JP2000216311A - Heat sink and its mounting leg part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat sink and its mounting leg part, wherein a leg part for mounting a heat sink main body to a board is easily dismounted from the hear sink main body for efficient recycling. SOLUTION: This heat sink mounting leg part is used to mount a heat sink main body 1 to a printed board. The heat sink mounting leg part 7 comprises a plate-like body 13 for mounting to the heat sink main body 1, a caulking/ fixing part 9, being provided to the plate-like body 13, for caulking/fixing to the hear sink main body 1, and a dismounting hole 15, which with one side of the plate-like body 13 bent, is provided at the bent part. Here, a board mounting part 11 for soldering to the printed board is provided on the other side of the plate-like body 13. Thus, efficient recycling is allowed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink mounting leg for mounting a heat sink body to a substrate and a heat sink. In particular, it relates to a heat sink that can be efficiently recycled and its mounting leg.

[0002]

2. Description of the Related Art FIG. 2 is a perspective view showing a conventional heat sink. FIG. 3 is an enlarged perspective view of a portion A (attachment leg) shown in FIG.

A heat sink body (heat radiating plate) 1 shown in FIG.
Is manufactured by processing an aluminum plate. A heat-dissipating element 3 such as a transistor is fixed to one side of the heat sink body 1 with a screw 5. At the end of the heat sink body 1, the main body 1 is attached to a printed circuit board.
(Not shown) is attached.

[0004] As shown in FIG.
a and the substrate mounting portion 11. Plate 7a
Are provided with two holes, into which the dowel convex portions 9 of the heat sink are inserted, and by fixing the convex portions 9 by caulking, the leg portions 7 are attached to the heat sink body 1. The board mounting portion 11 is provided below the plate-like body 7a, and the heat sink body 1 is mounted on the printed board by soldering the board mounting portion 11 to a printed board.

[0005]

As described above, heat sinks are often made of aluminum having good heat conductivity and high heat radiation effect. On the other hand, the legs 7 attached to the heat sink body 1 as soldering portions for mounting on a printed circuit board are often made of a metal other than aluminum, such as iron or silver top material. For this reason, in order to take out and recycle only aluminum from the heat sink, it is necessary to separate the heat sink body 1 and the leg 7.

However, in the above-mentioned conventional heat sink,
The leg 7 is firmly fixed to the heat sink body 1 by caulking the dowel projection 9.
The flat portion of the plate-shaped body 7a is in tight contact with the flat portion. For this reason, it is not easy to separate the heat sink body 1 and the leg 7 for recycling after the board mounting portion 11 is soldered and the heat sink is mounted on the printed circuit board. As a result, it is difficult to extract only aluminum from the heat sink and efficiently recycle it.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to enable a leg portion for attaching a heat sink body to a substrate to be easily removed from the heat sink body, thereby achieving efficient recycling. To provide a heat sink and a mounting leg thereof.

[0008]

According to the present invention, there is provided a heat sink mounting leg for mounting a heat sink body on a substrate, wherein the mounting leg of the heat sink is mounted on the heat sink body. A plate-shaped body, a caulking fixing means provided on the plate-shaped body, and a caulking fixing means for caulking the heat sink body, and one side of the plate-shaped body being bent, And a hole. Further, it is preferable to further include a board attachment portion provided on the other side of the plate-like body for soldering to the board.

In the mounting leg of the heat sink, one side of the plate is bent, and a hole for removal is provided in that portion. For this reason, when recycling, the worker inserts a bar-shaped tool into this hole and pry outwards,
The crimped portion can be easily removed. As a result, the mounting leg can be easily separated from the heat sink body. Therefore, efficient recycling becomes possible.

The heat sink according to the present invention comprises a heat sink body, a plate-like body attached to the heat sink body by caulking fixing means, and one side of the plate-like body being bent, and a detachment provided at the bent portion. And a hole. Further, it is preferable that the semiconductor device further includes a board attaching portion provided on the other side of the plate-like body and soldered to the board to attach the heat sink body to the board.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a state in which an attachment leg is attached to a heat sink body according to an embodiment of the present invention. Also in the present embodiment,
The entire heat sink has the same configuration as that shown in FIG. 2, and FIG. 1 is an enlarged perspective view of portion A in FIG.

The heat sink body (radiator plate) 1 is manufactured by processing an aluminum plate. A heat-dissipating element 3 such as a transistor as shown in FIG. A leg 7 for attaching the main body 1 to a printed circuit board (not shown) is attached to an end of the heat sink main body 1. The legs 7 are formed of a metal other than aluminum, such as iron or silver top material.

The leg 7 is composed of a plate 13 and a board mounting portion 11. The plate-like body 13 is provided with two caulking fixing holes, into which the dowel convex portions 9 of the heat sink are inserted, and by fixing the convex portions 9 by caulking, the legs are attached to the heat sink body 1. The part 7 is attached.

Further, a hole 15 for removal is provided in the upper part of the plate-shaped body 13, and the plate-shaped body 1 near the hole 15 is provided.
3 is bent. As a result, a hole 15 for removal is exposed from the surface of the plate-shaped body 13 in contact with the heat sink body 1, and as a result, a rod-shaped tool such as a screwdriver can be inserted into the hole 15 and the bent portion.

The board mounting section 11 is provided below the plate 13 and the heat sink body 1 is mounted on the printed board by soldering the board mounting section 11 to a printed board.

According to the above embodiment, the hole 15 for removal is provided in the upper part of the plate 13 of the leg 7 and the upper part of the plate 13 is bent. Therefore, when only aluminum is taken out from the heat sink and recycled, the worker inserts a bar-shaped tool such as a screwdriver into the hole 15 and pry outwards to easily remove the crimp-fixed portion 9. it can. As a result, the leg 7 can be easily separated from the heat sink body 1. In addition, the heat radiated element 3 can be removed from the heat sink body 1 by removing the screw 5. Therefore, conventionally, it was difficult to recycle the heat sink because the legs were not easily separated. However, in the present embodiment, since the legs 7 can be easily removed from the heat sink body 1, efficient recycling can be achieved. It becomes possible.

Further, as described above, since it can be removed in a short time with a simple tool such as a screwdriver, the processing cost at the time of recycling can be reduced.

If the heat sink according to the present embodiment is used, 150 to 200 g of aluminum can be collected from one television. Therefore, the heat sink and its mounting leg according to the present embodiment are very useful.

The present invention is not limited to the above embodiment, but can be implemented with various modifications.

[0020]

As described above, according to the present invention, one side of the plate-like body is bent, and a hole for removal is provided in that portion. Therefore, a leg for attaching the heat sink body to the substrate can be easily removed from the heat sink body, and a heat sink and an attachment leg thereof that can be efficiently recycled can be provided.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a state in which an attachment leg is attached to a heat sink body according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a conventional heat sink.

3 is an enlarged perspective view of a portion A (attachment leg) shown in FIG. 2;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Heat sink body (radiator plate) 3 ... Heat radiated element
... screws, 7 ... legs, 7a ... plate, 9 ... projections, 11 ... board mounting part, 13 ... plate, 15 ... holes for removal.

Claims (4)

[Claims] 1. A mounting part for a heat sink for mounting a heat sink body to a substrate, comprising: a plate-shaped body for mounting the heat sink body; and a caulking fixed to the heat sink body provided on the plate-shaped body. A mounting leg portion for a heat sink, comprising: a caulking fixing means for performing the fixing; and a removal hole provided at a bent portion of one side of the plate-shaped body. 2. The heat sink mounting leg according to claim 1, further comprising a substrate mounting portion provided on the other side of said plate-like body for soldering to said substrate. 3. A heat sink body, a plate-like body attached to the heat sink body by caulking fixing means, and one side of the plate-like body is bent, and a removal hole provided in the bent portion. A heat sink. 4. The heat sink according to claim 3, further comprising a board mounting portion provided on the other side of the plate-like body, and soldering the heat sink body to the board to mount the heat sink body on the board.