KR20010091330A - CPU releasing heat structure of portable computer - Google Patents
CPU releasing heat structure of portable computer Download PDFInfo
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- KR20010091330A KR20010091330A KR1020000012868A KR20000012868A KR20010091330A KR 20010091330 A KR20010091330 A KR 20010091330A KR 1020000012868 A KR1020000012868 A KR 1020000012868A KR 20000012868 A KR20000012868 A KR 20000012868A KR 20010091330 A KR20010091330 A KR 20010091330A
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- cpu
- heat dissipation
- mounting board
- fan
- hinge
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J32/00—Ink-ribbon cartridges
- B41J32/02—Ink-ribbon cartridges for endless ribbons
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J15/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, specially adapted for supporting or handling copy material in continuous form, e.g. webs
- B41J15/04—Supporting, feeding, or guiding devices; Mountings for web rolls or spindles
- B41J15/044—Cassettes or cartridges containing continuous copy material, tape, for setting into printing devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/325—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads by selective transfer of ink from ink carrier, e.g. from ink ribbon or sheet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J33/00—Apparatus or arrangements for feeding ink ribbons or like character-size impression-transfer material
- B41J33/14—Ribbon-feed devices or mechanisms
Abstract
Description
본 발명은 CPU 방열구조에 관한 것으로, 보다 상세하게는 휴대용 컴퓨터의 내측에 구비되어 프로세서유닛으로부터 발생되는 열을 공기의 흐름에 따라 용이하게 배출시킬 수 있도록 환풍팬의 착탈 및 각도변환이 가능하도록 한 CPU 방열구조에 관한 것이다.The present invention relates to a heat dissipation structure of the CPU, and more particularly, is provided inside the portable computer so that the fan can be detached and the angle can be changed so that the heat generated from the processor unit can be easily discharged according to the flow of air. CPU heat dissipation structure.
주지된 바와 같이, 일반적으로 전기제품에는 여러 종류의 전자부품 소자들이인쇄회로기판에 설치되는데, 이중 특히, 트랜지스터(이하, TR이라 함) 혹은 집적회로, CPU 와 같은 소자는 기능을 수행할 때 많은 열이 발생된다.As is well known, in electronics, various kinds of electronic component elements are generally installed on a printed circuit board, in particular, transistors (hereinafter referred to as TRs), integrated circuits, and CPUs have many functions when performing functions. Heat is generated.
상기 기구에서 발생된 열은 소자의 회로적인 기능을 저하시키거나 소자를 파손시키는 원인이 되므로 그 열을 신속하게 방열시키는 방열장치가 설치되게 된다. 이와 같이 종래의 방열장치의 일 예로서는 알루미늄과 같이 열전도가 우수한 금속의 표면에 방열핀을 형성하여 이를 일정크기로 절단한 열전도방식 방열판과 소자로부터 발생된 열을 전자기구의 외부로 방출시키는 송풍식 방열팬 등이 있다.Since the heat generated by the mechanism causes a decrease in the circuit function of the device or damages the device, a heat dissipation device for quickly dissipating the heat is installed. As an example of the conventional heat dissipation device, a heat dissipation fin that forms heat dissipation fins on a surface of a metal having excellent thermal conductivity, such as aluminum, and cuts it to a certain size, and a blowing heat dissipation fan that dissipates heat generated from the device to the outside of the electronic device. Etc.
전자의 열전도방식 방열판은 대한민국 실용신안등록출원 제 91-001521호에 상세히 개시되기도 하였으며 후자의 송풍식 방열팬은 컴퓨터의 중앙처리장지(CPU)와 같이 고가의 집적회로를 방열 시킬 때 주로 사용한다.The former heat conduction type heat sink was described in detail in Korean Utility Model Application No. 91-001521. The latter blown heat dissipation fan is mainly used for heat dissipating expensive integrated circuits, such as a central processing unit (CPU) of computers.
이하, 중앙처리장치용 송풍팬에 대하여 간략하게 기술한다.Hereinafter, a blower fan for the central processing unit will be briefly described.
도 1과 도 2는 종래의 CPU방열구조를 나타낸 사시도이다.1 and 2 are perspective views showing a conventional CPU heat dissipation structure.
먼저, 전자기기의 내부와 외부의 중간에 상기 송풍팬(2)이 설치되며, 중앙처리장치(6)가 설치된 장착보드(4)에 상기 송풍팬(2)이 설치된다.First, the blowing fan 2 is installed between the inside and the outside of the electronic device, and the blowing fan 2 is installed on the mounting board 4 on which the central processing unit 6 is installed.
보다 상세하게, 상기 송풍팬(2)은 T자형이나 상부부착방식으로 상기 중앙처리장치(6)로부터 발생된 열을 전자기기의 외부로 방출시키게 되는 바, 상부부착방식은 상기 장착보드(4)의 가장자리에 별도의 부착편(8)을 위치시키고 상기 장착보드(4)와 송풍팬(2)을 납땜하여 고정시키거나 일체형으로 구성하며, T자형 장착방식은 상기 장착보드(4)와 송풍팬(10)을 수직으로 위치시키고 수직으로 절곡된 부착편(12)을 덧대어 납땜고정하게 된 것이다.More specifically, the blowing fan 2 is to release the heat generated from the central processing unit 6 to the outside of the electronic device in the T-shaped or upper attachment method, the upper attachment method is the mounting board (4) Position the separate attachment piece (8) on the edge of the mounting board 4 and the blowing fan (2) to be fixed by fixing or integrally configured, T-shaped mounting method is the mounting board (4) and blowing fan (10) is placed vertically and the attachment piece 12 bent vertically is padded to fix the soldering.
이상에서 알 수 있는 바와 같이, 송풍팬은 효과적인 방열을 기대할 수는 있으나 방열판에 비해 상대적으로 고가이기 때문에 실제로 채용이 어려워 고가의 소자 방열용으로 국한하여 사용하고 있다.As can be seen from the above, the blower fan can be expected to be effective heat dissipation, but because it is relatively expensive compared to the heat sink, it is difficult to actually use it is limited to use for expensive element heat dissipation.
그러나, 상기 중앙처리장치(CPU)의 방열용으로 송풍팬을 사용할 때에는 그 중앙처리장치가 설치된 보드에 납땜 또는 일체형으로 송풍팬이 구성되어 있으므로 기존에 제작된 송풍팬은 중앙처리장치의 교체와 더불어 교체되므로 재사용이 어려워 송풍팬을 다시 제작/설치해야하는 이중의 낭비를 초래하는 문제가 있는 것이다.However, when the blower fan is used for heat dissipation of the CPU, since the blower fan is formed by soldering or integrated into the board on which the CPU is installed, the conventional blower fan is replaced with the replacement of the CPU. It is difficult to reuse because it is replaced, there is a problem that causes a double waste of having to manufacture / install the blower fan again.
본 발명은 상기한 종래 기술의 사정을 감안하여 이루어진 것으로, 공기의 흐름에 따라 자유롭게 송풍팬의 위치를 변경시킬 수 있으며 송풍팬의 용이한 착탈이 가능하고 송풍팬과 장착보드가 방열파이프로의 사용이 가능한 힌지축에 의해 결합됨으로써 효과적인 방열이 이루어지도록 한 CPU 방열구조를 제공함에 그 목적이 있다.The present invention has been made in view of the above-described prior art, and the position of the blower fan can be freely changed according to the flow of air, the blower fan can be easily attached and detached, and the blower fan and the mounting board are used as heat radiation pipes. It is an object of the present invention to provide a CPU heat dissipation structure in which effective heat dissipation is achieved by being coupled by this possible hinge axis.
도 1은 종래의 실시예에 따른 CPU 방열구조를 나타내는 사시도이다.1 is a perspective view illustrating a CPU heat dissipation structure according to a conventional embodiment.
도 2는 종래의 다른 실시예에 따른 CPU 방열구조를 나타내는 사시도이다.2 is a perspective view illustrating a CPU heat dissipation structure according to another exemplary embodiment.
도 3은 본 발명의 일실시예에 따른 CPU 방열구조를 나타내는 분리사시도이다.3 is an exploded perspective view illustrating a CPU heat dissipation structure according to an embodiment of the present invention.
*도면의 주요부분에 대한 부호의 설명** Description of the symbols for the main parts of the drawings *
6:CPU, 14:장착보드,6: CPU, 14: mounting board,
16:송풍팬, 20,26:힌지지지대,16: blower fan, 20, 26: hinge support,
22:스냅피트, 28:방열파이프.22: snap fit, 28: heat dissipation pipe.
상기한 목적을 달성하기 위해, 본 발명의 바람직한 실시예에 따르면 전자기기 내부의 열을 외부의 공기중으로 방출시키기 위한 방열구조에 있어서, 그 상면에 CPU가 삽입되는 삽입홈이 각설되고, 그 일측면에 힌지공이 형성된 힌지 지지대가 부착된 장착보드와; 적어도 하나이상의 측면으로부터 체결공이 형성된 결합편이 연장되어 형성되고, 상기 장착보드와 1조로 구성되는 힌지 지지대가 그 일측면에 부착된 송풍팬과; 상기 송풍팬과 장착보드의 힌지 지지대의 힌지공에 삽입되며 상기장착보드의 측면에 밀착 고정될 수 있도록 그 중앙부가 수직으로 절곡되어 CPU로부터 발생된 열을 전도시켜 공기중으로 방열시키는 방열파이프로 구성된 것을 특징으로 하는 CPU 방열구조이 제공된다.In order to achieve the above object, according to a preferred embodiment of the present invention, in the heat dissipation structure for dissipating heat inside the electronic device to the outside air, an insertion groove into which the CPU is inserted is angled on an upper surface thereof, and one side surface thereof. A mounting board having a hinge support on which a hinge hole is formed; A blowing fan having a coupling piece formed with a fastening hole extending from at least one side, and having a hinge support composed of one set with the mounting board; It is inserted into the hinge hole of the hinge support of the blower fan and the mounting board and the center portion is bent vertically to be fixed to the side of the mounting board is composed of a heat dissipation pipe to conduct heat generated from the CPU to radiate heat into the air A CPU heat dissipation structure is provided.
바람직하게, 본 발명의 일실시예에 따르면, 상기 장착보드는 그 일측면 중앙부에 상기 방열파이프를 삽입하여 고정시킬 수 있는 스냅피트가 형성된다.Preferably, according to one embodiment of the present invention, the mounting board is formed with a snap fit that can be fixed by inserting the heat radiation pipe in the central portion of one side.
이하, 본 발명에 대해 도면을 참조하여 상세하게 설명한다.EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail with reference to drawings.
도 3은 본 발명의 일실시예에 따른 CPU 방열구조를 나타내는 분리사시도이다.3 is an exploded perspective view illustrating a CPU heat dissipation structure according to an embodiment of the present invention.
이를 참조하면, CPU 방열구조는 CPU가 장착된 장착보드(14)와 송풍팬(16)으로 대별되는 바, 상기 장착보드(14)는 그 상면에 CPU(6)가 삽입되는 삽입홈(도시생략)이 각설된다.Referring to this, the heat dissipation structure of the CPU is roughly divided into a mounting board 14 and a blowing fan 16 on which the CPU is mounted, and the mounting board 14 has an insertion groove into which the CPU 6 is inserted into an upper surface thereof (not shown). ) Is laid out.
또한, 상기 장착보드(14)는 그 상면으로부터 하면을 통해 내측면에 나사홈이 형성된 관통공(18)이 구성되며, 그 일측면에 힌지공이 형성된 힌지 지지대(20)가 부착된다.In addition, the mounting board 14 has a through hole 18 formed with a screw groove formed on the inner surface through a lower surface thereof from an upper surface thereof, and a hinge support 20 having a hinge hole formed on one side thereof.
바람직하게, 상기 장착보드(14)는 그 일측면 중앙부에 그 측면으로부터 연장된 스냅피트(22)가 형성된다.Preferably, the mounting board 14 is formed with a snap fit 22 extending from the side in the central portion of one side.
상기 송풍팬(16)은 적어도 하나이상의 측면으로부터 체결공(24a)이 형성된 결합편(24)이 연장되어 형성되고, 상기 장착보드(14)와 1조로 구성되는 힌지 지지대(26)가 그 일측면에 부착된다.The blowing fan 16 is formed by extending the engaging piece 24 formed with the fastening hole 24a from at least one side, the hinge support 26 consisting of a pair of the mounting board 14, one side thereof Is attached to.
또한, 상기 송풍팬(16)과 장착보드(14)의 힌지 지지대(20,26)의 힌지공에 삽입되며 상기 장착보드(14)의 측면에 설치됨으로써 상기 CPU(6)로부터 발생된 열을 전도시켜 공기중으로 방열시키는 방열파이프(28)가 제공된다.In addition, it is inserted into the hinge hole of the hinge support (20, 26) of the blowing fan 16 and the mounting board 14 and is installed on the side of the mounting board 14 to conduct heat generated from the CPU (6) A heat radiation pipe 28 is provided to heat radiation into the air.
상기한 구성의 본 발명의 일실시예에 따른 CPU 방열구조의 기능 및 작용을 첨부된 도면을 참조하여 상세하게 설명한다.The function and operation of the CPU heat dissipation structure according to the embodiment of the present invention having the above-described configuration will be described in detail with reference to the accompanying drawings.
먼저, 상기 송풍팬(16)과 장착보드(14)의 각각 힌지 지지대(20,26)를 측부 밀착시킨 다음 상기 방열파이프(28)를 상기 힌지 지지대(20,26)의 힌지공에 삽입시킨다.First, the hinge supports 20 and 26 of the blower fan 16 and the mounting board 14 are in close contact with each other, and then the heat dissipation pipe 28 is inserted into the hinge holes of the hinge supports 20 and 26.
그런다음, 상기 방열파이프(28)의 측면을 상기 장착보드(14)의 측면에 형성된 스냅피트(22)의 내측으로 밀어넣으면 용이하게 상기 방열파이프(28)가 상기 장착보드(14)의 측면에 밀착 고정된다.Then, when the side of the heat dissipation pipe 28 is pushed into the inside of the snap pit 22 formed on the side of the mounting board 14, the heat dissipation pipe 28 is easily attached to the side of the mounting board 14. It is tightly fixed.
따라서, 상기 방열파이프(28)는 상기 송풍팬(16)과 장착보드(14)의 힌지축 역할을 함과 동시에 상기 장착보드(14)로부터 발생된 열을 전도시켜 공기중으로 방열하는 기능을 갖게 된다.Accordingly, the heat dissipation pipe 28 serves as a hinge axis of the blower fan 16 and the mounting board 14 and at the same time conducts heat generated from the mounting board 14 to radiate heat into the air. .
그리고, 상기 송풍팬(16)은 상기 장착보드(14)에 대하여 힌지결합되어 있으므로 전자제품 내부의 소자 설치방향과 공기의 흐름을 고려하여 자유롭게 설치각도를 변환시킬 수 있게 된다.In addition, the blower fan 16 is hinged to the mounting board 14, so that the installation angle can be freely changed in consideration of the element installation direction and air flow in the electronic product.
또한, 상기 송풍팬(16)이 상기 장착보드(14)에 착탈가능하게 결합되어 있으므로 상기 장착보드(14)를 교체할 때 상기 송풍팬(16)은 재사용 가능하게 된다.In addition, since the blowing fan 16 is detachably coupled to the mounting board 14, the blowing fan 16 becomes reusable when the mounting board 14 is replaced.
한편, 본 발명에 따른 CPU 방열구조는 단지 상기한 실시예에 한정되는 것이 아니고 그 기술적 요지를 이탈하지 않는 범위내에서 다양한 변경이 가능하다.On the other hand, the CPU heat dissipation structure according to the present invention is not limited only to the above-described embodiment, and various modifications can be made without departing from the technical gist of the present invention.
상기한 바와 같이, 본 발명에 따른 CPU 방열구조에 의하면 휴대용 컴퓨터의 내측에 구비되는 환풍팬의 착탈 및 각도변환이 가능하도록 하며, 메인보드의 측면으로부터 환풍팬의 하면으로 방열파이프가 구비되어 프로세서유닛으로부터 발생되는 열을 공기의 흐름에 따라 용이하게 배출시킬 수 있게 된다.As described above, according to the CPU heat dissipation structure according to the present invention, the fan and the angle conversion of the fan is provided in the inside of the portable computer, and the heat dissipation pipe is provided from the side of the motherboard to the bottom of the fan fan processor unit The heat generated from the can be easily discharged according to the flow of air.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000012868A KR20010091330A (en) | 2000-03-14 | 2000-03-14 | CPU releasing heat structure of portable computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000012868A KR20010091330A (en) | 2000-03-14 | 2000-03-14 | CPU releasing heat structure of portable computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20010091330A true KR20010091330A (en) | 2001-10-23 |
Family
ID=19655147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020000012868A KR20010091330A (en) | 2000-03-14 | 2000-03-14 | CPU releasing heat structure of portable computer |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20010091330A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6958913B2 (en) | 2002-06-20 | 2005-10-25 | Samsung Electronics Co., Ltd. | Heatsink mounting unit |
| WO2010028202A2 (en) * | 2008-09-08 | 2010-03-11 | Vornado Air, Llc | Air circulator |
| CN108536265A (en) * | 2018-06-13 | 2018-09-14 | 广州大学 | Has the heat dissipation of electronic chip device of radiation heat transfer function |
-
2000
- 2000-03-14 KR KR1020000012868A patent/KR20010091330A/en not_active Application Discontinuation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6958913B2 (en) | 2002-06-20 | 2005-10-25 | Samsung Electronics Co., Ltd. | Heatsink mounting unit |
| WO2010028202A2 (en) * | 2008-09-08 | 2010-03-11 | Vornado Air, Llc | Air circulator |
| WO2010028202A3 (en) * | 2008-09-08 | 2010-06-10 | Vornado Air, Llc | Air circulator |
| CN108536265A (en) * | 2018-06-13 | 2018-09-14 | 广州大学 | Has the heat dissipation of electronic chip device of radiation heat transfer function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Withdrawal due to no request for examination |