JP2570629Y2 - Heat sink - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION The present invention is to easily disassemble and disassemble a radiator plate soldered and fixed to an electronic substrate using a radiating mounting leg from an electronic substrate using a general tool when disposing of electronic equipment. The present invention also relates to a radiator plate that enables the reuse of resources of a separated radiator plate.

[0002]

2. Description of the Related Art In recent years, in an electronic device composed of an electronic substrate on which electronic components are mounted at high density and high density, it is necessary to prevent malfunction or destruction of the semiconductor device due to heat, and to exhibit sufficient performance of the semiconductor device. However, the heat radiation of the semiconductor element that generates heat cannot be ignored, and a general heat radiating plate is a heat radiating plate made of extruded aluminum (hereinafter referred to as aluminum) having good heat conductivity and good workability. Often used.

[0003] In recent years, global environmental problems
Due to the problem of resource reuse, emphasis has been placed on the classification and decomposability of components and the reuse of materials when disposing of electronic devices composed of composite components. In particular, aluminum parts consume a great deal of electric power for smelting aluminum, so recycling thereof is particularly required.

Conventionally, as shown in FIG. 3, a semiconductor element 10 requiring heat radiation is fixed to a heat radiation plate 30 with screws 40 via an insulating sheet 20 such as mica, and is directly soldered to an electronic substrate 80. The heat-dissipating plate 30 made of aluminum or the like that cannot be fixed is provided at one or more places by fitting and caulking a flat plate-shaped heat-dissipating plate mounting leg 50 made of a solderable metal. It has been usual to fix the electronic substrate 70 by soldering it to the substrate 80.

[0005]

[Problems to be Solved by the Invention] However, in consideration of the separation and disassembly of parts when disposing of electronic boards of electronic devices composed of composite materials, the heat radiation attached by conventional fitting and caulking is considered. When disposing of electronic equipment, the heat sink fixed by the board mounting legs can be removed by removing the screws that lock the semiconductor element to the heat sink using a general tool for the semiconductor element fixed to the heat sink. However, there is a problem that it is difficult to easily separate and disassemble the heat sink from the electronic board using a general tool, and the heat sink that cannot be removed has to be disposed of together with other electronic components together with the electronic board. There is also a problem that the material of the heat sink cannot be reused.

In view of the above problem, the present invention makes it easy to insert a general tool into a surface where the heat sink mounting leg and the heat sink are in contact with the heat sink that is soldered to the electronic board by the heat sink mounting leg that is crimped. A concave shape is provided, and the above-mentioned general tool is inserted into a gap formed by combining the concave shape with the heatsink mounting leg, and the tool is twisted to fit and caulk the heatsink with the heatsink mounting leg. The heat sink can be easily separated from the electronic board by disengaging the heat sink and separating the heat sink and the heat sink mounting legs.
It is another object of the present invention to provide a heat radiating plate for reusing the material of the heat radiating plate that can be separated.

[0007]

According to the present invention, there is provided a heat radiating plate which is soldered and fixed to an electronic board by a heat radiating plate mounting leg which is fitted and caulked, and a general tool is provided on a surface where the heat radiating plate mounting leg is in contact. A general tool is inserted into the gap formed by combining this concave shape and the heat sink mounting leg, and the heat sink is fitted with the heat sink mounting leg by twisting the tool. -The separation by heat sink from the electronic board and the decomposability have been improved by removing the connection by caulking.

[0008]

According to the heat sink of the present invention, the heat sink is provided with a concave shape for easy insertion of a general tool on a surface where the heat sink mounting leg is in contact with the heat sink, and this concave shape is combined with the heat sink mounting leg. It becomes possible to insert a general tool into the formed gap, and by twisting the tool inserted into this gap, the connection between the heat sink and the heat sink mounting legs is disengaged and caulked, and the heat sink is removed from the electronic board. Separation can be easily performed, and the material of the radiator plate that has been separated can be reused.

[0009]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a heat sink according to the present invention. FIG. 1 is an embodiment of the present invention, and schematically shows the configuration thereof. FIG. 2 shows a process of removing the heat sink from the electronic board in the present invention.

In FIG. 1, a semiconductor element 1 has an extruded heat sink 3 made of aluminum via an insulating sheet 2.
Is fixed with a small screw 4. The heat sink 3 is fitted with heat sink mounting legs 5 provided at two places in the front and rear of the drawing in U-shaped grooves 3a provided on both sides and is caulked and joined, and comes into contact with the heat sink mounting legs 5. A part of the gap formed by the combination with the radiator plate mounting leg 5 on the surface has a general tool 6 such as a flathead screwdriver.
A flat groove shape 3c that forms a gap 7 in which is easily inserted is provided near the caulking connection portion 3b. The heat sink 3 is fixed by soldering the heat sink mounting legs 5 to the electronic board 8.

The radiator plate 3 of the present invention, which is soldered and fixed to the electronic substrate at the fitting and caulked radiator plate mounting legs formed on the electronic substrate 8 as described above, is used.
The present invention will be described below with reference to FIG.

When the heat sink 3 constructed as shown in FIG. 1 is separated and disassembled from the electronic board 8, first, a small diameter screw 4 for fixing the semiconductor element 1 is removed by using a driver 9 to remove the semiconductor element 1 and the heat sink 3. And separated. Next, the tip of the tool 6 described above is inserted into a gap 7 formed by the flat groove 3c provided on the heat sink 3 and the heat sink mounting leg 5 with a flathead screwdriver 6, and the tool 6 is pryed to release heat. The connection between the plate 3 and the radiating plate mounting leg 5 by fitting and crimping can be released.

By repeating this for another portion 7, the radiator plate 3 and the radiator plate mounting leg 5 can be separated. By performing the same operation on the heat sink 3 on the opposite side of the heat sink 3 from the drawing, the heat sink 3 can be easily separated from the electronic board 7.

Although an example of fitting and caulking has been described as a means for connecting the heat radiating plate and the heat radiating plate mounting leg, any mechanical connecting means such as pressure welding and riveting may be used in addition to caulking. Needless to say.

[0015]

As described above, according to the present invention, a general tool is provided on the surface where the heat sink mounting leg is in contact with the heat sink attached to the electronic board by the heat sink mounting leg which is fitted and caulked. Provide a concave shape that is easy to insert, insert a general tool into the gap formed by combining this concave shape with the heat sink mounting leg, and pry this tool to fit the heat sink with the heat sink mounting leg. The heat sink can be easily separated from the electronic board by removing the connection by caulking and separating the heat sink from the heat sink mounting leg. In addition, it is possible to reuse the separated material of the heat sink.

[Brief description of the drawings]

FIG. 1 is a view of a heat sink attached to an electronic board according to an embodiment of the present invention;

FIG. 2 is a diagram illustrating separation of a heat sink from an electronic board according to an embodiment of the present invention;

FIG. 3 is a view of a heat sink fixed to an electronic board using conventional heat sink mounting legs.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor element 3 Heat sink 3a Groove part 3b Caulking connection part 3c Groove shape 5 Heat sink attaching leg 6 Flathead screwdriver 8 Electronic board 9 Plus screwdriver

Claims (1)

(57) [Scope of request for utility model registration] 1. A radiator mounting leg soldered and fixed to an electronic board, and a radiator provided with an electronic component to be radiated and provided with a groove are integrally connected to each other. A heat radiating plate, wherein a gap is provided on a surface of the heat radiating plate mounting leg, the surface being in contact with the heat radiating plate mounting leg.