CN108536265A - Has the heat dissipation of electronic chip device of radiation heat transfer function - Google Patents
Has the heat dissipation of electronic chip device of radiation heat transfer function Download PDFInfo
- Publication number
- CN108536265A CN108536265A CN201810608608.0A CN201810608608A CN108536265A CN 108536265 A CN108536265 A CN 108536265A CN 201810608608 A CN201810608608 A CN 201810608608A CN 108536265 A CN108536265 A CN 108536265A
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- Prior art keywords
- card slot
- electronic chip
- transfer function
- heat
- radiated rib
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 37
- 238000012546 transfer Methods 0.000 title claims abstract description 34
- 230000005855 radiation Effects 0.000 title claims abstract description 30
- 239000011248 coating agent Substances 0.000 claims abstract description 47
- 238000000576 coating method Methods 0.000 claims abstract description 47
- 238000012545 processing Methods 0.000 claims abstract description 26
- 239000012528 membrane Substances 0.000 claims abstract description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 21
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 7
- 229910017052 cobalt Inorganic materials 0.000 claims description 5
- 239000010941 cobalt Substances 0.000 claims description 5
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007739 conversion coating Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- VLAPMBHFAWRUQP-UHFFFAOYSA-L molybdic acid Chemical compound O[Mo](O)(=O)=O VLAPMBHFAWRUQP-UHFFFAOYSA-L 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a kind of heat dissipation of electronic chip devices having radiation heat transfer function, including card slot, several radiated ribs and fan, the top of card slot is fixed in the lower end of each radiated rib, and each radiated rib is apart from one another by arrangement, the upper end fan attachment of each radiated rib；First through hole is offered on the side wall of card slot, the madial wall of card slot is coated with heat absorbing coating, and the bottom of card slot is used to fix the central processing unit membrane module of electronic chip.The above-mentioned madial wall for having the card slot in the heat dissipation of electronic chip device of radiation heat transfer function is coated with heat absorbing coating, when the central processing unit membrane module of electronic chip generates amount of heat, heat absorbing coating energy quick adsorption heat reduces the influence that heat generates central processing unit membrane module；And each radiated rib forms thermal conduction path from each other in radiator, and each thermal conduction path matches to form air duct with first through hole, and air duct is matched with fan in time to be excluded heat.
Description
Technical field
The present invention relates to heat abstractor technical fields, are dissipated more particularly to a kind of electronic chip having radiation heat transfer function
Thermal.
Background technology
With the fast development of electronics and information industry, electronic equipment (such as computer etc.) has become must in people's daily life
One of indispensable equipment.Nowadays electronic equipment is more and more intelligent, and internal electrical equipment is also increasing, such as core
Piece, power supply device, disc unit, CD player etc., each electrical equipment can generate amount of heat in operation, and heat can be led
The stability and quality for causing operation of electric element, if heat can not exclude that the electronic equipment speed of service will be caused slack-off in time,
Even there is interim card and crash phenomenon, timely and effectively excluding heat (radiating) is just particularly important.
For the various electrical equipments in electronic equipment, heat is most caused by central processing unit (CPU) chip,
In electronic equipment operational process, the heat that cpu chip generates may be up to 40 watts or more, and cpu chip is the core of electronic equipment
Center portion part, the heat dissipation of cpu chip are to ensure the key factor of electronic equipment operation.Currently, being typically employed in electronic equipment internal
Fan or radiator are installed to radiate to cpu chip, but heat dissipation effect is bad.
Invention content
Based on this, it is necessary to for existing ineffective in electronic equipment internal installation fan or radiator heat-dissipation
Problem provides a kind of heat dissipation of electronic chip device having radiation heat transfer function.
A kind of heat dissipation of electronic chip device having radiation heat transfer function, including card slot, several radiated ribs and fan, often
The top of the card slot is fixed in the lower end of one radiated rib, and each described radiated rib is apart from one another by arrangement,
The fan is fixed in the upper end of each radiated rib；
First through hole is offered on the side wall of the card slot, the madial wall of the card slot is coated with heat absorbing coating, the card slot
Bottom be used to fix the central processing unit membrane module of electronic chip.
The above-mentioned heat dissipation of electronic chip device for having radiation heat transfer function includes card slot, several radiated ribs and fan,
The lower end of wherein each radiated rib is fixed on the top of card slot, is alternatively arranged between each radiated rib, each is dissipated
The upper end of hot fin forms a whole for installing fan attachment；The side wall of card slot is equipped with first through hole, the inside of card slot
Wall is coated with heat absorbing coating, and the bottom of card slot, which is used to connect with the central processing unit membrane module of electronic chip, (utilizes the bottom of card slot
Portion is mounted on will be provided with the heat dissipation of electronic chip device of radiation heat transfer function on central processing unit membrane module)；Above-mentioned has
The madial wall (i.e. whole surface inside card slot) of card slot in the heat dissipation of electronic chip device of radiation heat transfer function is coated with heat absorption
Coating, when the central processing unit membrane module of electronic chip generates amount of heat, heat absorbing coating energy quick adsorption heat reduces heat
Measure the influence generated to central processing unit membrane module；And it is logical to form heat transfer from each other for each radiated rib in radiator
Road, each thermal conduction path match to form air duct with first through hole, and air duct is matched with fan in time to be excluded heat, maximum
Reduce to degree the heat of central processing unit membrane module generation.
Further include in one of the embodiments,：The bottom sidewall of the card slot is equipped with snap part, the snap part
It is clamped with the buckling parts of the central processing unit membrane module.
Each radiated rib is equally spacedly arranged in parallel in one of the embodiments,.
The heat absorbing coating is that black chromium heat absorbing coating, black nickel heat absorbing coating and black cobalt are inhaled in one of the embodiments,
Hot coating.
The card slot is concave card slot in one of the embodiments, and the madial wall of the concave card slot is in plane, cambered surface
Or any one in the conical surface.
The top sidewall of the card slot offers several fixing grooves in one of the embodiments, each described heat dissipation
The lower end of fin is plugged on respectively in the corresponding fixing groove.
The top sidewall of each described radiated rib and the card slot is integrally formed in one of the embodiments,.
The quantity of the first through hole is multiple in one of the embodiments, is evenly distributed on the side wall of the card slot
On.
The bottom of each radiated rib offers multiple second through-holes in one of the embodiments,.
The fan locks for screw equipped with several and will be with the radiated rib group in one of the embodiments,
The screw hole of conjunction.
Description of the drawings
Fig. 1 is the dimensional structure diagram for the heat dissipation of electronic chip device for having radiation heat transfer function in one embodiment；
Fig. 2 is the cross-sectional view for the heat dissipation of electronic chip device for having radiation heat transfer function in one embodiment；
Fig. 3 is the cross-sectional view for the heat dissipation of electronic chip device for having radiation heat transfer function in one embodiment；
Fig. 4 is the cross-sectional view for the heat dissipation of electronic chip device for having radiation heat transfer function in one embodiment；
Fig. 5 is the cross-sectional view for the heat dissipation of electronic chip device for having radiation heat transfer function in one embodiment.
Specific implementation mode
Present disclosure is described in further detail below in conjunction with preferred embodiment and attached drawing.Obviously, hereafter institute
The embodiment of description only explains the present invention rather than limitation of the invention.Based on the embodiments of the present invention, the common skill in this field
The every other embodiment that art personnel are obtained without making creative work belongs to the model that the present invention protects
It encloses.It should be noted that for ease of description, only some but not all contents related to the present invention are shown in the drawings.
To facilitate the understanding of the present invention, below with reference to relevant drawings to being originally described more fully.It needs to illustrate
It is that when an element is considered as " connection " another element, it can be directly to another element and in combination
It is integrated, or may be simultaneously present centering elements.Term as used herein " installation ", " one end ", " other end " and class
As state for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article and the technology people for belonging to the art
The normally understood meaning of member is identical.Term used in book described herein is intended merely to the mesh of description specific embodiment
, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more relevant Listed Items
Any and all combinations.In addition, " first ", " second ", " third ", " the 4th " are intended merely to described in differentiation herein
Object is not the restriction to object.
"upper", "lower", "left", "right" for being mentioned in text etc. are only used for indicating relative position relation, when being described object
After absolute position changes, then the relative position relation may also correspondingly change.
As shown in Figures 1 to 5, a kind of heat dissipation of electronic chip device having radiation heat transfer function, including it is card slot 10, several
The top of card slot 10, and each radiated rib are fixed in radiated rib 20 and fan 30, the lower end of each radiated rib 20
30 apart from one another by arrangement, the upper end fan attachment 30 of each radiated rib 20；First through hole is offered on the side wall of card slot 10
40, the madial wall of card slot 10 is coated with heat absorbing coating 50, and the bottom of card slot 10 is used to fix the central processing unit module of electronic chip
Part 100.
Radiated rib 30 is also referred to as fin or fin, is usually used in heat transmission equipment, and fin can increase heat transfer area, drop
Thermal resistance, the enhancing equipment heat-transfer capability of low heat convection.Optionally, the shape of radiated rib can be surface plate, curved slab (example
The curved slab of such as wave).In the present embodiment, the quantity of radiated rib 20 can be one or more, can be according to reality
The requirement of the size of radiator and radiating efficiency in border selects appropriate number of radiated rib 20, each radiated rib 20
Between to be spaced apart, i.e., gap is formed between radiated rib 20 two-by-two, in order to rapid cooling.Optionally, each is dissipated
It can be uniformly distributed, can not also be uniformly arranged between hot fin 20.In the present embodiment, the size of each radiated rib can
It, can also be different with identical.
Card slot 10 is the basal body structure for the heat dissipation of electronic chip device for having radiation heat transfer function, is on the one hand used to install solid
Determine radiated rib, on the other hand being used to be fixedly mounted the central processing unit membrane module of electronic chip (will radiate by card slot 10
Device is attached with electronic chip, radiator is arranged close to the position of the central processing unit membrane module of electronic chip),
In the present embodiment, radiated rib 20 is fixed on to the top of card slot, central processing unit membrane module 100 is fixed on the bottom of card slot 10
Portion.
Its main component of heat absorbing coating 50 is some heat-absorbing materials, can quickly absorb a large amount of heat.In the present embodiment,
Heat absorbing coating 50 is all coated in 10 madial wall of card slot (i.e. inner surface), when central processing unit membrane module generates greatly in the process of running
When the heat of amount, heat absorbing coating 50 can quickly absorb heat, and by radiated rib by heat derives.
The heat dissipation of electronic chip device for having radiation heat transfer function in the present embodiment includes card slot 10, several radiated ribs 20
With fan 30, the lower end of wherein each radiated rib 20 is fixed on the top of card slot 10, between each radiated rib 20 between
It is formed a whole every the upper end of arrangement, each radiated rib 20 for installing fan attachment；The side wall of card slot 10 is equipped with
The madial wall of first through hole 40, card slot 10 is coated with heat absorbing coating 50, and the bottom of card slot 10 is for the central processing with electronic chip
Device membrane module connects；The above-mentioned madial wall for having the card slot 10 in the heat dissipation of electronic chip device of radiation heat transfer function is coated with
Heat absorbing coating 50, when the central processing unit membrane module of electronic chip generates amount of heat, heat absorbing coating energy quick adsorption heat,
The influence that heat generates central processing unit membrane module is reduced, in addition, the side wall in card slot 10 opens up first through hole 40, it is each to radiate
Apart from one another by forming passage of heat and install fan, i.e., each thermal conduction path and the on 20 top of radiated rib between fin 20
One through-hole 40 matches to form air duct, and air duct is matched with fan in time to be excluded heat, common between these above-mentioned equipment
It acts on and forced-convection heat transfer effect can be formed, in further being accelerated by heat transfer, thermal convection current and the synergistic effect of heat radiation
The heat dissipation (in detail please as shown in Figure 5) of central processor membrane module.
In one of the embodiments, as shown in Figure 1, the bottom sidewall for further including card slot 10 is equipped with snap part 60, card
Buckle part 60 and the buckling parts of central processing unit membrane module are clamped.
Snap part 60 is used to be clamped with the holding section of central processing unit membrane module, to (actually dissipate card slot 10
Hot device) it is fixed on central processing unit membrane module, avoid the occurrence of sliding.Wherein engaging part 60 can be U-shaped buckle, Great Wall Card
Any types such as button；Holding section can be connecting hole, groove etc., fix card slot i.e. as long as can be matched with snap part 60
It can.
Each radiated rib 20 is equally spacedly arranged in parallel in one of the embodiments,.
In the present embodiment, each radiated rib 20 is used and is equidistantly arranged in parallel, i.e., between each radiated rib 20
Equidistantly, and 20 parallel arrangement of each radiated rib；Above-mentioned set-up mode one side installation process is convenient and simple, also allows for dissipating
Hot device carries out cleaning repair；On the other hand it also can guarantee that heat dissipation is uniform, avoid because local heat dissipation effect difference is to central processing unit mould
Component impacts.
Heat absorbing coating 50 is black chromium heat absorbing coating, black nickel heat absorbing coating and the heat absorption of black cobalt in one of the embodiments,
Coating.
Specifically, the type of heat absorbing coating 50 is more, including electroplated coating, electrochemical surface conversion coating, Vacuum Deposition apply
Layer and pigment coating.In the present embodiment, using electroplated coating, because it is with good absorption ratio.Wherein electroplated coating is logical
Include often black chrome coating, black nickel coating and black cobalt coating.The absorptance α and transmitting ratio ε of black chrome coating be respectively 0.93-0.97 and
0.07-0.15, α/ε are 6~13, have excellent spectral selection.The thermal stability and high temperature resistant property of black chrome coating are also very
It is good, it is suitable for hot conditions, it can long-term stable operation at 300 DEG C.In addition, black chrome coating also has preferable weatherability and anti-corrosion
Property.Black nickel coating is mostly nickel-alloy coating, and composition changes with electroplate liquid composition and sedimentary condition.The electroplate liquid of black nickel is divided into
Two classes, i.e. zinc sulfate electroplate liquid and the electroplate liquid of salt containing molybdic acid.The black nickel coating obtained by first kind plating solution, nickeliferous 40%~
60%, it is about 20%~30% containing zinc.The absorptance α of black nickel coating up to 0.93~0.96, heat emission ratio ε is 0.08~
For 0.15, α/ε close to 6~12, absorbent properties are preferable.Black nickel coating is very thin, in order to improve the binding force of coating and matrix and resistance to
Corrosion, frequently with inter coat (such as Ni, Cu, Cd) or the double-deck nickel coating.The main component of black cobalt coating is CoS, has honeycomb
Type reticular structure, for absorptance α up to 0.94~0.96, transmitting ratio ε is that 0.12~0.14, α/ε is 6.7~8.
In one of the embodiments, such as Fig. 1, shown in Fig. 3 to Fig. 4, card slot 10 is concave card slot, the inside of concave card slot
Wall is in any one in plane, cambered surface or the conical surface.
Specifically, card slot 10 is concave card slot, wherein 10 inner surface of card slot (i.e. madial wall) is not usually smooth structure,
With certain roughness, increase by 10 inner surface area of card slot, to increase the application area of heat absorbing coating 50, and then bigger journey
Degree ground absorbs the heat that central processing unit membrane module generates.Wherein as shown in figure 3,10 madial wall of card slot can be planar；Such as
Shown in Fig. 4,10 madial wall of card slot can also be in cambered surface, conical surface (not shown), inverted V-shaped (not shown) etc., into
One step increases card slot inner surface area.
The top sidewall of card slot 10 offers several fixing grooves in one of the embodiments, each radiated rib
Lower end is plugged on respectively in corresponding fixing groove.
In the present embodiment, the top sidewall of card slot 10 offers multiple fixing grooves, and wherein fixing groove radiates for installing
Fin 20, the i.e. lower end of radiated rib 20 are by being plugged in fixing groove so that radiated rib 20 is fixed on the top of card slot.It is logical
In the case of often, fixing groove is symmetrical arranged on the two side (in terms of Fig. 1 on the side wall of the front of and behind of card slot) of card slot, i.e.,
A pair of of fixing groove is for fixing a radiated rib.In addition, fixing groove quantity is several.
It should be understood that above-mentioned fixing groove is merely a kind of fixed mode of radiated rib, do not limit only using above-mentioned
Mode, those skilled in the art can also use other modes, as long as radiated rib can be fixed on to the top of card slot i.e.
It can.
The top sidewall of each radiated rib and card slot is integrally formed in one of the embodiments,.
In the present embodiment, the top sidewall of radiated rib and card slot is integrated, needs not move through other structures (example
Such as fixing groove) radiated rib is fixed on card slot.Radiated rib is in integral structure with card slot, on the one hand radiator is facilitated to pacify
Dress manufacture, on the other hand avoids the landing of radiated rib in use, to influence heat dissipation effect.
In one of the embodiments, as shown in Figure 3 to Figure 4, the quantity of first through hole 40 is multiple, is evenly distributed on card
On the side wall of slot.
Specifically, the side wall of card slot 10 is equipped with multiple first through hole 40, increases the exchange of heat, further increases heat dissipation
The radiating efficiency of device.
In one of the embodiments, as shown in Figures 3 to 5, the bottom of each radiated rib 20 offers multiple the
Two through-holes 70.
In the present embodiment, multiple second through-holes 70 are opened up close to the position of bottom in each radiated rib 20, increased
The exchange of heat further increases the radiating efficiency of radiator.
In one of the embodiments, as shown in Figure 1, fan 30 locks for screw equipped with several and will be with cooling fin
The screw hole 80 of piece combination.
In the present embodiment, several screw holes 80 are equipped on fan 30, wherein screw hole 80 is used for locking screw, screw
Fan 30 is fixed on to the top of radiated rib by screw hole 80.Optionally, it is respectively set one at four angles of fan 30
On the one hand screw hole 80 can ensure that the stability that fan 30 is installed, another party are convenient when needing to repair radiator
Dismounting.
Each technical characteristic of above example can be combined arbitrarily, to keep description succinct, not to above-described embodiment
In each technical characteristic it is all possible combination be all described, as long as however, the combination of these technical characteristics be not present lance
Shield is all considered to be the range of this specification record.
Only several embodiments of the present invention are expressed for above example, the description thereof is more specific and detailed, but can not
Therefore it is construed as limiting the scope of the patent.It should be pointed out that for those of ordinary skill in the art,
Under the premise of not departing from present inventive concept, various modifications and improvements can be made, these are all within the scope of protection of the present invention.
Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of heat dissipation of electronic chip device having radiation heat transfer function, which is characterized in that including card slot, several radiated ribs
And fan, the top of the card slot is fixed in the lower end of each radiated rib, and each described radiated rib is mutual
It is alternatively arranged, the fan is fixed in the upper end of each radiated rib；
First through hole is offered on the side wall of the card slot, the madial wall of the card slot is coated with heat absorbing coating, the bottom of the card slot
Portion is used to fix the central processing unit membrane module of electronic chip.
2. the heat dissipation of electronic chip device according to claim 1 for having radiation heat transfer function, which is characterized in that also wrap
It includes：The bottom sidewall of the card slot is equipped with snap part, the buckling parts of the snap part and the central processing unit membrane module
Clamping.
3. the heat dissipation of electronic chip device according to claim 1 for having radiation heat transfer function, which is characterized in that Ge Gesuo
Radiated rib is stated equally spacedly to be arranged in parallel.
4. the heat dissipation of electronic chip device according to claim 1 for having radiation heat transfer function, which is characterized in that the suction
Hot coating is black chromium heat absorbing coating, black nickel heat absorbing coating and black cobalt heat absorbing coating.
5. the heat dissipation of electronic chip device according to claim 1 for having radiation heat transfer function, which is characterized in that the card
Slot is concave card slot, and the madial wall of the concave card slot is in any one in plane, cambered surface or the conical surface.
6. having the heat dissipation of electronic chip device of radiation heat transfer function according to claim 1-5 any one of them, feature exists
In the top sidewall of the card slot offers several fixing grooves, and the lower end of each radiated rib is plugged on correspondence respectively
The fixing groove in.
7. having the heat dissipation of electronic chip device of radiation heat transfer function according to claim 1-5 any one of them, feature exists
In the top sidewall of each described radiated rib and the card slot is integrally formed.
8. the heat dissipation of electronic chip device according to claim 6 for having radiation heat transfer function, which is characterized in that described first is logical
The quantity in hole is multiple, is evenly distributed on the side wall of the card slot.
9. the heat dissipation of electronic chip device according to claim 7 for having radiation heat transfer function, which is characterized in that each
The bottom of the radiated rib offers multiple second through-holes.
10. the heat dissipation of electronic chip device for having radiation heat transfer function according to claim 8 or claim 9, which is characterized in that institute
State the screw hole that fan locks for screw equipped with several and will be combined with the radiated rib.
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| CN201810608608.0A CN108536265A (en) | 2018-06-13 | 2018-06-13 | Has the heat dissipation of electronic chip device of radiation heat transfer function |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11222830B2 (en) * | 2018-01-03 | 2022-01-11 | Lenovo (Beijing) Co., Ltd. | Heat dissipation structure and electronic device |
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| CN208298109U (en) * | 2018-06-13 | 2018-12-28 | 广州大学 | The heat dissipation of electronic chip device for having radiation heat transfer function |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US11222830B2 (en) * | 2018-01-03 | 2022-01-11 | Lenovo (Beijing) Co., Ltd. | Heat dissipation structure and electronic device |
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