CN207486724U - A kind of Novel LED light heat-dissipating casing structure - Google Patents

A kind of Novel LED light heat-dissipating casing structure Download PDF

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Publication number
CN207486724U
CN207486724U CN201721636048.7U CN201721636048U CN207486724U CN 207486724 U CN207486724 U CN 207486724U CN 201721636048 U CN201721636048 U CN 201721636048U CN 207486724 U CN207486724 U CN 207486724U
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CN
China
Prior art keywords
radiator shell
metal substrate
dissipating casing
led light
novel led
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201721636048.7U
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Chinese (zh)
Inventor
石峰
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Dongguan Yifeng Plastic Co Ltd
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Dongguan Yifeng Plastic Co Ltd
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Publication date
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Priority to CN201721636048.7U priority Critical patent/CN207486724U/en
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Publication of CN207486724U publication Critical patent/CN207486724U/en
Expired - Fee Related legal-status Critical Current
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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model discloses a kind of Novel LED light heat-dissipating casing structures,Including radiator shell and aluminum metal plate,The aluminum metal plate is embedded on the inner wall of radiator shell,The upper surface of the aluminum metal plate is symmetrically provided with multiple micro-channels,And multiple threaded holes are also installed on radiator shell upper surface,The lower surface of the radiator shell is also equipped with metal substrate,The outer surface of the radiator shell and metal substrate is closely connected by sealing strip,The front of the metal substrate is provided with LED chip slot,The front of the metal substrate is also installed with copper post pin,The upper surface of the metal substrate is also installed with electric source line interface,In a manner that metal pilum is combined with polymer heat-dissipating casing,Chip and lamp locker can be reduced connects installation and tactile thermal resistance,Cause entire radiating element small volume,And heatsink fins on piece has installed micro-channel structure additional,Increase heat dissipation area,Improve heat-sinking capability.

Description

A kind of Novel LED light heat-dissipating casing structure
Technical field
The utility model is related to heat-dissipating casing technical field of structures, specially a kind of Novel LED light heat-dissipating casing structure.
Background technology
Under global energy anxiety, the overall background for advocating green sustainable energy, under high-power LED light source must can become The ideal solid-state energy-conserving light source of a generation is used especially in conjunction with solar panel or electromagnetic induction solar panel, extensive The great competitiveness in the fields such as the street lighting used, Landscape Lighting is following green energy resource most with prospects, high-power The semiconductor devices such as LED chip play huge effect in all trades and professions, while also have become next-generation novel height Power electronic device.For the work that these high power devices is enable to stablize, it is also necessary to overcome many difficulties.It is wherein main A problem precisely due to device inside high temperature caused by more and more big heat flow density.Excessively high internal temperature not only influences The working performance of equipment can also threaten the stability of equipment.
The material used in existing radiator is the very high metal or ceramics of thermal conductivity, them can be made full use of to lead Hot coefficient is high, the advantages of so as to improve heat exchanger efficiency.But under current processing technology and lamp package technology, metal dissipates What hot device was done cannot be too big, and for fear of the limitation of metalworking technology, although above-mentioned processing technology can be relied on to realize micro- knot The machine-shaping of structure, but high processing costs and the big grade of difficulty all hinder its development.And if in order to increase heat dissipation area And radiator is made big, and can not be encapsulated into lamps and lanterns.
Invention content
In order to overcome the shortcomings of prior art, the utility model provides a kind of Novel LED light heat-dissipating casing structure, adopts The mode combined with metal pilum with polymer heat-dissipating casing, it is possible to reduce chip and lamp locker connect installation and tactile thermal resistance, make Entire radiating element small volume is obtained, and heatsink fins on piece has installed micro-channel structure additional, increases heat dissipation area, improves scattered Thermal energy power can effectively solve the problem that the problem of background technology proposes.
Technical solution is used by the utility model solves its technical problem:A kind of Novel LED light heat-dissipating casing structure, Including radiator shell and aluminum metal plate, the aluminum metal plate is embedded on the inner wall of radiator shell, the aluminum gold The upper surface for belonging to plate is symmetrically provided with multiple micro-channels, and multiple spiral shells are also installed on radiator shell upper surface Pit, the lower surface of the radiator shell are also equipped with the outer surface of metal substrate, the radiator shell and metal substrate It is closely connected by sealing strip, the front of the metal substrate is provided with LED chip slot, and the front of the metal substrate is also solid Dingan County is equipped with copper post pin, and the upper surface of the copper post pin is provided with rubber connector, and the upper surface of the metal substrate is also It is installed with electric source line interface.
As a kind of preferred technical solution of the utility model, the aluminum metal plate both ends are additionally provided with high heat conduction PPS Material layer.
As a kind of preferred technical solution of the utility model, the quantity of the threaded hole is four, and four threaded holes It is symmetrically distributed on the upper surface of radiator shell.
As a kind of preferred technical solution of the utility model, the lower surface of the aluminum metal plate is also welded with metalwork Connection pillar.
As a kind of preferred technical solution of the utility model, outside the lower surface of the metalwork connection pillar and radiator The inner wall of shell is fixedly connected.
As a kind of preferred technical solution of the utility model, the spacing between the adjacent micro-channel is set as 5mm.
As a kind of preferred technical solution of the utility model, it is additionally provided on the front of the high heat conduction PPS material layers Insulate connecting interface.
Compared with prior art, the beneficial effects of the utility model are:
(1)The heat-dissipating casing of the utility model uses high polymer material, will use high polymer micro injection molding technology conduct The advantages of main processing method, the method is can be molded more complicated structure, can large batch of continuous production, production Process automation degree is high, and molding structure is accurate, can be molded fine feature or structure etc..It, will in process of injection molding It is injected together using chip pilum as the metal insert of injection process so that high polymer is wrapped in metal watch in molten condition The machine-shaping of lamp outer casing entirety is completed in face in common cooling.During this, the contact position of metal and polymer will not have The presence of air along with increased contact area, can reduce the heat transfer resistance at this, improve heat conduction efficiency;
(2)The utility model aluminum metal plate micro-channel, the cross sectional shape of micro-channel can be fabricated to it is variously-shaped, but The mobility and fillibility of injection material are allowed for, the shape of micro-structure is designed using semicircular structure, is effectively improved Heat dissipation area, and the addition of micro-channel also reduces the thickness of fin to a certain extent, is also beneficial to distributing for heat.
(3)The utility model uses the form that metallic aluminium is combined with plastics, using the processing technology of integral molded plastic, metal An internal inserts of the aluminium as injection member, total are molded simultaneously, have high precision machining, volume production rate is high, can shape multiple The advantages that miscellaneous structure and small structure.
Description of the drawings
Fig. 1 is the overall structure diagram of the utility model;
Fig. 2 is the aluminum metal plate structure schematic diagram of the utility model;
Fig. 3 is the metal substrate structure schematic diagram of the utility model.
In figure:1- radiator shells;2- threaded holes;3- aluminum metal plates;4- micro-channels;5- high heat conduction PPS material layers;6- Insulate connecting interface;7- metal substrates;8- sealing strips;9- metalwork connection pillars;10- electric source line interfaces;11- copper post pins; 12- rubber connectors;13-LED chip pockets.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work All other embodiments obtained shall fall within the protection scope of the present invention.
The explanation of following embodiment is refer to the attached drawing, can be to the particular implementation implemented to example the utility model Example.The direction and position term that the utility model is previously mentioned, for example, " on ", " in ", " under ", "front", "rear", "left", "right", " It is interior ", " outer ", " side " etc., be only the direction and position with reference to annexed drawings.Therefore, the direction and position term used is to use To illustrate and understand the utility model rather than to limit the utility model.
Embodiment:
As shown in figures 1 and 3, the utility model provides a kind of Novel LED light heat-dissipating casing structure, including radiator outside Shell 1 and aluminum metal plate 3, the aluminum metal plate 3 is embedded on the inner wall of radiator shell 1, using radiator shell 1 and aluminium The compound heat spreader structures of matter metallic plate 3 can make up the relatively low thermal conductivity of plastics, the upper table of the aluminum metal plate 3 Face is symmetrically provided with multiple micro-channels 4, and 3 both ends of aluminum metal plate are additionally provided with high heat conduction PPS material layers 5, described Insulation connecting interface 6, and the also fixed peace on 1 upper surface of radiator shell are additionally provided on the front of high heat conduction PPS material layers 5 Equipped with multiple threaded holes 2, the quantity of the threaded hole 2 is four, and four threaded holes 2 are symmetrically distributed in radiator shell 1 Upper surface on, the lower surface of the radiator shell 1 is also equipped with metal substrate 7, the radiator shell 1 and metal substrate 7 outer surface is closely connected by sealing strip 8, and the front of the metal substrate 7 is provided with LED chip slot 13, the metal The front of substrate 7 is also installed with copper post pin 11, and the upper surface of the copper post pin 11 is provided with rubber connector 12, institute The upper surface for stating metal substrate 7 is also installed with electric source line interface 10, and the radiator is by radiator shell 1 and metal substrate The main element of about 7 two layers of composition, heat conduction and heat dissipation is micro-channel 4.It needs to do metal substrate 7 certain add during installation Work is installed air-tight interfaces, is connected between two layers of cooling fin with sealing strip 8, blending bolt fastening.
As shown in Fig. 2, the lower surface of the aluminum metal plate 3 is also welded with metalwork connection pillar 9, the metalwork connects The lower surface for connecing pillar 9 is fixedly connected with the inner wall of radiator shell 1, and the spacing between the adjacent micro-channel 4 is set as 5mm, the height growth of institute's micro-channel 4 can actually reduce the junction temperature of chip, but with the growth of fin, the degree of junction temperature reduction Number be gradually reduced, heat-sinking capability raising be not it is obvious that and long fin can cause heat that cannot timely be transmitted to The end of fin influences to radiate, and can increase the volume of lamps and lanterns with duration fin.The length of general fin is close to the length of lamps and lanterns matrix Heat dissipation effect is preferable when spending.
In conclusion the utility model is mainly characterized by:
(1)The heat-dissipating casing of the utility model uses high polymer material, will use high polymer micro injection molding technology conduct The advantages of main processing method, the method is can be molded more complicated structure, can large batch of continuous production, production Process automation degree is high, and molding structure is accurate, can be molded fine feature or structure etc..It, will in process of injection molding It is injected together using chip pilum as the metal insert of injection process so that high polymer is wrapped in metal watch in molten condition The machine-shaping of lamp outer casing entirety is completed in face in common cooling.During this, the contact position of metal and polymer will not have The presence of air along with increased contact area, can reduce the heat transfer resistance at this, improve heat conduction efficiency;
(2)The utility model aluminum metal plate micro-channel, the cross sectional shape of micro-channel can be fabricated to it is variously-shaped, but The mobility and fillibility of injection material are allowed for, the shape of micro-structure is designed using semicircular structure, is effectively improved Heat dissipation area, and the addition of micro-channel also reduces the thickness of fin to a certain extent, is also beneficial to distributing for heat.
(3)The utility model uses the form that metallic aluminium is combined with plastics, using the processing technology of integral molded plastic, metal An internal inserts of the aluminium as injection member, total are molded simultaneously, have high precision machining, volume production rate is high, can shape multiple The advantages that miscellaneous structure and small structure.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned exemplary embodiment, and And in the case of the spirit or essential attributes without departing substantially from the utility model, it can realize that this practicality is new in other specific forms Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this practicality is new The range of type is indicated by the appended claims rather than the foregoing description, it is intended that by containing in the equivalent requirements of the claims is fallen All changes in justice and range are embraced therein.Any reference numeral in claim should not be considered as limitation Involved claim.

Claims (7)

1. a kind of Novel LED light heat-dissipating casing structure, it is characterised in that:Including radiator shell(1)With aluminum metal plate(3), The aluminum metal plate(3)It is embedded in radiator shell(1)Inner wall on, the aluminum metal plate(3)Upper surface it is uniformly right Title is provided with multiple micro-channels(4), and in radiator shell(1)Multiple threaded holes are also installed on upper surface(2), it is described Radiator shell(1)Lower surface be also equipped with metal substrate(7), the radiator shell(1)With metal substrate(7)Appearance Face passes through sealing strip(8)Close connection, the metal substrate(7)Front be provided with LED chip slot(13), the Metal Substrate Plate(7)Front be also installed with copper post pin(11), the copper post pin(11)Upper surface be provided with rubber connector (12), the metal substrate(7)Upper surface be also installed with electric source line interface(10).
2. a kind of Novel LED light heat-dissipating casing structure according to claim 1, it is characterised in that:The aluminum metal plate (3)Both ends are additionally provided with high heat conduction PPS material layers(5).
3. a kind of Novel LED light heat-dissipating casing structure according to claim 1, it is characterised in that:The threaded hole(2)'s Quantity is four, and four threaded holes(2)It is symmetrically distributed in radiator shell(1)Upper surface on.
4. a kind of Novel LED light heat-dissipating casing structure according to claim 1, it is characterised in that:The aluminum metal plate (3)Lower surface be also welded with metalwork connection pillar(9).
5. a kind of Novel LED light heat-dissipating casing structure according to claim 4, it is characterised in that:The metalwork connection Pillar(9)Lower surface and radiator shell(1)Inner wall be fixedly connected.
6. a kind of Novel LED light heat-dissipating casing structure according to claim 1, it is characterised in that:The adjacent micro-channel (4)Between spacing be set as 5mm.
7. a kind of Novel LED light heat-dissipating casing structure according to claim 2, it is characterised in that:The high heat conduction PPS materials The bed of material(5)Front on be additionally provided with insulation connecting interface(6).
CN201721636048.7U 2017-11-30 2017-11-30 A kind of Novel LED light heat-dissipating casing structure Expired - Fee Related CN207486724U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721636048.7U CN207486724U (en) 2017-11-30 2017-11-30 A kind of Novel LED light heat-dissipating casing structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721636048.7U CN207486724U (en) 2017-11-30 2017-11-30 A kind of Novel LED light heat-dissipating casing structure

Publications (1)

Publication Number Publication Date
CN207486724U true CN207486724U (en) 2018-06-12

Family

ID=62472996

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721636048.7U Expired - Fee Related CN207486724U (en) 2017-11-30 2017-11-30 A kind of Novel LED light heat-dissipating casing structure

Country Status (1)

Country Link
CN (1) CN207486724U (en)

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CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20180612

Termination date: 20191130