JP2000236053A - Heat sink and mounting leg thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat sink and a mounting leg which can be efficiently recycled, because the leg for mounting the heat sink to a substrate can be removed readily from the groove part of the heat sink. SOLUTION: This leg part 6 for mounting a heat sink 1 having a groove part 9 to a substrate has a plate body 6a inserted in the groove part 9, protruding parts 6b which are provided on both sides of the plate body 6a and has a width between ends of both the protruding parts which are narrower than the width of the groove part 9 and claws 6c, which are provided on both sides of the plate body 6a and has a with between ends of both the pawls wider than the width of the groove part 9. A substrate mounting part 10 is provided for soldering to the substrate at the lower end part of the plate body 6a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink and a mounting leg for attaching the heat sink to a substrate. In particular, the present invention relates to a heat sink that can be efficiently recycled and its mounting leg.

[0002]

2. Description of the Related Art FIG. 4 is a perspective view showing a conventional heat radiating plate and a mounting leg for mounting the same on a substrate. FIG.
(A) is a top view of the attachment leg part shown in FIG.

The heat radiating plate 1 shown in FIG. 4 is manufactured by using an extruded aluminum material. The heat radiating plate 1 has a flat heat radiating plate main body 3, and a plurality of heat radiating fins 5 are formed on one main surface of the main body 3. A groove 9 is formed at one end of the main surface of the main body 3. The leg 7 is attached to the groove 9 by inserting the leg 7 into the groove 9 as shown by the arrow. An object to be cooled (not shown) such as a semiconductor element is fixed to the other main surface of the heat sink body 3 with screws (not shown) or the like.

The leg 7 is composed of a plate-like body 7a and a board mounting portion 11, as shown in FIG. The plate-like body 7a is provided with a claw 7b protruding in the width direction. These claws 7b are used to fix the leg 7 so that the leg 7 is caught in the groove 9 when the leg 7 is inserted into the groove 9 of the heat sink 1 so that the leg 7 does not fall out of the groove. The legs 7 are attached to the heat sink body 3 in this manner. The board mounting portion 11 is provided below the plate 7a, and the heat sink 1 is mounted on a printed board (not shown) by soldering the board mounting section 11 to a printed board.

FIG. 5B is a perspective view showing a mounting leg of another conventional heat sink. The leg 17 is a plate-like body 17.
a and the substrate mounting portion 11. Plate 17
a is provided with a claw portion 17b projecting in the thickness direction. These claw portions 17b are provided with the leg portions 1 in the groove portions 9 of the heat sink 1.
This is for fixing the leg 17 so that the leg 17 does not fall out of the groove when it is inserted. Also,
The board mounting part 11 is provided below the plate 17a.

[0006]

As described above, the heat radiating plate 1 is often made of aluminum having good heat conductivity and high heat radiating effect. On the other hand, the legs 7, 17 attached to the heat sink body 3 as soldering portions for mounting on a printed circuit board are often made of a metal other than aluminum, such as iron or silver top material. For this reason, in order to take out and recycle only aluminum from the heat sink 1, it is necessary to separate the heat sink 1 from the legs 7.

However, in the above-mentioned conventional heat radiating plate, the legs 7 and 17 are fixed to the heat radiating plate 1 by claw portions 7b and 17b. They are angled so that they face in the opposite direction. For this reason,
The claw portion is easy to insert into the groove portion, but once attached to the groove portion, it is difficult to remove the leg portion from the groove portion. Therefore, it is not easy to separate the radiator plate and the leg for recycling after mounting the radiator plate 1 on the printed circuit board by soldering the board mounting portion 11. That is,
It is difficult to extract only aluminum from the heat sink and efficiently recycle it.

The present invention has been made in view of the above circumstances, and an object of the present invention is to efficiently remove a leg for attaching a heat sink to a substrate from a groove of the heat sink. It is an object of the present invention to provide a recyclable heat sink and its mounting leg.

[0009]

In order to solve the above-mentioned problems, according to the present invention, there is provided a heat-radiating plate mounting leg for mounting a heat-radiating plate having a groove to a substrate.
A plate-like body to be inserted into the groove, a protrusion provided on both sides of the plate-like body, and a protrusion having a width between the tips of both protrusions smaller than the width of the groove; Claw portions provided on both sides of the claw portion, the claw portions having a width between the tips of both claw portions wider than the width of the groove portion. Also,
It is preferable to further include a board mounting portion provided at a lower end portion of the plate-shaped body for soldering to the board.

In the mounting leg of the radiator plate, the leg is pressed into the groove of the radiator plate, so that the leg can be fixed so as not to fall out of the groove by the claw. Then, the heat sink can be attached to the substrate by soldering the substrate and the substrate attachment portion. On the other hand, when removing the radiator plate from the substrate, the protrusion of the radiator plate can be deformed inward by tilting the groove of the radiator plate in a direction parallel to the main surface of the plate-like member so that one protrusion serves as a fulcrum. . Thereby, the holding force of the claw portion is lost, and the radiator plate can be easily removed from the substrate, and the radiator plate and the leg can be easily separated.

A heat sink according to the present invention comprises a heat sink body, a groove provided in the heat sink body, a plate inserted into the groove, and protrusions provided on both sides of the plate. And
A projection having a width between the tips of the projections narrower than the width of the groove, and a claw provided on both sides of the plate-like body, wherein the width between the tips of the claws wider than the width of the groove is provided. And a board attachment part provided at the lower end of the plate-shaped body for soldering to a board.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a radiator plate according to an embodiment of the present invention and a mounting leg for mounting the radiator plate on a substrate. FIG. 2 is a partial cross-sectional view showing a state in which a heat sink is mounted on a printed circuit board using the mounting legs according to the embodiment of the present invention.

The heat sink 1 shown in FIG. 1 is manufactured using an extruded aluminum material. The heat radiating plate 1 has a flat heat radiating plate main body 3, and a plurality of heat radiating fins 5 are formed on one main surface of the main body 3. A groove 9 is formed at one end of the main surface of the main body 3. The leg 6 is attached to the groove 9 by inserting the leg 6 into the groove 9 as shown by the arrow. The legs 6 are formed using a plated steel plate of zinc or the like which is inexpensive and has good solderability. An object to be cooled (not shown) such as a semiconductor element is fixed to the other main surface of the heat sink body 3 with screws (not shown) or the like.

As shown in FIG. 2, the leg 6 is
a and a substrate mounting portion 10 provided thereunder. The plate-like body 6a has two protruding sides in the width direction.
One protrusion 6b and two claws 6c are provided.
The width of the two protrusions 6b is formed slightly smaller than the width 9a of the groove 9, and the width of the two claws 6c is formed slightly larger than the width 9a of the groove 9. The reason why the width of the claw portion 6c is slightly larger than the groove width 9a is that when the leg portion 6 is inserted into the groove portion 9, the leg portion does not come off from the groove portion 9 due to the elasticity of the steel plate claw portion 6c. This is for securing the pull-out strength.

Next, a method of attaching the heat sink to the printed circuit board will be described. As shown in FIG.
The leg 6 as shown by the arrow. Thereby, as shown in FIG. 2, the leg 6 is attached to the groove 9 and the leg 6 is formed by the claw 6c having a width slightly larger than the groove width 9a.
It is fixed so that it does not fall out. Next, the printed circuit board 1
The object to be cooled (not shown) mounted on the heat sink 2 is fixed to the other main surface of the heat sink body 3 with screws or the like.

Thereafter, the board mounting portion 10 of the leg is inserted into a hole provided in the printed circuit board 12, and the board mounting portion 10 is fixed to the printed circuit board 12 by the solder 14, and the radiator plate 1 is fixed by the leg 6. It is attached to the printed circuit board 12.

Next, a method of removing the heat sink 1 from the printed circuit board 12 and separating the heat sink 1 from the leg 6 will be described. FIG. 3 is a cross-sectional view for explaining a procedure for removing the heat sink from the printed circuit board.

First, the object to be cooled, such as a semiconductor element, is placed on the heat sink 1.
Then, as shown in FIG. 3, the groove 9 of the heat sink 1 is turned down in the direction of the arrow. Thereby, the one claw 6c is deformed inward with the portion where the one protrusion 6b is in contact with the inner wall of the groove 9 as a fulcrum. Next, the groove 9 of the heat sink 1 is tilted in the direction opposite to the arrow, so that the other protrusion (not shown) is in contact with the inner wall of the groove so that the other claw (not shown) faces inward. Deform. By deforming the claw portion in this manner, the holding force of the claw portion is eliminated, and as a result, the radiator plate 1 can be easily removed from the printed circuit board 12, and the radiator plate 1 and the leg portion 6 can be easily separated. Can be.

According to the above embodiment, two projections 6b having a width slightly smaller than the groove width 9a are provided on the plate-like body 13 of the leg 6 and two claws having a width slightly larger than the groove width 9a. A portion 6c is provided. As a result, the heat sink 1 can be easily detached from the printed circuit board 12 by separating the heat sink 1 and the leg portions 6 as described above. In this case, there is no need to use a dedicated tool and it is necessary to remove the solder 14. Nor. Therefore, conventionally, it was difficult to recycle the radiator plate because the legs were not easily separated. However, in the present embodiment, the legs 6 can be easily removed from the radiator plate 1, so that efficient recycling can be achieved. Becomes possible.

Further, since the radiator plate 1 removed from the printed circuit board 12 is made of only aluminum material, there is a great cost advantage in recycling. Further, since the method of assembling the heat sink 1 is the same as that of the conventional heat sink, there is no need to change the equipment and process.

It should be noted that the present invention is not limited to the above embodiment, but can be implemented with various modifications.
In the present embodiment, the leg portion 6 having the two claw portions 6c is used. However, depending on the size of the radiator plate, it may be necessary to improve the holding force of the radiator plate by the claw portion. It is also possible to provide one or more similar two claws on the upper or lower part of the projection 6b.

[0022]

As described above, according to the present invention, there are provided a plate-shaped member to be inserted into a groove, and two protrusions provided on both sides of the plate-shaped member, the protrusions being narrower than the width of the groove. And a claw provided on both sides of the plate-like body, the claw having a width between the tips of both claws wider than the width of the groove. . Therefore, it is possible to easily remove the leg for attaching the heat sink to the substrate from the groove of the heat sink, and to provide a heat sink and its attachment leg that can be efficiently recycled.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a heat sink according to an embodiment of the present invention and an attachment leg for attaching the heat sink to a substrate.

FIG. 2 is a partial cross-sectional view showing a state in which a heat sink is mounted on a printed circuit board using the mounting legs according to the embodiment of the present invention.

FIG. 3 is a cross-sectional view for explaining a procedure for removing a heat sink from a printed circuit board.

FIG. 4 is a perspective view showing a conventional heat radiating plate and a mounting leg for mounting the same to a substrate.

5 (a) is a plan view of the mounting leg shown in FIG. 4, and FIG. 5 (b) is a perspective view showing another conventional mounting plate of a heat sink.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Heat sink, 3 ... Heat sink body, 5 ... Heat sink, 6, 7
... Legs, 6a, 7a. Plate, 6b.
b: claw portion, 9: groove portion, 9a: width of groove portion, 10: board mounting portion, 11: leg portion, 12: printed circuit board, 14: solder, 1
7: leg, 17a: plate, 17b: claw.

Claims (3)

[Claims] 1. A mounting leg for attaching a heat sink having a groove to a substrate, comprising: a plate-like body inserted into the groove; and projections provided on both sides of the plate-like body. A projection having a width between the tips of the projections smaller than the width, and a claw provided on both sides of the plate-like body, the claw having a width between the tips of the two claws wider than the width of the groove. And a mounting part for a heat sink, comprising: 2. A mounting leg for a heat sink according to claim 1, further comprising a board mounting portion provided at a lower end portion of said plate-shaped body for soldering to said board. 3. A radiator body, a groove provided in the radiator body, a plate inserted into the groove, and protrusions provided on both sides of the plate, wherein the groove is provided. And a claw provided on both sides of the plate-shaped body, wherein the claw provided on both sides of the plate-like body has a width between the crests of the claw which is wider than the width of the groove. A heat radiating plate comprising: a claw portion; and a substrate mounting portion provided at a lower end portion of the plate-shaped body for soldering to a substrate.