KR950034716A - Method for manufacturing heat sinks, devices for heat sinks, and heat-generating parts cooling devices - Google Patents

Method for manufacturing heat sinks, devices for heat sinks, and heat-generating parts cooling devices Download PDF

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Publication number
KR950034716A
KR950034716A KR1019950010255A KR19950010255A KR950034716A KR 950034716 A KR950034716 A KR 950034716A KR 1019950010255 A KR1019950010255 A KR 1019950010255A KR 19950010255 A KR19950010255 A KR 19950010255A KR 950034716 A KR950034716 A KR 950034716A
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KR
South Korea
Prior art keywords
heat
sheet
rectangular cross
plane
actual
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KR1019950010255A
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Korean (ko)
Inventor
캄 리트-얀
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엠. 케이. 영
에이티앤드티 코포레이션
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Publication of KR950034716A publication Critical patent/KR950034716A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

본 발명은 적은 비용을 갖는 매우 효과적인 히트 싱크를 형성하기 위해 제조된 판금을 이용한 신규 방법 및 장치를 개시한다. 천공 및 절곡을 포함하는 제조 기법은 실질적으로 직사각형 횡단면도를 포함한 하나 이상의 튜브를 생성하기 위해 사용된다. 직사각형 단면 튜브는 공통 베이스를 공유한다. 본 발명의 특별한 예시적인 예에 있어서, 다수의 실질적인 직사각형 단면 튜브가 정렬되어 판금 히트 싱크가 다수의 열-발생 및 다른 부품을 포함하는 회로 팩과 인터에피스할 수 있다.The present invention discloses a novel method and apparatus using sheet metal fabricated to form highly effective heat sinks with low cost. Manufacturing techniques, including perforation and bending, are used to create one or more tubes including substantially rectangular cross sectional views. Rectangular cross-sectional tubes share a common base. In a particular illustrative example of the present invention, a plurality of substantially rectangular cross-sectional tubes may be aligned so that the sheet metal heat sink can interfacing with a circuit pack comprising a plurality of heat-generating and other components.

Description

히트 싱크 제조방법, 히트 싱크 용도의 장치 및 열-발생 부품 냉각 장치Method for manufacturing heat sinks, devices for heat sinks and cooling devices for heat-generating parts

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 본 발명에 따라서 예시적으로 제조된 판금 히트 싱크를 도시하는 도면, 제4도는 제2도에 도시된 회로 팩과 조합으로 제3도에 도시된 예시적으로 제조된 판금 히트 싱크를 도시하는 도면, 제5도는 히트 싱크의 제조 중간 단계에서 제3도에 도시된 히트 싱크의 평면도, 제6,7 및 8도는 히트 싱크 제조의 여러 단계에서 제3도에 도시된 히트 싱크의 도면.FIG. 3 shows an exemplary sheet metal heat sink manufactured according to the present invention, and FIG. 4 shows an exemplary manufactured sheet metal heat sink shown in FIG. 3 in combination with the circuit pack shown in FIG. FIG. 5 is a plan view of the heat sink shown in FIG. 3 at an intermediate stage of the manufacture of the heat sink, and FIGS. 6, 7 and 8 are views of the heat sink shown in FIG. 3 at various stages of the heat sink manufacture.

Claims (17)

히트 싱크 제조 방법에 있어서, 평탄한 시트(flat sheet)를 정의하는 기준면에 실질적으로 평탄한 판금을 제공하는 단계; 상기 기준면에 실질적으로 직각인 제1실제 평면을 생성하기 위해 상기 시트의 방열부(a heat dissipative portion)를 절곡하는 단계; 상기 제1실제 평면에 실질적으로 직각이며 상기 기준면에 실질적으로 직각인 제2실제 평면을 생성하기 위해 상기 방열부를 절곡하는 단계와, 실제 직사각형 단면 튜브를 생성하기 위해 상기 제2실제 평면에 실질적으로 직각이며 상기 기준면에 실질적으로 직각인 제3실제 평면을 생성하기 위해 상기 방열부를 절곡하는 단계를 포함하는 히트 싱크 제조방법.A heat sink manufacturing method, comprising: providing a substantially flat sheet metal at a reference plane defining a flat sheet; Bending a heat dissipative portion of the sheet to create a first actual plane substantially perpendicular to the reference plane; Bending the heat dissipation portion to create a second actual plane that is substantially perpendicular to the first real plane and substantially perpendicular to the reference plane, and substantially perpendicular to the second real plane to create an actual rectangular cross-sectional tube And bending the heat dissipation portion to create a third actual plane that is substantially perpendicular to the reference plane. 제1항에 있어서, 상기 시트는 제1항의 단계에 따라 직사각형 단면 튜브로 각각 절곡할 수 있는 다수의 방열부를 포함하는 히트 싱크 제조방법.The method of claim 1, wherein the sheet comprises a plurality of heat dissipable portions each of which can be bent into a rectangular cross-sectional tube according to the step of claim 1. 제2항에 있어서, 적어도 하나의 추가적은 실제 직사각형 단면 튜브를 생성하기 위해 상기 시트의 적어도 하나의 절곡되지 않은 방열부에 대해 제1항의 상기 3차례의 절곡 단계를 반복하는 단계를 더 포함하는 히트 싱크 제조방법.The heat treatment of claim 2, further comprising repeating the three bending steps of claim 1 for at least one unbent heat dissipation of the sheet to produce at least one additional actual rectangular cross-sectional tube. Sink manufacturing method. 제2항에 있어서, 상기 다수의 방열부는 적어도 하나의 천공 단계에 의해 형성되는 히트 싱크 제조방법.The method of claim 2, wherein the plurality of heat sinks are formed by at least one drilling step. 제2항에 있어서, 상기 다수의 방열부는 적어도 하나의 절단 단계에 의해 형성되는 히트 싱크 제조방법.The method of claim 2, wherein the plurality of heat dissipating parts are formed by at least one cutting step. 제1항에 있어서, 상기 판금은 높은 열전도성을 갖는 합금으로 이루어진 히트 싱크 제조방법.The method of claim 1, wherein the sheet metal is made of an alloy having high thermal conductivity. 제1항에 있어서, 상기 시트는 디바이스의 통과를 위해 적어도 하나의 개구를 포함하는 히트 싱크 제조방법.The method of claim 1, wherein the sheet includes at least one opening for passage of the device. 제2항에 있어서, 상기 실질적으로 직사각형 단면 튜브내 상기 제1실제 평면을 갖는 실질적으로 동일 평면인 실제 평면을 생성하기 위해 상기 시트의 적어도 하나의 절곡되지 않은 방열부에 관해 제1항의 상기 제1절곡 단계를 반복하는 단계를 더 포함하는 히트 싱크 제조방법.3. The method of claim 1, wherein the first of the first aspects of the sheet in relation to at least one unbent heat dissipation of the sheet to create a substantially coplanar real plane with the first real plane in the substantially rectangular cross-sectional tube. Heat sink manufacturing method further comprising the step of repeating the bending step. 평탄한 시트가 기준면을 정의하는 실질적을 평탄한 판금; 상기 기준면에 실질적으로 직각인 실제 평면을 포함하는 상기 시트의 제1방열부; 상기 제1방열부에 실질적으로 직각이며, 상기 기준면에 실질적으로 직각인 실제 평면을 포함하는 상기 시트의 제2방열부와, 실질적으로 직사각형 단면 튜브를 생성하기 위해 상기 제2방열부에 실질적으로 직각이며, 상기 기준면에 실질적으로 직각인 실제 평면을 포함하는 상기 시트의 제3방열부를 포함하는 히트 싱크 용도의 장치.A substantially flat sheet metal in which the flat sheet defines a reference plane; A first heat radiation portion of the sheet including an actual plane substantially perpendicular to the reference plane; A second heat dissipation portion of the sheet substantially perpendicular to the first heat dissipation portion, the actual heat dissipation portion including the actual plane substantially perpendicular to the reference plane, and substantially perpendicular to the second heat dissipation portion to create a substantially rectangular cross-sectional tube. And a third heat dissipation portion of the sheet including an actual plane substantially perpendicular to the reference plane. 제9항에 있어서, 상기 시트는 제1항의 상기 단계에 따라 실제 직사각형 단면 튜브로 각각 절곡될 수 있는 다수의 방열부를 포함하는 히트 싱크 용도의 장치.10. The apparatus of claim 9, wherein the sheet includes a plurality of heat sinks that can each be bent into an actual rectangular cross-sectional tube according to the step of claim 1. 제10항에 있어서, 적어도 하나의 추가적인 직사각형 단면 튜브를 더 포함하는 히트 싱크 용도의 장치.The apparatus of claim 10, further comprising at least one additional rectangular cross sectional tube. 제10항에 있어서, 상기 다수의 방열부는 적어도 하나의 천공 단계에 의해 형성되는 히트 싱크 용도의 장치.12. The apparatus of claim 10, wherein the plurality of heat dissipating portions are formed by at least one drilling step. 제10항에 있어서, 상기 디수의 방열부는 적어도 하나의 절단 단계에 의해 형성되는 히트 싱크 용도의 장치.11. The apparatus of claim 10, wherein said heat dissipation portion of said di water is formed by at least one cutting step. 제9항에 있어서, 상기 판금은 높은 열전도성을 갖는 합금으로 이루어지는 히트 싱크 용도의 장치.10. The apparatus of claim 9, wherein the sheet metal is made of an alloy having high thermal conductivity. 제9항에 있어서, 상기 시트는 디바이스의 통과를 위해 적어도 하나의 개구를 포함하는 히트 싱크 용도의 장치.10. The apparatus of claim 9, wherein the sheet includes at least one opening for passage of the device. 제11항에 있어서, 상기 실절직어로 직사각형 단면 튜브내 상기 제1실제 평면을 갖는 실질적으로 동일평면인 실제 평면을 생성하기 위해 상기 시트의 적어도 하나의 절곡되지 않은 방열부를 포함하는 히트 싱크 용도의 장치.12. The apparatus of claim 11, comprising at least one unbent heat dissipation portion of said sheet to produce a substantially coplanar real plane having said first actual plane in said rectangular cross-sectional tube. . 열-발생 부품을 냉각시키기 위한 장치로서, 베이스와, 4개의 벽을 포함하는 하나 이상의 실제 직사각형 단면 튜브를 포함하며, 상기 하나 이상의 직사각형 단면 튜브는 상기 4개의 벽중 하나의 벽으로서 베이스를 포함하고, 상기 베이스 및 상기 하나 이상의 직사각형 단면 튜브는 단일 판금으로 제조되는 열-발생 부품 냉각 장치.An apparatus for cooling a heat-generating part, comprising: a base and at least one actual rectangular cross-sectional tube comprising four walls, wherein the at least one rectangular cross-sectional tube comprises a base as one of the four walls, And said base and said at least one rectangular cross-sectional tube are made of a single sheet metal. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950010255A 1994-04-29 1995-04-28 Method for manufacturing heat sinks, devices for heat sinks, and heat-generating parts cooling devices KR950034716A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23557494A 1994-04-29 1994-04-29
US8/235,574 1994-04-29

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KR950034716A true KR950034716A (en) 1995-12-28

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KR1019950010255A KR950034716A (en) 1994-04-29 1995-04-28 Method for manufacturing heat sinks, devices for heat sinks, and heat-generating parts cooling devices

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EP (1) EP0680249A3 (en)
JP (1) JPH08159682A (en)
KR (1) KR950034716A (en)
CA (1) CA2147018A1 (en)

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Publication number Priority date Publication date Assignee Title
US5710733A (en) * 1996-01-22 1998-01-20 Silicon Graphics, Inc. Processor-inclusive memory module
US5867419A (en) * 1997-01-27 1999-02-02 Silicon Graphics, Inc. Processor-inclusive memory module
US6722423B1 (en) * 2000-09-12 2004-04-20 Wen-Chen Wei Heat sink
JP5454149B2 (en) * 2010-01-05 2014-03-26 オンキヨー株式会社 Heat sink mounting structure and heat sink mounting method
JP6063113B2 (en) * 2011-10-06 2017-01-18 株式会社Uacj heatsink

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US3893161A (en) * 1974-02-04 1975-07-01 Jr Albert Pesak Frictionally engageable heat sink for solid state devices

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CA2147018A1 (en) 1995-10-30
EP0680249A2 (en) 1995-11-02
JPH08159682A (en) 1996-06-21
EP0680249A3 (en) 1996-05-08

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