CN208433401U - Heat dissipation of electronic chip device - Google Patents
Heat dissipation of electronic chip device Download PDFInfo
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- CN208433401U CN208433401U CN201820918765.7U CN201820918765U CN208433401U CN 208433401 U CN208433401 U CN 208433401U CN 201820918765 U CN201820918765 U CN 201820918765U CN 208433401 U CN208433401 U CN 208433401U
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- card slot
- electronic chip
- heat
- heat dissipation
- radiated rib
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Abstract
The utility model relates to a kind of heat dissipation of electronic chip device, including card slot, several radiated ribs and fan, the top of card slot is fixed in the lower end of each radiated rib, and each radiated rib is apart from one another by arrangement, the upper end fan attachment of each radiated rib；Several cavity structures are equipped in card slot, the upper end of cavity structure and the lower end of radiated rib abut against, each cavity structure is spaced apart from each other distribution, and phase-changing energy storage material is filled in each cavity structure；First through hole is offered on the side wall of card slot, the inner sidewall of card slot is coated with heat absorbing coating, and the bottom of card slot is used to fix the central processing unit membrane module of electronic chip.Above-mentioned radiator is when the central processing unit membrane module of electronic chip generates amount of heat, phase-changing energy storage material and heat absorbing coating energy quick adsorption heat, and utilize thermal conduction path and air duct, air duct is matched with fan in time to be excluded heat, and the heat that central processing unit membrane module generates farthest is reduced.
Description
Technical field
The utility model relates to heat abstractor technical fields, more particularly to a kind of heat dissipation of electronic chip device.
Background technique
With the fast development of electronics and information industry, electronic equipment (such as computer etc.) has become must in people's daily life
One of indispensable equipment.Nowadays electronic equipment is more and more intelligent, and internal electrical component is also increasing, such as core
Piece, power supply device, disc unit, CD player etc., each electrical component can generate amount of heat in operation, and heat can be led
The stability and quality of operation of electric element are caused, if can not to exclude to will lead to the electronic equipment speed of service in time slack-off for heat,
Even there is Caton and crash phenomenon, timely and effectively excluding heat (radiating) is just particularly important.
For the various electrical components in electronic equipment, heat caused by central processing unit (CPU) chip is most,
In electronic equipment operational process, the heat that cpu chip generates may be up to 40 watts or more, and cpu chip is the core of electronic equipment
Center portion part, the heat dissipation of cpu chip are to ensure the key factor of electronic equipment operation.Currently, being typically employed in electronic equipment internal
Fan or radiator are installed to radiate to cpu chip, but heat dissipation effect is bad.
Utility model content
Based on this, it is necessary to for existing ineffective in electronic equipment internal installation fan or radiator heat-dissipation
Problem provides a kind of heat dissipation of electronic chip device.
A kind of heat dissipation of electronic chip device, including card slot, several radiated ribs and fan, each radiated rib
The top of the card slot is fixed in lower end, and each described radiated rib is apart from one another by arrangement, each described radiated rib
The fixed fan in upper end；
Several cavity structures, the lower end phase of the upper end of the cavity structure and the radiated rib are equipped in the card slot
It abuts, each described cavity structure is spaced apart from each other distribution, and phase-changing energy storage material is filled in each described cavity structure；
First through hole is offered on the side wall of the card slot, the inner sidewall of the card slot is coated with heat absorbing coating, the card slot
Bottom be used to fix the central processing unit membrane module of electronic chip.
Above-mentioned heat dissipation of electronic chip device includes card slot, several radiated ribs and fan, wherein each radiated rib
Lower end be fixed on the top of card slot, be alternatively arranged between each radiated rib, the upper end composition one of each radiated rib
A entirety is used to install fan attachment；It is equipped with several cavity structures in card slot, is filled with phase-changing energy storage material in cavity structure,
The side wall of card slot is equipped with first through hole, and the inner sidewall of card slot is coated with heat absorbing coating, and the bottom of card slot is used for and electronic chip
Heat dissipation of electronic chip device (is mounted on central processing unit mould group using the bottom of card slot by the connection of central processing unit membrane module
On part)；The inner sidewall (i.e. whole surface inside card slot) of card slot in above-mentioned heat dissipation of electronic chip device is coated with heat absorption and applies
Layer, when the central processing unit membrane module of electronic chip generates amount of heat, phase-changing energy storage material and heat absorbing coating can quickly be inhaled
Attached heat reduces the influence that heat generates central processing unit membrane module；And in radiator each radiated rib mutually it
Between form thermal conduction path, each thermal conduction path matches to form air duct with first through hole, air duct matched with fan can in time
Heat is excluded, the heat that central processing unit membrane module generates farthest is reduced.
In one of the embodiments, further include: the bottom sidewall of the card slot is equipped with snap part, the snap part
It is clamped with the buckling parts of the central processing unit membrane module.
Each radiated rib is equally spacedly arranged in parallel in one of the embodiments,.
The heat absorbing coating is that black chromium heat absorbing coating, black nickel heat absorbing coating and black cobalt are inhaled in one of the embodiments,
Hot coating.
The card slot is concave card slot in one of the embodiments, and the inner sidewall of the concave card slot is in plane, cambered surface
Or any one in the conical surface.
The top sidewall of the card slot offers several fixing grooves in one of the embodiments, each described heat dissipation
The lower end of fin is plugged on respectively in the corresponding fixing groove.
The top sidewall of each described radiated rib and the card slot is integrally formed in one of the embodiments,.
The quantity of the first through hole is multiple in one of the embodiments, is evenly distributed on the side wall of the card slot
On.
The bottom of each radiated rib offers multiple second through-holes in one of the embodiments,.
The fan locks for screw equipped with several and will be with the radiated rib group in one of the embodiments,
The screw hole of conjunction.
Detailed description of the invention
Fig. 1 is the schematic perspective view of heat dissipation of electronic chip device in one embodiment；
Fig. 2 is the schematic diagram of the section structure of heat dissipation of electronic chip device in one embodiment；
Fig. 3 is the schematic diagram of the section structure of heat dissipation of electronic chip device in one embodiment；
Fig. 4 is the schematic diagram of the section structure of heat dissipation of electronic chip device in one embodiment；
Fig. 5 is the schematic diagram of the section structure of heat dissipation of electronic chip device in one embodiment.
Specific embodiment
The content of the utility model is described in further detail below in conjunction with preferred embodiment and attached drawing.Obviously, under
Literary described embodiment only explains the utility model, rather than the restriction to the utility model.Based on the reality in the utility model
Example is applied, every other embodiment obtained by those of ordinary skill in the art without making creative efforts all belongs to
In the range of the utility model protection.It should be noted that illustrating only for ease of description, in attached drawing and the utility model phase
The part of pass rather than full content.
For the ease of understanding the utility model, below with reference to relevant drawings to being originally described more fully.It needs
Bright, when an element is considered as " connection " another element, it can be directly to another element and therewith
It is combined as a whole, or may be simultaneously present centering elements.Term as used herein " installation ", " one end ", " other end " with
And similar statement is for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and the technology people for belonging to the art
The normally understood meaning of member is identical.Term used in book described herein is intended merely to the mesh of description specific embodiment
, it is not intended that in limitation the utility model.Term " and or " used herein includes one or more relevant institute's lists
Any and all combinations of purpose.In addition, " first ", " second ", " third ", " the 4th " are intended merely to distinguish and are retouched herein
The object stated not is the restriction to object.
"upper", "lower", "left", "right" for mentioning in text etc. are only used for indicating relative positional relationship, when being described object
After absolute position changes, then the relative positional relationship may also correspondingly change.
As shown in Figures 1 to 5, a kind of heat dissipation of electronic chip device, including card slot 10, several radiated ribs 20 and fan
30, the top of card slot 10 is fixed in the lower end of each radiated rib 20, and each radiated rib 30 is apart from one another by arrangement, often
The upper end fan attachment 30 of one radiated rib 20；Several cavity structures 40, the upper end of cavity structure 40 are equipped in card slot 10
It is abutted against with the lower end of radiated rib 20, each cavity structure 40 is spaced apart from each other distribution, and fills in each cavity structure
There is phase-changing energy storage material 50；First through hole 60 is offered on the side wall of card slot 10, the inner sidewall of card slot 10 is coated with heat absorbing coating 70,
The bottom of card slot 10 is used to fix the central processing unit membrane module 200 of electronic chip.
Radiated rib 30 is also referred to as fin or fin, is usually used in heat exchange equipment, and fin can increase heat transfer area, drop
Thermal resistance, the enhancing equipment heat-transfer capability of low heat convection.Optionally, the shape of radiated rib can be surface plate, curved slab (example
The curved slab of such as wave).In the present embodiment, the quantity of radiated rib 20 can be one or more, can be according to reality
The requirement of the size of radiator and radiating efficiency in border selects appropriate number of radiated rib 20, each radiated rib 20
Between to be spaced apart, i.e., gap is formed between radiated rib 20 two-by-two, in order to rapid cooling.Optionally, each is dissipated
It can be uniformly distributed, can also unevenly be arranged between hot fin 20.In the present embodiment, the size of each radiated rib can
It, can also be different with identical.
Card slot 10 is the base structure of heat dissipation of electronic chip device, on the one hand for installing fixed radiated rib, another party
The central processing unit membrane module that face is used to be fixedly mounted electronic chip (is carried out radiator and electronic chip by card slot 10
Connection, is arranged close to radiator the position of the central processing unit membrane module of electronic chip), in the present embodiment, it will dissipate
Hot fin 20 is fixed on the top of card slot, and central processing unit membrane module 200 is fixed on the bottom of card slot 10.
Phase-changing energy storage material 50 is that one kind can release energy temporary unused energy stores again when needed
Material can absorb hot (cold) from environment or release (cold) amount of heat to environment, to reach that is, during its object phase change
The purpose of energy stores and release.Wherein, phase-changing energy storage material includes organic energy storage material: such as paraffin class, fatty acid, more
The organic phase change energy storage materials such as first alcohols；
Inorganic energy storage material: such as Na2SO4·10H2O、CaCl2·6H2O、Na2HPO4·12H2The inorganic salts crystallization water such as O
Close salt；Composite phase-change energy storage material: such as paraffinic base/expanded graphite, CaCl2·6H2O/ expanded graphite, paraffin/graphene are received
Rice grain, CaCl2·6H2O/ porous Al2O3Equal composite phase-change energy storage materials.It can choose in the present embodiment above-mentioned any one
Kind or a variety of phase-changing energy storage materials, when chip temperature is increased suddenly and can not be discharged in time, phase-changing energy storage material can will be warm
Amount is absorbed and is stored, and plays the role of resisting heat punching, to protect chip.The phase transition temperature of phase-changing energy storage material differs greatly,
That is phase transition temperature variation range is larger, wherein up to 30~120 DEG C.Fansink designs person or processing staff can be according to different
Demand selects the different phase-changing energy storage material of phase transition temperature, if such as radiator for military, the phase transition temperature of material is 30
~120 DEG C；If radiator, for civilian, the phase transition temperature of material is 30~50 DEG C.In addition, in the present embodiment, cavity knot
The shape of structure 40 can be rectangle, square etc..
Its main component of heat absorbing coating 70 is some heat-absorbing materials, can quickly absorb a large amount of heat.In the present embodiment,
Heat absorbing coating 70 is all coated in 10 inner sidewall of card slot (i.e. inner surface), when central processing unit membrane module generates greatly in the process of running
When the heat of amount, heat absorbing coating 70 can quickly absorb heat, and pass through radiated rib for heat derives.
Heat dissipation of electronic chip device includes card slot 10, several radiated ribs 20 and fan 30 in the present embodiment, wherein each
The lower end of a radiated rib 20 is fixed on the top of card slot 10, is alternatively arranged between each radiated rib 20, each heat dissipation
The upper end of fin 20 forms a whole for installing fan attachment；Several cavity structures 40, cavity structure are equipped in card slot
Phase-changing energy storage material 50 is filled in 40, the side wall of card slot 10 is equipped with first through hole 60, and the inner sidewall of card slot 10 is coated with heat absorption
Coating 70, the bottom of card slot 10 with the central processing unit membrane module of electronic chip for connecting；Above-mentioned heat dissipation of electronic chip dress
The inner sidewall of card slot 10 in setting is coated with heat absorbing coating 70, generates amount of heat in the central processing unit membrane module of electronic chip
When, 70 energy quick adsorption heat of phase-changing energy storage material 50 and heat absorbing coating reduces what heat generated central processing unit membrane module
Influence, in addition, the side wall in card slot 10 opens up first through hole 60, between each radiated rib 20 apart from one another by formed passage of heat with
And fan is installed on 20 top of radiated rib, i.e., each thermal conduction path matches to form air duct with first through hole 60, air duct and wind
Fan match and can in time exclude heat, collective effect between these above-mentioned equipment and forced-convection heat transfer effect can be formed, into
One step accelerates the heat dissipation of central processing unit membrane module (in detail see Fig. 5 by the synergistic effect of heat transfer, thermal convection and heat radiation
It is shown).
In one of the embodiments, as shown in Figure 1, further including the bottom sidewall of card slot 10 equipped with snap part 80, card
The buckling parts of buckle part 8080 and central processing unit membrane module 200 is clamped.
Snap part 80 is used to be clamped with the holding section of central processing unit membrane module, so that card slot 10 (actually be dissipated
Hot device) it is fixed on central processing unit membrane module, avoid the occurrence of sliding.Wherein engaging part 60 can be U-shaped buckle, Great Wall Card
Any types such as button；Holding section can be connecting hole, groove etc., as long as can match with snap part 80 card slot is fixed i.e.
It can.
Each radiated rib 20 is equally spacedly arranged in parallel in one of the embodiments,.
In the present embodiment, each radiated rib 20 is used and is equidistantly arranged in parallel, i.e., between each radiated rib 20
Equidistantly, and 20 parallel arrangement of each radiated rib；Above-mentioned set-up mode one side installation process is convenient and simple, is also convenient for scattered
Hot device carries out cleaning maintenance；On the other hand it also can guarantee that heat dissipation uniformly, is avoided because local heat dissipation effect difference is to central processing unit mould
Component impacts.
Heat absorbing coating 70 is black chromium heat absorbing coating, black nickel heat absorbing coating and the heat absorption of black cobalt in one of the embodiments,
Coating.
Specifically, the type of heat absorbing coating 70 is more, including electroplated coating, electrochemical surface conversion coating, Vacuum Deposition apply
Layer and pigment coating.In the present embodiment, using electroplated coating, because it is with good absorption ratio.Wherein electroplated coating is logical
It often include black chrome coating, black nickel coating and black cobalt coating.The absorptance α and transmitting ratio ε of black chrome coating be respectively 0.93-0.97 and
0.07-0.15, α/ε are 6~13, have excellent spectral selection.The thermal stability and high temperature resistant property of black chrome coating are also very
It is good, it is suitable for hot conditions, it can long-term stable operation at 300 DEG C.In addition, black chrome coating also has preferable weatherability and anti-corrosion
Property.Black nickel coating is mostly nickel-alloy coating, and composition changes with electroplate liquid composition and sedimentary condition.The electroplate liquid of black nickel is divided into
Two classes, i.e. zinc sulfate electroplate liquid and the electroplate liquid of salt containing molybdic acid.The black nickel coating obtained by first kind plating solution, nickeliferous 40%~
60%, it is about 20%~30% containing zinc.The absorptance α of black nickel coating up to 0.93~0.96, heat emission ratio ε is 0.08~
For 0.15, α/ε close to 6~12, absorbent properties are preferable.Black nickel coating is very thin, in order to improve the binding force of coating and matrix and resistance to
Corrosion, frequently with inter coat (such as Ni, Cu, Cd) or the double-deck nickel coating.The main component of black cobalt coating is CoS, has honeycomb
Type reticular structure, for absorptance α up to 0.94~0.96, transmitting ratio ε is that 0.12~0.14, α/ε is 6.7~8.
In one of the embodiments, such as Fig. 1, shown in Fig. 3 to Fig. 4, card slot 10 is concave card slot, the inside of concave card slot
Wall is in any one in plane, cambered surface or the conical surface.
Specifically, card slot 10 is concave card slot, wherein 10 inner surface of card slot (i.e. inner sidewall) is not usually smooth structure,
With certain roughness, increase by 10 inner surface area of card slot, to increase the application area of heat absorbing coating 70, and then more great Cheng
Degree ground absorbs the heat that central processing unit membrane module generates.Wherein as shown in figure 3,10 inner sidewall of card slot can be planar；Such as
Shown in Fig. 4,10 inner sidewall of card slot can also in cambered surface, conical surface (not shown), inverted V-shaped (not shown) etc., thus into
One step increases card slot inner surface area.
In addition, concave card slot is usually metal material.Optionally, metal material can be higher for thermal coefficients such as copper, aluminium
Metal.
The top sidewall of card slot 10 offers several fixing grooves in one of the embodiments, each radiated rib
Lower end is plugged on respectively in corresponding fixing groove.
In the present embodiment, the top sidewall of card slot 10 offers multiple fixing groove (not shown)s, wherein fixing groove
For installing radiated rib 20, i.e. the lower end of radiated rib 20 makes radiated rib 20 be fixed on card by being plugged in fixing groove
The top of slot.Under normal conditions, fixing groove is on the two sidewalls (in terms of Fig. 1 on the side wall of the front of and behind of card slot) of card slot
It is symmetrical arranged, i.e., a pair of of fixing groove is for fixing a radiated rib.In addition, fixed slot number is several.
It should be understood that above-mentioned fixing groove is merely a kind of fixed mode of radiated rib, do not limit only using above-mentioned
Mode, those skilled in the art can also be using other modes, as long as radiated rib can be fixed on to the top of card slot i.e.
It can.
The top sidewall of each radiated rib and card slot is integrally formed in one of the embodiments,.
In the present embodiment, the top sidewall of radiated rib and card slot is integrated, needs not move through other structures (example
Such as fixing groove) radiated rib is fixed on card slot.Radiated rib and card slot are in integral structure, on the one hand radiator are facilitated to pacify
Dress manufacture, on the other hand avoids the landing of radiated rib in use, to influence heat dissipation effect.
In one of the embodiments, as shown in Figure 3 to Figure 4, the quantity of first through hole 60 is multiple, is evenly distributed on card
On the side wall of slot.
Specifically, the side wall of card slot 10 is equipped with multiple first through hole 60, increases the exchange of heat, further increases heat dissipation
The radiating efficiency of device.
In one of the embodiments, as shown in Figures 3 to 5, the bottom of each radiated rib 20 offers multiple the
Two through-holes 90.
In the present embodiment, multiple second through-holes 90 are opened up close to the position of bottom in each radiated rib 20, wherein
Strong convection is formed between first through hole 60 and the second through-hole 90, increases the exchange of heat, further increases the heat dissipation effect of radiator
Rate.
In one of the embodiments, as shown in Figure 1, fan 30 locks for screw equipped with several and will be with cooling fin
The screw hole 100 of piece combination.
In the present embodiment, several screw holes 100 are equipped on fan 30, wherein screw hole 100 is used for locking screw, spiral shell
Fan 30 is fixed on the top of radiated rib by screw hole 100 by silk.Optionally, one is respectively set at four angles of fan 30
A screw hole 100, on the one hand can guarantee the stability that fan 30 is installed, and another party is needing to repair when side to radiator
Just it dismantles.
Each technical characteristic of above embodiments can be combined arbitrarily, for simplicity of description, not to above-described embodiment
In each technical characteristic it is all possible combination be all described, as long as however, the combination of these technical characteristics be not present lance
Shield all should be considered as described in this specification.
Above embodiments only express the several embodiments of the utility model, and the description thereof is more specific and detailed, but simultaneously
The limitation to utility model patent range therefore cannot be interpreted as.It should be pointed out that for the ordinary skill people of this field
For member, without departing from the concept of the premise utility, various modifications and improvements can be made, these belong to this reality
With novel protection scope.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of heat dissipation of electronic chip device, which is characterized in that including card slot, several radiated ribs and fan, described in each
The top of the card slot is fixed in the lower end of radiated rib, and each described radiated rib is apart from one another by arrangement, each institute
State the fixed fan in upper end of radiated rib；
Several cavity structures are equipped in the card slot, the upper end of the cavity structure and the lower end of the radiated rib offset
It connects, each described cavity structure is spaced apart from each other distribution, and phase-changing energy storage material is filled in each described cavity structure；
First through hole is offered on the side wall of the card slot, the inner sidewall of the card slot is coated with heat absorbing coating, the bottom of the card slot
Portion is used to fix the central processing unit membrane module of electronic chip.
2. heat dissipation of electronic chip device according to claim 1, which is characterized in that further include: the bottom side of the card slot
Wall is equipped with snap part, the buckling parts clamping of the snap part and the central processing unit membrane module.
3. heat dissipation of electronic chip device according to claim 1, which is characterized in that each radiated rib is equally spacedly
It is arranged in parallel.
4. heat dissipation of electronic chip device according to claim 1, which is characterized in that the heat absorbing coating is that the heat absorption of black chromium applies
Layer, black nickel heat absorbing coating and black cobalt heat absorbing coating.
5. heat dissipation of electronic chip device according to claim 1, which is characterized in that the card slot is concave card slot, described
The inner sidewall of concave card slot is in any one in plane, cambered surface or the conical surface.
6. heat dissipation of electronic chip device according to claim 1-5, which is characterized in that the top side of the card slot
Wall offers several fixing grooves, and the lower end of each radiated rib is plugged on respectively in the corresponding fixing groove.
7. heat dissipation of electronic chip device according to claim 1-5, which is characterized in that each described cooling fin
The top sidewall of piece and the card slot is integrally formed.
8. heat dissipation of electronic chip device according to claim 6, which is characterized in that the quantity of the first through hole is more
It is a, it is evenly distributed on the side wall of the card slot.
9. heat dissipation of electronic chip device according to claim 7, which is characterized in that the bottom of each radiated rib
Offer multiple second through-holes.
10. heat dissipation of electronic chip device according to claim 8 or claim 9, which is characterized in that the fan is equipped with several
The screw hole that locks for screw and will be combined with the radiated rib.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820918765.7U CN208433401U (en) | 2018-06-13 | 2018-06-13 | Heat dissipation of electronic chip device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820918765.7U CN208433401U (en) | 2018-06-13 | 2018-06-13 | Heat dissipation of electronic chip device |
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| CN208433401U true CN208433401U (en) | 2019-01-25 |
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ID=65101870
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598050A (en) * | 2018-06-13 | 2018-09-28 | 广州大学 | Heat dissipation of electronic chip device |
| CN110267488A (en) * | 2019-05-30 | 2019-09-20 | 广州大学 | A kind of electronic device powerless heat dissipating device |
| US20230204303A1 (en) * | 2021-12-29 | 2023-06-29 | Industrial Technology Research Institute | Phase change thermal management device |
-
2018
- 2018-06-13 CN CN201820918765.7U patent/CN208433401U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598050A (en) * | 2018-06-13 | 2018-09-28 | 广州大学 | Heat dissipation of electronic chip device |
| CN110267488A (en) * | 2019-05-30 | 2019-09-20 | 广州大学 | A kind of electronic device powerless heat dissipating device |
| US20230204303A1 (en) * | 2021-12-29 | 2023-06-29 | Industrial Technology Research Institute | Phase change thermal management device |
| US11976885B2 (en) * | 2021-12-29 | 2024-05-07 | Industrial Technology Research Institute | Phase change thermal management device |
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