat sink. In this conventional example, both ends of a flat plate-shaped heat sink 1 are bent to form a tap 3, and the tap 3 is screwed onto a printed circuit board 5. It was stopped and the heat sink 1 was mounted on the printed circuit board 5. In the figure, 7 is a semiconductor screwed to the heat sink 3, 9 is a heat conductive insulating sheet, and 11 is a pattern.

However, in the conventional support structure in which the tap 3 is screwed to the printed circuit board 5 and the heat sink 1 is mounted as described above, the surface space of the printed circuit board 5 is set on the contact surface with the tap 3, so that the heat sink 1 is The pattern on the surface of the printed circuit board 5 cannot be passed through the fixed part,
High-density mounting and wiring were hindered. In addition, if the number of semiconductors that generate heat increases or the amount of heat generation increases, the flat surface heat sink 1 as described above has a limit in securing a surface area effective for heat dissipation, and a sufficient heat dissipation effect cannot be expected.

Therefore, as shown in FIG. 14, a heat sink 17 having a plurality of fins 13 for securing a surface area on a base portion 15 is widely used, and the heat sink 17 is also mounted on an insulating spacer 19. Wiring at the heat sink fixing portion is enabled by interposing.
In the figure, 21 is an electronic component that is automatically inserted, and 23 is an electronic component that is manually inserted because it cannot be automatically inserted because of its shape or the like.

However, in the supporting structure as described above, when mounting the heat sink 17 on the printed circuit board 5, a third space is provided between the heat sink 17 and the printed circuit board 5.
Since the insulating spacer 19 which is a component of the above must be interposed, the steps of positioning the insulating spacer 19, holding the heat sink 17, and fixing them are required, and the assembling workability is poor. The components are mounted in the order of the electronic component 21 for automatic insertion and the electronic component 23 for manual insertion, but when the printed circuit board 5 is turned over after the electronic component 23 for manual insertion is mounted, it is provisionally mounted. Electronic component 2
Since the heat sinks 1 and 23 drop, the heat sink 17 cannot be screwed after the manual insertion process. Therefore, conventionally, the heat sink 17 is screwed before the manual insertion step. However, when the electronic component 23 of the manual insertion is also mounted under the fins 13 of the heat sink 17 for high density mounting, the fin There is a fear that the electronic component 23 is not sufficiently mounted due to the hindrance of the electronic component 23, which makes it difficult to mount the electronic component 23.

FIGS. 15 and 16 show a conventional example in which the above-described mounting problem is solved. In the conventional example of FIG. 15, a caulking protrusion 27 is formed on a heat sink 25 having a lower center cut out as shown in FIG. Providing and the caulking protrusion 27
After fitting the soldering terminal 29 to the, the tip of the caulking protrusion 27 is crushed and the soldering terminal 29 is attached to the heat sink 25, so that the heat sink 25 can be mounted on the printed circuit board 5 at the same time when the electronic component manually inserted is mounted. It was done like this.

On the other hand, in the conventional example shown in FIG. 16, a solder pin 33 is provided below the heat sink 31, and the solder pin 33 is provided.
The heat sink 31 can be mounted at the same time as the electronic component manually inserted by inserting the heat sink 31 into the printed circuit board 5.

[0009]

However, even in the support structure of the heat sink 25 shown in FIG. 15, the wiring space on the printed circuit board 5 is obstructed at the contact surface between the heat sink 25 and the printed circuit board 5. ing. Further, the mounting by the soldering terminals 29 is unstable, and there is a possibility that the lead legs 7a of the semiconductor 7 may be burdened with vibration and external force.

Even in the conventional example shown in FIG. 16, the wiring space on the printed circuit board 5 is obstructed by the heat sink fixing portion, and the weight of the fins 35 may cause the heat sink 31 to tilt in the arrow direction. There was a problem in the stability of the heat sink 31. The present invention has been devised in view of such an actual situation, and can be mounted on a printed circuit board in the same direction as a manually inserted electronic component and the like, and further, a heat sink supporting structure for improving stability of the mounted heat sink. The purpose is to provide.

[0011]

In order to achieve such an object, the invention according to claim 1 forms a groove on a heat sink mounted on a printed circuit board, and the groove is formed on the printed circuit board.
Press the support terminals to be soldered or screwed in and heat them.
Support for heat sink that supports the tosink on the printed circuit board
The heat sink along the opening edge of the groove.
To form a protruding piece to prevent the support terminal from falling off.
It has a stationary portion of the press-fit portion and the printed circuit board to the groove
Is formed into a substantially L-shaped cross section, and the inner wall of the groove is formed in the press-fitting portion.
A plurality of locking claws that are pressed against the
And it shall be the feature of that.

[0012]

[0013]

SUMMARY OF] According to invention according to claim 1, after completing the electronic component mounting of the electronic components and the hands inserted in the automatic insertion of the printed circuit board, the heat sink supporting pin is press-fitted inserted from the left and right in the groove If the semiconductor is screwed and the heat sink is soldered or screwed to the printed circuit board from the same direction as the electronic component via the support terminal, the heat sink is supported by the printed circuit board via the support terminal. Then press the press-fitting part of the support terminal into the groove of the heat sink.
When inserting and inserting, the locking claws are pressed against the inner wall of the groove and the support terminals
It will be firmly attached to the heat sink.

[0014]

[0015]

Embodiments of the present invention will be described in detail below with reference to the drawings. 1 to 8 show a first embodiment of the invention according to claim 1, and in FIG. 1, 37 is a heat sink made of aluminum, and in order to secure a sufficient heat radiation effect, a plurality of fins are provided as in the conventional case. 39 is integrally provided in the lateral direction of the base portion 41. And, below the fin 39, a groove 45 for press-inserting the support pin 43 to be described later is formed over the lateral direction of the base portion 41, the groove 4
A projecting piece 47 for preventing the support terminal 43 from falling off is formed along the opening edge portion of the opening 5.

2 and 3 show a metal support terminal 43 which is press-fitted and inserted into the groove 45. The support terminal 43 is
Press-fitting portion 49 into groove 45 and fixing portion 51 to printed circuit board 5
Are formed in a substantially L-shaped cross section, and two locking claws 53 are provided on both sides of the press-fitting portion 49 so as to be bent in the pulling-out direction of the press-fitting portion 49 . And press-fitting part 49
The width dimension A is slightly greater than the width B of the groove 45 Rutotomoni, all of the locking claw 53, as shown in FIG. 5
With a width dimension b wider than the plate thickness a of the support terminal 43
It has a structure in which the tip side is bent and protrudes toward the protruding piece 47 side.
The width dimension b corresponds to the depth dimension c of the groove 45.
Then, the relation of b> c is set. Therefore, the press-fitting portion 4
When 9 is press-fitted and inserted into the groove 45, each locking claw 53 bends and the groove
At the same time when the locking claws 53 are pressed against the inner wall 45a of the
It is compressed to the dimension c and pressed against the inner wall 47a of the protruding piece 47.
The support terminals 43 are firmly attached to the heat sink 37 because they are in contact with each other.
It will be fixed. Of course, as described above, the locking claw 5
3 has a structure in which the press-fitting portion 49 is bent in the withdrawal direction,
It is easy to press fit the press-fitting part 49 into the groove 45, and it is not
Since the pawl 53 bites into the inner walls 45a and 47a, the support end
It is difficult for the child 43 to come off the heat sink 37.

Further, as shown in FIG. 4, when the press-fitting portion 49 is press-fitted into the groove 45 and the support terminal 43 is attached to the heat sink 37, the lower edge portion 51a of the fixing portion 51 to the lower edge of the heat sink 37. The size of the fixed portion 51 is set so that the portion 37a is in a slightly floating state. On the other hand, in FIG. 4, reference numeral 55 denotes two soldering fixing pieces projecting from the lower edge portion 51a of the fixing portion 51. Both soldering fixing pieces 55 are formed on the printed circuit board 5 as shown in FIG. When it is inserted into the mounting hole 57, it is formed into an arc shape so as to face each other with the soldering fixing piece 55 'of the fixing portion 51' of the supporting terminal 43 'on the other side press-fitted into the opposite side of the groove 45. Has been done. Thus, by forming the facing soldering fixing pieces 55, 55 'in an arc shape so as to face each other, when they are inserted into the mounting hole 57 as shown in FIG. 6, the inner wall 57a of the mounting hole 57 is formed. And the soldering fixing pieces 55, 55 ', the gap d between the soldering fixing pieces 55, 55' becomes narrower before soldering,
The fitting of 55 'and the mounting hole 57 becomes tight, and the heat sink 43 is stabilized on the printed circuit board 5.

Further, as shown in FIG. 7, the lower edge portion 51a of the fixing portion 51 comes into contact with the surface of the printed circuit board 5 when the soldering fixing piece 55 is inserted into the mounting hole 57. By confirming that there is no gap between the soldering fixing piece 55 and the printed circuit board 5 at the time of insertion, the soldering fixing piece 55 can be soldered without floating. Then, as described above, when the support terminal 43 is attached to the heat sink 37, the heat sink 37 starts from the lower edge portion 51a of the fixed portion 51.
Since the lower edge portion 37a of the fixed portion 51 is brought into contact with the surface of the printed circuit board 5 in this manner, the lower edge portion 37a of the printed circuit board 5 and the heat sink 37 are A slight gap is generated between the edge portion 37a. Further, the base of the soldering fixing piece 55 has a U
A notch 59 having a character shape is formed, and thus the notch 59 is formed.
Is provided at the base of the soldering fixing piece 55, so that the solder rising can be confirmed.

In addition, the fixing portion 51 is provided with two circular holes 61 near the solder fixing piece 55. Thus, by providing the holes 61 in the fixing portion 51 to partially reduce the cross-sectional area of the fixing portion 51 and increase the thermal resistance, when the soldering fixing piece 55 is soldered to the printed circuit board 5. , As shown by the arrow in FIG. 7, the soldering fixing piece 55
The transfer of heat from the support terminal 43 and the heat sink 37 is reduced so that the soldering fixing piece 55 can be soldered well, and the most effective wind flow to the heat sink 37 is achieved.
On the other hand, the air resistance of the support terminal 43 is reduced.

Since the present embodiment is constructed in this way, the components are mounted on the printed circuit board 5 as in the conventional case. First, the electronic components 21 for automatic insertion are mounted first, and after the mounting is completed. The electronic component 23 manually inserted may be mounted. After the electronic components 21 and 23 are mounted, the semiconductor 7 is mounted on the heat sink 37 in which the support terminals 43 and 43 'are press-fitted and inserted into the groove 45 from the left and right sides via the heat conductive insulating sheet 9 as shown in FIG. Screw and then support terminal 4
The soldering fixing piece 55 of the fixing portion 51 of No. 3 may be inserted into the mounting hole 57 of the printed board 5.

When the press-fitting portion 49 is press-fitted and inserted into the groove 45, the locking claws 53 engage the inner wall 45 of the groove 45 as described above.
a and the inner wall 47a of the protruding piece 47 so that the support terminal 43 is firmly attached to the heat sink 37, and there is no gap between the printed circuit board 5 and the lower edge portion 51a of the fixed portion 51. If the soldering fixing pieces 55, 55 'are inserted into the mounting holes 57 as shown in FIG. 6, the heat sink 43 can be stably attached to the printed circuit board 5.

In this state, the solder rise may be confirmed by the cut 59 and soldering may be performed. The fixing portion 51 is provided with a hole 61 to partially reduce the cross-sectional area and increase the thermal resistance. Therefore, heat transfer from the solder fixing pieces 55, 55 'to the support terminals 43, 43' and the heat sink 37 is reduced, and as a result, the solder fixing pieces 55, 5 '.
5 ′ is satisfactorily soldered to the printed board 5, and the lower edge portion 37a of the heat sink 37 is mounted on the printed board 5 with a slight gap from the printed board 5.

As described above, in this embodiment, after the electronic components 21 for automatic insertion and the electronic components 23 for manual insertion are mounted, the heat sink 37 is the same as the electronic components 23, etc. for manual insertion as manual insertion components on the printed circuit board 5. Since it can be mounted from the direction, the heat sink 37 can be mounted easily, and like the support structure shown in FIGS. 15 and 16, the electronic component 23 manually inserted under the fins 39 of the heat sink 37 can be mounted easily and securely. Therefore, the workability is improved.

Further, in this embodiment, the soldering fixing pieces 55, 55 'which are securely inserted into the printed circuit board 5 can be surely soldered by checking the notch 59 for the solder rising. Also, the effect of providing the hole 61 is combined with the reliable soldering, and as a result, the heat sink 37 can be reliably supported on the printed circuit board 5. Further, since the lower edge portion 51a of the fixing portion 51 is in contact with the printed circuit board 5, the heat sink 37 is stably supported on the printed circuit board 5 via the support terminal 43 as compared with the mounting structure shown in FIGS. Will be done.

Further, in this embodiment, since the lower edge portion 37a of the heat sink 37 is mounted on the printed circuit board 5 with a slight clearance from the printed circuit board 5, as shown in FIG. The wiring pattern 63 can be laid out between the portion 37a and the printed circuit board 5, which has an advantage that high-density mounting can be performed. Further, in this embodiment, the press-fitting portion 49 of the support terminal 43 provided with the locking claw 53 as described in FIG.
Width A of the groove 45 is set to be slightly larger than the width B of the groove 45.
And all locking claws 53 have a plate thickness a of the support terminal 43.
With a width dimension b wider than
Since the structure is bent to the side and protruded, the press-fitting portion 49 is formed in the groove 4
5, the locking claws 53 bend and the grooves
At the same time when the locking claws 53 are pressed against the inner wall 45a of the
It is compressed to the dimension c and pressed against the inner wall 47a of the protruding piece 47.
The support terminals 43 are firmly attached to the heat sink 37 because they are in contact with each other.
Fixed. Of course, as described above, the locking claw 53 is the press-fitting portion.
Since it has a structure in which 49 is bent in the pulling-out direction,
It is easy to press-fit the press-fitting part 49, and the locking claw 53 is
Since the support terminal 43 bites into the inner walls 45a and 47a,
It has an advantage that it is hard to come off from the heat sink 37. And the book
According to the embodiment, the press-fitting portion 49 is inserted into the groove 45 as described above.
By press-fitting and inserting, each locking claw 53 is pressed down to c dimension.
Since it is contracted and comes into pressure contact with the inner wall 47a of the protruding piece 47,
As shown in FIG. 5, the soldering fixing piece from the end surface of the heat sink
The dimension e up to 55 is stable, and therefore, there is an advantage that the mounting position of the semiconductor 7 and the dimension of the supporting terminal 43 up to the soldering fixing piece 55 can be determined. Further, since the support terminal 43 is provided with the hole 61, aerodynamic characteristics are also good.

The hole 61 formed in the fixing portion 51 is not limited to the circular shape described above, and as shown in FIG.
The long hole 65 may be provided, or the soldering fixing piece 55.
The lower edge portion 51a of the fixed portion 51 between
If it is continuous, a space space 67 is generated between the printed circuit board 5 and the fixed portion 51, and the pattern 69 can be passed through the surface of the printed circuit board 5.

10 and 11 show a second embodiment of the present invention. In the first embodiment, the present invention is applied to the heat sink 37 in which the fin 39 is provided on the base portion 41, but as shown in FIG. 10, the base portion 73 of the flat heat sink 71 having no fin is used. The groove 45 may be provided. Then, in order to improve the stability, as shown in FIG. 11, if the fixing portion 51 ″ of the one supporting terminal 43 ″ is bent to the side opposite to the fixing portion 51 of the other supporting terminal 43, the heat sink The fixing portions 51, 51 ″ are located on the front and back sides of 71, so that the heat sink 71 can be stably supported.

Also, when a large heat sink must be mounted on a printed circuit board, or when external force or vibration is applied to the heat sink and soldering by the soldering fixing piece 55 may cause insufficient support strength of the heat sink. After soldering the electronic components , as shown in FIG.
Support terminal 77 in which fixing portion 73 is provided with screw fixing piece 75
Screw the heat sink 71 to the printed circuit board 5 using
Eliminates the troublesome positioning of insulating spacers
Therefore, it is effective for realizing reliable holding. still,
Similar to the first embodiment, in the support terminal 77, a locking claw 81 having the same shape as the locking claw 53 is provided in the press-fitting part 79 bent in the L-shape with the fixing part 73. There is. In addition, in the figure, 83 is a screw hole provided in the screw fixing piece 75,
Reference numeral 85 is a screw hole provided in the printed circuit board 5, and 87 is a screw.

Thus, according to this embodiment, as in the first embodiment, the heat sink 71 can be mounted in the same direction as the electronic component 21 for automatic insertion and the electronic component 23 for manual insertion, and the mounting is easy. In addition, the electronic components 23 that are manually inserted can be mounted easily and reliably, and high-density mounting of components can be performed. Further, according to this embodiment, there is an advantage that the heat sink 71 can be supported more firmly to the printed circuit board 5.

[0030]

As mentioned [devised effect described above, according to the invention according to claim 1, after mounting the electronic component and the manual insertion electronic components of the automatic insertion into the printed circuit board, supporting the heat sink from the same direction as these parts Since it can be mounted via the terminal, mounting of the heat sink is easier and the heat sink is more stably supported on the printed circuit board via the support terminal than before.
In addition, the mounting position of the semiconductor and the size of the support terminal can be determined.
Have the advantage that

Even if the heat sink has fins, the manual insertion of electronic components to be mounted under the fins is easy and reliable, and a stable mounting state of the components can be secured.

[Brief description of drawings]

FIG. 1 is an overall perspective view of a heat sink according to a first embodiment of the present invention.

FIG. 2 is a side view of a support terminal on a press-fitting portion side.

FIG. 3 is a side view of a support terminal on a fixed portion side.

FIG. 4 is a partially cutaway perspective view of the heat sink in a state where the support terminal is press-fitted and inserted into the groove of the heat sink.

FIG. 5 is a cross-sectional view of the heat sink in a state where the support terminal is press-fitted and inserted into the groove of the heat sink.

FIG. 6 is a partial cross-sectional view showing a state in which a soldering fixing piece is inserted into a mounting hole of a printed board.

FIG. 7 is a side view of a fixed portion of a support terminal.

FIG. 8 is an overall perspective view of a heat sink support structure according to a first embodiment of the present invention.

FIG. 9 is a side view of a modified example of the fixing portion of the support terminal.

FIG. 10 is a side view of a heat sink according to a second embodiment of the present invention.

FIG. 11 is an overall perspective view of a support structure for a heat sink according to a second embodiment of the present invention.

FIG. 12 is an overall perspective view of a support structure of a heat sink according to a third embodiment of the present invention.

FIG. 13 is a side view of a conventional heat sink support structure.

FIG. 14 is a side view of a conventional heat sink support structure.

FIG. 15 is a side view of a conventional heat sink support structure.

FIG. 16 is a side view of a conventional heat sink support structure.

FIG. 17 is a partial perspective view of a conventional heat sink.

[Explanation of symbols]

 5 Printed Circuit Board 37,71 Heat Sink 39 Fins 43,53 Support Terminal 45 Groove 49,79 Press-fitting Part 51,73 Fixing Part 53,81 Locking Claw 55 Soldering Fixing Piece 59 Notch 61,65 Hole 75 Screwing Fixing Piece

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Hiroyasu Yamaguchi 237 Sakado, Takatsu-ku, Kawasaki-shi, Kanagawa Fuji Denso Co., Ltd. (72) Creator Tadayo Kamada 2-26, Horinouchi, Suginami-ku, Tokyo Hokusa Co., Ltd. (56) References Japanese Patent Laid-Open No. 61-65751 (JP, A) Actual Open 60-106346 (JP, U) Actual Open 2-104695 (JP, U) Actual Open 2-44344 (JP, U)

Claims (1)

[Scope of utility model registration request] 1. A groove is formed in a heat sink mounted on a printed circuit board, and the groove is soldered to the printed circuit board.
Press the support terminals that are
It is the support structure of the heat sink that supports the printed circuit board.
The heat sink along the edge of the opening of the groove.
A protruding piece for preventing drop is formed, and the support terminal is pressed into the groove.
Sectional L-shape consisting of an insertion part and a fixed part to the printed circuit board
A plurality of parts that are formed into a press-fitted portion and press-contact with the inner wall of the groove.
The support structure of the heat sink, wherein the locking claw of is bent and provided in the pull-out direction .