JP2005142410A - Heatsink mounting structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable simple execution of separation between a heatsink and an electronic board to thereby recycle the heatsink and a mounting leg. <P>SOLUTION: Heatsink mounting legs 4 fitted and caulked to a heatsink 1 is fixed by soldering to an electronic board 2 using jumpers 6. And the heatsink mounting leg 4 is provided with a projection 4a, and a gap 7 is previously formed between the projection 4a and the jumper 6. By inserting a tool such as a nipper into the gap 7 and cutting the jumper 6, the heatsink 1 can be easily separated from an electronic board 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a heat sink mounting structure, and more particularly to a heat sink mounting structure for attaching a heat sink to an electronic board, and more particularly to a heat sink mounting structure capable of efficient recycling.

  In an electronic device using an electronic substrate on which electronic components of a semiconductor element are mounted at a high density, if the heat generated from the semiconductor element is not sufficiently dissipated, it may cause malfunction or destruction of the semiconductor element, thereby reducing the performance of the semiconductor element. It will not be able to fully demonstrate. In order to dissipate the heat generated by such a semiconductor element, a heat radiating plate extruded with aluminum (hereinafter referred to as aluminum) having good thermal conductivity and good workability is generally used.

  FIG. 6 is a perspective view showing the structure of a conventional heat sink described in Patent Document 1, in which 20 is a heat sink, 21 is a semiconductor element, 22 is an insulating sheet, 23 is a screw, and 24 is a heat sink attached. A leg 25 is an electronic substrate. As shown in FIG. 6, the semiconductor element 21 that requires heat dissipation is fixed to the heat dissipation plate 20 with screws 23 via an insulating sheet 22 such as mica. Further, since the heat sink 20 made of aluminum cannot be directly soldered and fixed to the electronic board 25, a metal flat heat sink mounting leg 24 that can be soldered is fitted to the heat sink 20 by fitting and caulking. The heat radiating plate 20 is fixed to the electronic substrate 25 by providing the heat radiating plate mounting legs 24 to the electronic substrate 25 at one or a plurality of locations.

FIG. 7 is a diagram for explaining the configuration of the mounting leg portion of the heat radiating plate described in Patent Document 2. FIG. In the configuration of Patent Document 2, the heat radiating plate 30 is attached to the substrate by the attachment legs 32. The mounting legs 32 are provided on a plate-like body 32a to be inserted into the groove 31 of the heat radiating plate 30, projections 32b provided on both sides of the plate-like body 32a, and both sides of the projection 32b. A claw portion 32c and a substrate attachment portion 32d for soldering to the substrate are provided. And the plate-shaped body 32a is inserted in the groove part 31 of the heat sink 30, and the heat sink 30 and the attachment leg part 32 are fixed by the nail | claw part 32c. Then, the board mounting portion 32d is inserted into the hole provided in the board, and the board mounting portion 32d and the board are soldered.
Japanese Utility Model Publication No. 5-95051 JP 2000-236053 A

However, when considering disposal of an electronic device made of a composite material, the following problem arises in the conventional heat sink mounting structure in terms of the separation and disassembly of the components of the electronic board constituting the electronic device.
That is, when the electronic device is disposed of, for the semiconductor element fixed to the heat sink, the screws for fixing the semiconductor element to the heat sink may be removed using a general tool. However, the heat sink and the electronic substrate have a problem that it is difficult to easily separate them using a general tool.
For example, as in Patent Document 1, in the configuration in which the heat sink mounting legs attached to the heat sink by fitting and caulking are soldered to the electronic board, the heat sink can be easily removed from the electronic board. Can not. At this time, the heat sink that cannot be removed from the electronic board has to be disposed of together with the other electronic components together with the electronic board, and the material of the heat sink cannot be reused.

In addition, in the configuration in which the mounting legs are soldered and fixed to the electronic board as in Patent Document 2, when the heat sink is removed from the electronic board, the mounting legs and the electronic board remain fixed and the entire electronic board is disposed of. Therefore, there is a problem that the material of the heat sink mounting leg cannot be reused.
In addition, since the mounting leg portion is made of a solderable iron material, there is a problem that the mass cannot be lowered compared to an aluminum material.

  The present invention has been made in view of the above circumstances, and can easily separate the heat sink and the electronic board using a general tool, thereby reusing the heat sink and the mounting legs. An object of the present invention is to provide a heat sink mounting structure that can be used.

  A first technical means is a heat sink mounting structure that includes a heat sink and an attachment member coupled to the heat sink, and attaches the heat sink to the substrate by fixing the attachment member to the substrate. Is characterized in that a convex portion is provided to form a gap into which a tool can be inserted in order to separate the substrate and the mounting member.

  A second technical means includes a fixing member for fixing the attachment member to the substrate in the first technical means, and the attachment member has a fixing member insertion hole into which the fixing member is inserted. Is.

  According to a third technical means, in the second technical means, when the fixing member is inserted into the fixing member insertion hole, the convex portion of the mounting member comes into contact with the fixing member, so that the mounting member is near the convex portion. And a fixing member, a gap into which a tool can be inserted is formed.

  The fourth technical means is characterized in that, in the second or third technical means, the fixing member is a jumper, and the jumper can be cut by inserting a tool into the gap. .

  According to a fifth technical means, in any one of the first to fourth technical means, the heat radiating plate and the mounting member are formed of the same material.

  A sixth technical means includes a heat radiating plate according to any one of the first to fifth technical means, wherein the heat radiating plate has a groove portion into which the attachment member is fitted, and the fitting member is fitted into the groove portion. The mounting member is connected to the mounting member.

According to the present invention, the heat radiating plate can be easily separated from the heat radiating plate from the electronic board by using a general tool, and the heat radiating plate and the mounting leg can be reused thereby. Mounting structure can be provided.
In particular, using a mounting member fitted and crimped to the heat sink, adopting a mounting structure that solders and fixes the mounting member to the board using a fixing member by a jumper, and provides a convex portion on the mounting member, By forming a gap between the convex portion and the jumper, a heat sink can be easily separated from the electronic substrate by inserting a general tool such as a nipper into the gap and cutting the jumper. be able to.

Embodiments of a heat sink mounting structure according to the present invention will be specifically described below with reference to the accompanying drawings. In all the drawings for explaining the embodiments, the same reference numerals are given to the same elements, and the repeated explanation thereof is omitted.
FIG. 1 is a schematic perspective view showing a state in which a heat sink is attached to an electronic board, FIG. 2 is a schematic perspective view of the heat sink removed from the electronic board, and FIG. 3 is an electronic board with the heat sink removed. FIG. In the figure, 1 is a heat sink, 1a is a groove, 2 is an electronic board, 2a is a leg insertion hole, 2b is a jumper insertion hole, 3 is a semiconductor element, 4 is a heat sink mounting leg, 4a is a convex part, and 4b is a jumper. An insertion hole, 4c is a leg, 5 is a screw, 6 is a jumper, and 7 is a gap.

  The semiconductor element 3 is fixed to the extruded heat sink 1 made of aluminum using small-diameter screws 5. In addition, U-shaped grooves 1a are provided on both sides of the heat sink 1, and heat sink mounting legs 4 as heat sink mounting members are fitted into the grooves 1a, respectively. The groove part 1a and the heat sink mounting leg 4 are coupled by crimping. The portion where the heat radiating plate mounting leg 4 is fitted into the groove 1a is formed in a plate shape.

The electronic board 2 is provided with a leg insertion hole 2a for inserting the leg part 4c of the heat sink mounting leg part 4, and the heat sink for the electronic board 2 by inserting the leg part 4c into the leg insertion hole 2a. 1 positioning is performed. Furthermore, the electronic board 2 and the heat sink mounting leg 4 are provided with jumper insertion holes 2b and 4b, respectively. With the heat sink mounting leg 4 attached to the electronic board 2, the jumper 6 is inserted into each jumper insertion hole 2b and 4b. The heat sink mounting leg 4 is fixed to the electronic board 2 by inserting and soldering the jumper 6 to the land on the back side of the electronic board 2.
The jumper 6 functions as a fixing member for fixing the heat sink mounting leg 4 as an attachment member to the electronic board 2, and the jumper insertion holes 2a and 4b function as fixing member insertion holes for inserting the fixing member. .

  FIG. 4 is a schematic cross-sectional view of an essential part of a mounting portion of the heat radiating plate mounting leg 4 to the electronic substrate 2. The heat sink mounting leg 4 is provided with a cylindrical convex portion 4a that protrudes toward the opposite side of the electronic substrate 2 at a substantially central portion of the pair of jumper insertion holes 4b. When the jumper 6 is inserted into the jumper insertion hole 4b, a gap 7 is formed between the jumper 6 and the heat sink mounting leg 4 by the convex portion 4a. The jumper 6 inserted into the jumper insertion holes 2 b and 4 b is fixed by the solder 8 on the back side of the electronic substrate 2. A general tool such as a nipper can be inserted into the gap 7, and the jumper 6 is cut by the nipper to facilitate separation of the heat sink mounting leg 4 and the electronic substrate 2.

FIG. 5 is a diagram for explaining an operation when separating and disassembling the structure assembled as shown in FIG. When separating and disassembling the structure in which the heat sink 1 is fixed on the electronic substrate 2 by soldering the jumper 6, first, the screw 5 having a small diameter for fixing the semiconductor element 3 is removed using a screwdriver 12, The heat sink 1 is separated.
Next, the tip of the nipper 11 is inserted into the gap 7 formed by the convex portion 4 a of the heat sink mounting leg 4, and the jumper 6 is cut by the nipper 11. Then, by cutting the two jumpers 6 disposed on both sides of the heat radiating plate 1, the heat radiating plate 1 can be separated from the electronic substrate 2 together with the heat radiating plate mounting legs 4.

  In the above-described example, the example of fitting and caulking is described as a means for coupling the heat sink 1 and the heat sink mounting leg 4. However, in addition to caulking, any other method such as pressure welding, rivet fastening, and screws can be used. Needless to say, mechanical coupling means may be used.

  Further, by configuring the heat sink 1 and the heat sink mounting legs 4 with the same material, for example, aluminum, the weight of the entire heat sink mounting structure can be reduced.

It is a perspective schematic diagram showing the state where a heat sink is attached to an electronic substrate by the present invention. It is a perspective schematic diagram of a heat sink removed from an electronic substrate. It is a perspective schematic diagram of an electronic substrate which removed a heat sink. It is a principal part cross-sectional schematic of the attachment part to the electronic substrate of a heat sink mounting leg. It is a figure for demonstrating the operation | work when isolate | separating and disassembling the structure assembled especially like FIG. It is a perspective view which shows the structure of the conventional heat sink described in Japanese Utility Model Laid-Open No. 5-95051. It is a figure for demonstrating the structure of the attachment leg part of the conventional heat sink described in Unexamined-Japanese-Patent No. 2000-236053.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Heat sink, 1a ... Groove part, 2 ... Electronic board, 2a ... Leg part insertion hole, 2b ... Jumper insertion hole, 3 ... Semiconductor element, 4 ... Radiation plate mounting leg, 4a ... Convex part, 4b ... Jumper insertion hole, 4c ... Leg, 5 ... Screw, 6 ... Jumper, 7 ... Gap, 8 ... Solder, 11 ... Nipper, 12 ... Driver, 20 ... Heat sink, 21 ... Semiconductor element, 22 ... Insulating sheet, 23 ... Screw, 24 ... Radiation plate mounting legs, 25 ... electronic substrate, 30 ... radiation plate, 31 ... groove, 32 ... mounting leg portion, 32a ... plate-like body, 32b ... projection, 32c ... claw portion, 32d ... substrate mounting portion.

Claims (6)

  The heat sink has a heat sink and a mounting member coupled to the heat sink, and the heat sink is attached to the board by fixing the mounting member to the board. In order to separate the mounting member from the mounting member, a heat sink mounting structure is provided, wherein a convex portion is provided to form a gap into which a tool can be inserted.   The heat sink mounting structure according to claim 1, further comprising a fixing member for fixing the mounting member to the substrate, wherein the mounting member has a fixing member insertion hole into which the fixing member is inserted. .   In a state where the fixing member is inserted into the fixing member insertion hole, the convex portion of the mounting member abuts on the fixing member, so that the fixing member is interposed between the mounting member and the fixing member in the vicinity of the convex portion. The heat sink mounting structure according to claim 2, wherein a gap into which a tool can be inserted is formed.   The heat sink mounting structure according to claim 2 or 3, wherein the fixing member is a jumper, and the jumper can be cut by inserting a tool into the gap.   The heat sink mounting structure according to any one of claims 1 to 4, wherein the heat sink and the mounting member are formed of the same material.   The heat radiating plate has a groove portion into which the mounting member is fitted, and the heat radiating plate and the mounting member are coupled by fitting the mounting member into the groove portion. The heat sink attachment structure of any one of thru | or 5.

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