CN1503356A - Central type flow guiding heat radiation device - Google Patents

Central type flow guiding heat radiation device Download PDF

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Publication number
CN1503356A
CN1503356A CNA021526397A CN02152639A CN1503356A CN 1503356 A CN1503356 A CN 1503356A CN A021526397 A CNA021526397 A CN A021526397A CN 02152639 A CN02152639 A CN 02152639A CN 1503356 A CN1503356 A CN 1503356A
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CN
China
Prior art keywords
type flow
radiation device
center type
chassis
guiding radiation
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA021526397A
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Chinese (zh)
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CN100341144C (en
Inventor
骆俊光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NOYA Inc
NOVA Inc
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NOYA Inc
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Publication date
Application filed by NOYA Inc filed Critical NOYA Inc
Priority to CNB021526397A priority Critical patent/CN100341144C/en
Publication of CN1503356A publication Critical patent/CN1503356A/en
Application granted granted Critical
Publication of CN100341144C publication Critical patent/CN100341144C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

This invention provides a central diversion heat abstractor mounted on a heat source with a radiation unit set on it and a fan unit on the radiation unit which includes a super thermal conducting complex capable of adhering to the source and conducting the main heat source from the source up ward quickly, several interval rings are set on the fins of the complex with one on the shell outside the fins, and one inlets surrounding the bottom of the shell.

Description

Center type flow-guiding radiation device
(1) technical field
The present invention relates to a kind of heat abstractor, particularly relate to a kind of center type flow-guiding radiation device that temperature can be transmitted rapidly.
(2) background technology
As shown in Figure 1, general heat abstractor, be to be installed in pyrotoxin 12 tops that are positioned on the substrate 11, this pyrotoxin 12 can be a central processing unit (CPU), integrated circuit (IC) chip (IC), module ... Deng, this heat abstractor comprises that one is attached to the aluminium radiator fin 13 on this pyrotoxin 12, and a radiator fan 14 that blows to this fin 13, the bottom of this fin 13 is provided with a bronze medal metal conducting strip 15; Be delivered to fast on the fin of this aluminium radiator fin 13 by the higher temperature coefficient of conductivity of the copper metal surface temperature with pyrotoxin 12, obtain preferable radiating effect to strengthen the area of dissipation mode, still, above-mentioned radiating effect in fact still has following disappearance:
1. though the temperature coefficient of aluminum metal and copper metal is respectively 218 and 418, its heat-conducting effect of arranging in pairs or groups mutually is still fast inadequately, cause this fin 13 and this pyrotoxin 12 after temperature transfer, form the inconsistent situation of temperature that these pyrotoxin 12 surface temperatures still are higher than fin 13, be that the wind that radiator fan 14 is blown only blows the shell that reaches fin 13, can't arrive pyrotoxin 12 surfaces, the radiating effect that is commonly called as outside heat radiation is bad.
2. what deserves to be mentioned is, when pyrotoxin 12 after running, the temperature of its surface accumulation can raise gradually, but, the outside heat sinking function of above-mentioned heat abstractor can't in time reduce the elevated operating temperature of this pyrotoxin 12, will influence the working stability degree of this pyrotoxin 12, light then make the computer of installing pyrotoxin 12 produce the deadlock situation, the heavy then situation that is damaged because of working temperature is too high.
(3) summary of the invention
The objective of the invention is is providing a kind of center type flow-guiding radiation device that heat can be transmitted rapidly.
According to center type flow-guiding radiation device of the present invention, be to be installed on the pyrotoxin, and comprise a cooling mechanism that is installed on this pyrotoxin, and a fan that is installed on this cooling mechanism; This cooling mechanism comprises can the be sticked superthermal conduction assembly on this pyrotoxin, the fin that several spacer rings are located at this superthermal conduction assembly, reach the shell body that a ring is located at the outer circumferential side of this fin, this shell body has the air intake vent that its all side in bottom was established and be applied in at least one ring, and this air intake vent enters in this shell body for the guiding extraneous air; This fan is the top that can be installed in the shell body of this cooling mechanism with axially breaking away from; By this superthermal conduction assembly with the main thermal source of this pyrotoxin heat loss through conduction means up rapidly, and attract cool exterior air to be from lower to upper and path configuration through fleeing fast by air intake vent with this fan, concentrate the main heat dissipation that blows to this superthermal conduction assembly, and the auxiliary evacuation waste heat means of the of such a size cooling surface area by a plurality of fins, can obtain best radiating effect eventually.
(4) description of drawings
Below by most preferred embodiment and accompanying drawing center type flow-guiding radiation device of the present invention is elaborated, in the accompanying drawing:
Fig. 1 is that a plane of general heat abstractor is provided with figure.
Fig. 2 is a stereo appearance figure of first preferred embodiment of the present invention.
Fig. 3 is a three-dimensional exploded view of this first preferred embodiment.
Fig. 4 is another three-dimensional exploded view of this first preferred embodiment.
Fig. 5 is not complete assembled sectional view of this first preferred embodiment.
Fig. 6 is that schematic diagram is used in one of this first preferred embodiment, illustrate that the thermal column top of this cooling mechanism can be installed a thermoelectric generator and a fin in regular turn, and thermoelectric generator connects the fan of this fan via couple of conductor.
Fig. 7 is a complete combination cutaway view not of second preferred embodiment of the present invention, illustrates that the kerve on this chassis and the heat extraction groove of this heat extraction unit define a superthermal conduction cavity mutually.
Fig. 8 is a complete combination cutaway view not of this second preferred embodiment, illustrates that this shell body can axially break away from by the one-body molded structure of making in this chassis and this heat extraction unit.
Fig. 9 is not complete exploded view of the 3rd preferred embodiment of the present invention, and the structure that this chassis, thermal column, fin and shell body are made of one piece is described, and has a hollow cavity that is defined by this chassis, thermal column and fin internal communication.
Figure 10 is a complete combination cutaway view not of the 4th preferred embodiment of the present invention, and the structure that this chassis, thermal column and fin are made of one piece is described, and has a hollow cavity that is defined by this chassis, thermal column and fin internal communication.
Figure 11 is a completed lateral cutaway view not of the 4th preferred embodiment.
(5) embodiment
For convenience of description, at following embodiment, similar elements is to represent with same numeral.
Shown in Fig. 2,5, first preferred embodiment of center type flow-guiding radiation device 2 of the present invention is to be installed on the pyrotoxin 3, and this pyrotoxin 3 can be just like central processing unit (CPU), integrated circuit (IC) chip (IC), circuit module ... Deng and other pyrotoxin; This pyrotoxin 3 is a central processing unit in this example; This center type flow-guiding radiation device 2 comprise one be installed in cooling mechanism 4 on this pyrotoxin 3, at least one heat carriers 5, that are installed in this cooling mechanism 4 are installed in the induced draft fan mechanism 6 of this top, cooling mechanism 4 tops, and apply the heat-conducting cream 7 of this heat carrier 5.
Shown in Fig. 3,4,5, this cooling mechanism 4 comprises a superthermal conduction assembly 40 that can be sticked on this pyrotoxin 3, and several spacer rings are located at the fin 400 of this superthermal conduction assembly 40; This superthermal conduction assembly 40, comprise hang down the heat extraction unit 9 on the end face 82 that is located at this chassis 8 of circular base plate 8 (also can be square or other geometries) on this pyrotoxin 3, that to be sticked, and one has one for being sleeved on the bottom opening 101 of these chassis 8 chow rings and the hollow shell body 100 of a top opening 102.
This chassis 8 comprises the bottom surface that can be sticked on this pyrotoxin 3 81, in contrast to this bottom surface 81 and towards the center line end face 82 that the convergent curved arc forms that makes progress, and at least one bottom outlet 83 that is recessed to form from its end face 82, is to form four bottom outlets 83 in this example.
This heat extraction unit 9 have a vertical thermal column 91 that is located at the end face 82 on this chassis 8 and can be located at its outer circumferential side for above-mentioned fin 400 spacer rings, and fin 400 coatings of above-mentioned per two mutual adjacency defines a passage 400 '; This thermal column 91 has the louvre 911 of the bottom outlet 83 that at least one pair of should chassis 8, each fin 400 has a heat-conducting part 401 that can be connected on the end face 82 on this chassis 8, and the concave arc shape bottom space 402 that these heat-conducting part 401 collocation are defined just overlaps mutually with the convex arc shaped end face 82 on this chassis 8.
This shell body 100, have at least one ring and establish and be applied in the air intake vent 103 of its all side in bottom, this example is established a plurality of air intake vents 103 for ring, reach at least two rings and establish and be applied in the hole clipping 104 of its top week side, this air intake vent 103 enters in this shell body 100 for the guiding cool exterior air, and is the passage 400 ' (arrow as shown in Figure 7) of fleeing from lower to upper through this heat extraction unit 9; These air intake vent 103 double block button holes of shell body 100 being detained fixed bit with fastener (not shown) that can be used as.
This heat carrier 5 is bottom outlets 83 of being installed in this chassis 8 and the louvre 911 of this thermal column 91 coats in the accommodation space 110 that defines; This heat carrier 5 can be a superconduction rod or a heat pipe, is to adopt four heat carriers 5 in this example; Especially when using the superconduction rod, the heat energy that more can make this pyrotoxin 3 up conducts rapidly and obtains excellent heat-transfer effect.
This fan 6, it is the top opening 102 that can be installed in the shell body 100 of this cooling mechanism 4 with axially breaking away from, and comprise that a fan 61, a ring are located at the Circular Plate 62 of these fan 61 all sides, and three equidistantly protrude out the snib 63 of formation downwards from the bottom edge of this Circular Plate 62, and this snib 63 is buckled in the hole clipping 104 of shell body 100 of this cooling mechanism 4 separatably.
In addition, the bottom outlet 83 on this chassis 8 coats with the louvre of this thermal column 91 911 and defines an accommodation space 110, conduction mode means in this accommodation space 110 are roughly divided following four kinds according to material group structure characteristic: one, adopt the normal pressure conduction pattern, promptly fill the compound that constitutes by multiple heat absorption or exothermic material unit biscuit firing ground and mixed in it; Its two, be the spraying conduction pattern, can in aforesaid compound, mix add anti-oxidation element after, accommodation space 110 inwalls are bestowed the surface spray and form; Its three, be existing thermal conductance mode, be in this accommodation space 110, to vacuumize the following single or composite material of filling: pure water, methyl alcohol, acetone, ammonia, nitrogen, sodium, lithium ... Deng or other equivalent materials; Its four, be superthermal conduction pattern, be to be selected from hydrogen, lithium, sodium, potassium, magnesium, calcium, strontium, barium ... or the like, adopt multiple first biscuit firing ground and mixed and form, refill the aforementioned component thing after accommodation space 110 is vacuumized and get.
What deserves to be mentioned is, the conduction mode of this fin 400 also can be used aforesaid spraying conduction pattern, it is the compound with multiple heat absorption or the first biscuit firing ground and mixed formation of exothermic material, after mixing adds anti-oxidation element, the chow ring surface area of this fin 400 is bestowed surperficial the spraying form.
Again, as shown in Figure 6, the present invention also comprises a thermoelectric generator 120, be consistent cold core sheet in this example, the position of this thermoelectric generator 120 makes its high temperature surface 121 become thermo-contact (contact-making surface adds heat-conducting cream) with the thermal column 91 top upper surfaces of this cooling mechanism 4, the low temperature apparent surface 122 of thermoelectric generator 120 then with 132 one-tenth thermo-contacts of basal surface (contact-making surface adds heat-conducting cream) of a fin 130, and thermoelectric generator 120 connects the fan of the fan 6 of these fin 130 tops via couple of conductor 140; When the temperature of thermal column 91 rises, the position can produce a temperature difference at thermal column 91 with two relative surfaces 121,122 of the thermoelectric generator 120 of 130 of this fin, this temperature difference can make this thermoelectric generator 120 produce a direct current voltage, for example when temperature reaches one 50 ℃ of definite values, voltage that this thermoelectric generator 120 is produced and electric current will make the fan action, the rotation of fan allows cold airflow blow to fin 130 and makes its cooling, thereby causes more thermal energy to be removed the temperature that reduces pyrotoxin 3 from thermal column 91; And in case of necessity can be with 120 serial connections of the thermoelectric generator more than two or two together to increase voltage output; So thermoelectric generator 120 electric energy that produces not only has above-mentioned cooling cooling function, and can reduce the power consumption of computer system.
Shown in Fig. 2,4,5, when the temperature of pyrotoxin 3 rises when central processing unit work (such as), by being arranged in the heat carrier 5 (this example be adopt superconduction rod) of this chassis 8 with this heat extraction unit 9, the main thermal source that this pyrotoxin 3 is produced up conducts and the of such a size surface area auxiliary heat dissipation of borrowing a plurality of fins 400 of its chow ring rapidly via center thermal column 91; And attract cool exterior air to be the path configuration that designed curved arc raises up and but the cooling air-flow is fled fast of flowing through from lower to upper via air intake vent 103 with this fan 6, blow to the main heat dissipation of the highest center thermal column of this temperature 91 and this fin 400 with compiling, and the auxiliary evacuation waste heat means of the of such a size cooling surface area by a plurality of fins 400, so enter from air intake vent 103 by detaching rapidly of this fan 6 and scurry thermal current in shell body 100, and obtain best radiating effect; What deserves to be mentioned is that turbine shape (not shown), the also path that can provide air-flow one to flee fast also can be provided this fin 400.
As shown in Figure 7, second preferred embodiment of the present invention, the place that is different from first preferred embodiment is: this chassis 8 ' has a kerve 821 ' that is recessed to form from this end face 82 ', the thermal column 91 ' of this heat extraction unit 9 ' has a pair of heat extraction groove 912 ' that should kerve 821 ', this kerve 821 ' defines a superthermal conduction cavity 150 mutually with this heat extraction groove 912 ', adopts four kinds of temperature conduction pattern means as hereinbefore in this superthermal conduction cavity 150; In addition, as shown in Figure 8, but this chassis 8 ' and the close casting integrated moulding of this heat extraction unit 9 ' semen collection.
As shown in Figure 9, the 3rd preferred embodiment of center type flow-guiding radiation device 2 ' of the present invention, its with precedent different be in: the thermal column 91 ' of this chassis 8 ', this heat extraction unit 9 ', this fin 400 are to adopt hot investment casting one-body molded with shell body 100, and have one by this chassis 8 ', this thermal column 91 ' and the hollow cavity 160 that these fin 400 three inside are interconnected and are defined, adopt four kinds of temperature conduction pattern means as hereinbefore in this hollow cavity 160; Shown in Figure 10,11, the 4th preferred embodiment of the present invention, this chassis 8 ', this thermal column 91 ' are one-body molded with hot investment casting with this fin 400, and have one by this chassis 8 ', this thermal column 91 ' and the hollow cavity 160 that these fin 400 three inside are interconnected and are defined, adopt four kinds of temperature conduction pattern means as hereinbefore in this hollow cavity 160.
Now center type flow-guiding radiation device of the present invention 2,2 ' advantage are respectively described below:
The present invention is diffused into this chassis 8 rapidly when the temperature of pyrotoxin 3 is risen, 8 ' with this heat extraction unit 9, on 9 ', and the means that attract cool exterior air air-flow to be flee fast from lower to upper with this fan 6 via air intake vent 103, concentrate the main heat dissipation that blows to the highest thermal column of this temperature 91 and chow ring fin 400, add the auxiliary evacuation waste heat means of the of such a size cooling surface area that is constituted by a plurality of fins 400, can detach rapidly by this fan 6 eventually and flee the thermal current in this shell body 100 and obtain best radiating effect, be different from existing heat abstractor the still permanent inconsistent situation that is higher than these fin 13 temperature of these pyrotoxin 12 surface temperatures can take place, center type flow-guiding radiation device of the present invention relatively has the operating characteristic that reaches comprehensive cooling rapidly, and can not influence the working stability degree of this pyrotoxin (as CPU).

Claims (33)

1. a center type flow-guiding radiation device is installed on the heat source, includes a cooling mechanism that is installed on this heat source, and a fan that is installed on this cooling mechanism, it is characterized in that:
This cooling mechanism, comprise that one can be sticked on this heat source and can be with the main thermal source of this heat source up superthermal conduction assembly of heat loss through conduction, the fin that several spacer rings are located at this superthermal conduction assembly rapidly, reach the shell body that a ring is located at this fin outer circumferential side, this shell body has the air intake vent that its all side in bottom was established and be applied in at least one ring; Reach this fan, can be installed in the shell body top of this cooling mechanism with axially breaking away from.
2. center type flow-guiding radiation device as claimed in claim 1 is characterized in that:
This superthermal conduction assembly comprises that the chassis on this heat source, that can be sticked hangs down and be located at heat extraction unit on this chassis end face, and a superthermal conduction cavity that is defined by this chassis and this heat extraction unit matching.
3. center type flow-guiding radiation device as claimed in claim 2 is characterized in that: this heat extraction unit has a thermal column that hangs down and be located at this chassis end face and can be located at its outer circumferential side for this fin spacer ring.
4. center type flow-guiding radiation device as claimed in claim 3 is characterized in that:
This chassis has a kerve that is recessed to form from its end face, and this thermal column has the heat extraction groove of a pair of kerve that should the chassis, and this superthermal conduction cavity is to be coated by this kerve and this heat extraction groove to define.
5. center type flow-guiding radiation device as claimed in claim 2 is characterized in that:
Fill by leading adiabator in this superthermal conduction cavity and organized the compound that constitutes.
6. center type flow-guiding radiation device as claimed in claim 2 is characterized in that:
The internal face of this superthermal conduction cavity is coated with one and is organized the compound that constitutes by leading adiabator.
7. center type flow-guiding radiation device as claimed in claim 2 is characterized in that:
This superthermal conduction cavity is a vacuum super thermal conduction cavity.
8. center type flow-guiding radiation device as claimed in claim 7 is characterized in that:
This superthermal conduction chamber fills is led adiabator.
9. center type flow-guiding radiation device as claimed in claim 2 is characterized in that:
The chassis of this superthermal conduction assembly, heat extraction unit, fin and shell body are one-body molded, and the inner hollow cavity that is interconnected that forms of this chassis, heat extraction unit and this fin.
10. center type flow-guiding radiation device as claimed in claim 2 is characterized in that:
The chassis of this superthermal conduction assembly, this heat extraction unit and this fin are one-body molded, and the inner hollow cavity that is interconnected that forms of three.
11. center type flow-guiding radiation device as claimed in claim 2 is characterized in that:
The chassis of this superthermal conduction assembly and this heat extraction unit are one-body molded.
12. center type flow-guiding radiation device as claimed in claim 3 is characterized in that:
The thermal column of this heat extraction unit and this fin are one-body molded.
13. center type flow-guiding radiation device as claimed in claim 1 is characterized in that:
This superthermal conduction assembly comprises chassis, a vertical heat extraction unit that is located on this chassis end face that can be sticked on this heat source, and this heat extraction unit has a thermal column that hangs down and be located at this chassis end face and can be located at its outer circumferential side for this fin spacer ring.
14. center type flow-guiding radiation device as claimed in claim 13 is characterized in that:
This chassis has at least one bottom outlet that is recessed to form from its end face, and this thermal column has the louvre of the bottom outlet that at least one pair of should the chassis.
15. center type flow-guiding radiation device as claimed in claim 14 is characterized in that:
Also comprise at least one by this chassis bottom outlet and the louvre of this thermal column coat the accommodation space that defines.
16. center type flow-guiding radiation device as claimed in claim 15 is characterized in that:
Fill in this accommodation space by leading adiabator and organized the compound that constitutes.
17. center type flow-guiding radiation device as claimed in claim 15 is characterized in that:
The internal face of this accommodation space is coated with one and is organized the compound that constitutes by leading adiabator.
18. center type flow-guiding radiation device as claimed in claim 15 is characterized in that:
This accommodation space is a vacuum accommodation space.
19. center type flow-guiding radiation device as claimed in claim 18 is characterized in that:
This accommodation space is filled with leads adiabator.
20. center type flow-guiding radiation device as claimed in claim 15 is characterized in that:
Also comprise at least one heat conducting body that is installed in this accommodation space.
21. center type flow-guiding radiation device as claimed in claim 20 is characterized in that:
This heat conducting body is a superconduction rod.
22. center type flow-guiding radiation device as claimed in claim 20 is characterized in that:
This heat conducting body is a heat pipe.
23. center type flow-guiding radiation device as claimed in claim 20 is characterized in that:
Also comprise the heat-conducting cream that applies this heat conducting body outer circumferential side.
24. center type flow-guiding radiation device as claimed in claim 13 is characterized in that:
The chassis of this superthermal conduction assembly, this heat extraction unit, this fin and shell body are one-body molded, and the inner hollow cavity that is interconnected that forms of three.
25. center type flow-guiding radiation device as claimed in claim 13 is characterized in that:
The thermal column of the chassis of this superthermal conduction assembly, this heat extraction unit and this fin are one-body molded, and the inner hollow cavity that is interconnected that forms of three.
26. center type flow-guiding radiation device as claimed in claim 13 is characterized in that:
The chassis of this superthermal conduction assembly and this heat extraction unit are one-body molded.
27. center type flow-guiding radiation device as claimed in claim 13 is characterized in that:
The thermal column of this heat extraction unit and this fin are one-body molded.
28. center type flow-guiding radiation device as claimed in claim 3 is characterized in that:
Also comprise a thermoelectric generator, the position of this thermoelectric generator makes its high temperature surface become thermo-contact with the thermal column top upper surface of this cooling mechanism, the low temperature apparent surface of this thermoelectric generator then becomes thermo-contact with the basal surface of a fin, and this thermoelectric generator connects the fan of the fan of this fin top via couple of conductor.
29. center type flow-guiding radiation device as claimed in claim 13 is characterized in that:
Also comprise a thermoelectric generator, the position of this thermoelectric generator makes its high temperature surface become thermo-contact with the thermal column top upper surface of this cooling mechanism, the low temperature apparent surface of this thermoelectric generator then becomes thermo-contact with the basal surface of a fin, and this thermoelectric generator connects the fan of the fan of this fin top via couple of conductor.
30. center type flow-guiding radiation device as claimed in claim 2 is characterized in that:
This chassis end face is to be the curved arc shape that raises up, and each fin has a warm portion that leads that is connected on this chassis end face, and this is led the concave arc shape bottom space that the collocation of warm portion defines and just overlaps mutually with the top convex arc shaped on this chassis.
31. center type flow-guiding radiation device as claimed in claim 13 is characterized in that:
This chassis end face is to be the curved arc shape that raises up, and each fin has a warm portion that leads that can be connected on this chassis end face, and this is led the concave arc shape bottom space that the collocation of warm portion defines and just overlaps mutually with the top convex arc shaped on this chassis.
32. center type flow-guiding radiation device as claimed in claim 1 is characterized in that:
This fan is an induced draft fan mechanism.
33. center type flow-guiding radiation device as claimed in claim 1 is characterized in that:
All sides of this fin are coated with one and are organized the compound that constitutes by leading adiabator.
CNB021526397A 2002-11-26 2002-11-26 Central type flow guiding heat radiation device Expired - Fee Related CN100341144C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB021526397A CN100341144C (en) 2002-11-26 2002-11-26 Central type flow guiding heat radiation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB021526397A CN100341144C (en) 2002-11-26 2002-11-26 Central type flow guiding heat radiation device

Publications (2)

Publication Number Publication Date
CN1503356A true CN1503356A (en) 2004-06-09
CN100341144C CN100341144C (en) 2007-10-03

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7623348B2 (en) 2006-10-02 2009-11-24 Nidec Corporation Heat sink and cooling apparatus
CN101754658A (en) * 2008-12-11 2010-06-23 富准精密工业(深圳)有限公司 Radiating device
CN101898393A (en) * 2009-05-25 2010-12-01 鸿富锦精密工业(深圳)有限公司 Mold
CN103673717A (en) * 2013-12-18 2014-03-26 杭州汉惠通用设备有限公司 Inner guide type abnormal-shaped heat exchange pipe
CN107252751A (en) * 2017-01-12 2017-10-17 广州尚儒自控系统工程有限公司 A kind of bridge mopping equipment
CN110401126A (en) * 2019-08-20 2019-11-01 国家电网有限公司 Substation's GIS Current Transformer Secondary drives damp case
CN110416896A (en) * 2019-08-20 2019-11-05 国家电网有限公司 A kind of outside transformer substation bin automatic intelligent open air moisture-reducing device
CN110416895A (en) * 2019-08-20 2019-11-05 国家电网有限公司 A kind of damp case of substation's GIS device secondary circuit intelligence drive

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DE20105040U1 (en) * 2001-03-22 2001-06-13 Schmucker Hubert Cooler for electrical components
CN2514494Y (en) * 2002-02-01 2002-10-02 王勤文 Rotary colling device for central microprocessor
CN2599750Y (en) * 2002-11-26 2004-01-14 诺亚公司 Central flow-guiding radiator

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7623348B2 (en) 2006-10-02 2009-11-24 Nidec Corporation Heat sink and cooling apparatus
CN101754658A (en) * 2008-12-11 2010-06-23 富准精密工业(深圳)有限公司 Radiating device
CN101754658B (en) * 2008-12-11 2013-06-05 富准精密工业(深圳)有限公司 Radiating device
CN101898393A (en) * 2009-05-25 2010-12-01 鸿富锦精密工业(深圳)有限公司 Mold
CN101898393B (en) * 2009-05-25 2013-10-09 鸿富锦精密工业(深圳)有限公司 Mold
CN103673717A (en) * 2013-12-18 2014-03-26 杭州汉惠通用设备有限公司 Inner guide type abnormal-shaped heat exchange pipe
CN107252751A (en) * 2017-01-12 2017-10-17 广州尚儒自控系统工程有限公司 A kind of bridge mopping equipment
CN110401126A (en) * 2019-08-20 2019-11-01 国家电网有限公司 Substation's GIS Current Transformer Secondary drives damp case
CN110416896A (en) * 2019-08-20 2019-11-05 国家电网有限公司 A kind of outside transformer substation bin automatic intelligent open air moisture-reducing device
CN110416895A (en) * 2019-08-20 2019-11-05 国家电网有限公司 A kind of damp case of substation's GIS device secondary circuit intelligence drive
CN110416896B (en) * 2019-08-20 2023-06-23 国家电网有限公司 Intelligent full-automatic outdoor moisture removing device for outdoor cabinet of transformer substation
CN110401126B (en) * 2019-08-20 2023-08-29 国家电网有限公司 Secondary moisture-removing box for GIS current transformer of transformer substation
CN110416895B (en) * 2019-08-20 2023-08-29 国家电网有限公司 Intelligent moisture removal box for secondary circuit of GIS equipment of transformer substation

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