JP5454149B2 - Heat sink mounting structure and heat sink mounting method - Google Patents

Heat sink mounting structure and heat sink mounting method Download PDF

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JP5454149B2
JP5454149B2 JP2010000820A JP2010000820A JP5454149B2 JP 5454149 B2 JP5454149 B2 JP 5454149B2 JP 2010000820 A JP2010000820 A JP 2010000820A JP 2010000820 A JP2010000820 A JP 2010000820A JP 5454149 B2 JP5454149 B2 JP 5454149B2
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heat sink
heat
component
generating component
surface mount
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JP2011142142A (en
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有宣 太田
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Onkyo Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

本発明は発熱部品にヒートシンクを取り付けるヒートシンク取付構造に関する。   The present invention relates to a heat sink mounting structure for mounting a heat sink to a heat generating component.

従来、表面実装用ＩＣチップなどの発熱部品１には、放熱のためにその上部にヒートシンク２を取り付ける必要がある。図７は、従来のヒートシンク取付構造を示す側面図である。平面一枚板のヒートシンク２を発熱部品１に当接させて、プリント基板３の裏面側からネジ止めする場合（図７（ａ））、ネジ止めのときにヒートシンク２がネジ４を取り付ける側に傾いてしまうため、発熱部品１にヒートシンク２が密着しなくなる可能性がある。それを回避するために、下記特許文献に記載の発明のように、ヒートシンク２とプリント基板３との間にスペーサーを配置することで、ネジ止めの際にヒートシンク２が傾かないようにヒートシンク２を支持する方法があるが、その方法では手作業でスペーサーを配置しなければならないので作業効率が悪い。また、図７（ｂ）のように、ヒートシンク２に凹部を規定することによって、ヒートシンク２のネジ止め部分とプリント基板３との隙間をなくす方法もあるが、折り曲げられていることによってヒートシンク２の熱伝導性が下がってしまううえ、ヒートシンク２の製造で曲げ加工（プレス加工など）が必要なため、ヒートシンク２のコストが上がってしまうという問題がある。   Conventionally, it is necessary to attach a heat sink 2 to an upper part of the heat generating component 1 such as a surface mount IC chip for heat dissipation. FIG. 7 is a side view showing a conventional heat sink mounting structure. When the flat heat sink 2 is brought into contact with the heat generating component 1 and is screwed from the back side of the printed circuit board 3 (FIG. 7A), the heat sink 2 is on the side where the screw 4 is attached when screwing. The heat sink 2 may not be in close contact with the heat generating component 1 because it is inclined. In order to avoid this, by arranging a spacer between the heat sink 2 and the printed circuit board 3 as in the invention described in the following patent document, the heat sink 2 is prevented from tilting when screwed. There is a method of supporting, but in this method, since the spacers must be manually arranged, the working efficiency is poor. In addition, as shown in FIG. 7B, there is a method of eliminating a gap between the screwed portion of the heat sink 2 and the printed circuit board 3 by defining a recess in the heat sink 2, but by bending the heat sink 2, In addition to a decrease in thermal conductivity, the manufacturing of the heat sink 2 requires a bending process (such as a press process), and thus there is a problem that the cost of the heat sink 2 increases.

特開２００３−２８９１２５JP 2003-289125 A

本発明は上記従来の課題を解決するためになされたものであり、その目的とするところは、ヒートシンクをプリント基板へ効率良く且つ確実に取り付けることができるヒートシンク取付構造を提供することである。   The present invention has been made to solve the above-described conventional problems, and an object of the present invention is to provide a heat sink mounting structure capable of efficiently and reliably mounting a heat sink to a printed board.

本発明の好ましい実施形態によるヒートシンク取付構造は、プリント基板と、該プリント基板の第１の面に実装される発熱部品と、該発熱部品へ取り付けられるヒートシンクと、該プリント基板の該第１の面に実装される１又は複数の第１の表面実装部品とを備え；該プリント基板は、第２の面からネジが挿通される１又は複数の挿通孔が規定され、該ヒートシンクは、該ネジが螺合される１又は複数のネジ孔が規定され、該ネジによって該発熱部品へ取り付けられ、該第１の表面実装部品が該ヒートシンクを支持する。   A heat sink mounting structure according to a preferred embodiment of the present invention includes a printed circuit board, a heat generating component mounted on the first surface of the printed circuit board, a heat sink mounted on the heat generating component, and the first surface of the printed circuit board. One or a plurality of first surface-mounted components mounted on the printed circuit board; the printed circuit board has one or more insertion holes through which screws are inserted from a second surface; and the heat sink includes the screws One or more screw holes to be screwed are defined and attached to the heat generating component by the screw, and the first surface mount component supports the heat sink.

発熱部品と同一面に実装される第１の表面実装部品がヒートシンクを支持する。これによって、ネジによってヒートシンクを発熱部品へ取り付ける際、ヒートシンクが傾くことがないので、確実にヒートシンクが発熱部品へ取り付けられる。また、ヒートシンクの支持部品を半田リフローによって実装可能な表面実装部品とすることで、実装効率が向上する。   A first surface mount component mounted on the same surface as the heat generating component supports the heat sink. Accordingly, when the heat sink is attached to the heat generating component with screws, the heat sink does not tilt, so that the heat sink is reliably attached to the heat generating component. In addition, mounting efficiency is improved by using a surface mounting component that can be mounted by solder reflow as the support component of the heat sink.

好ましい実施形態においては、上記挿通孔が、上記発熱部品と上記第１の表面実装部品とで規定される軸上にあり、該発熱部品と該第１の表面実装部品との間に規定される。   In a preferred embodiment, the insertion hole is on an axis defined by the heat generating component and the first surface mount component, and is defined between the heat generating component and the first surface mount component. .

挿通孔が発熱部品と第１の表面実装部品とで規定される軸上にあり、発熱部品と第１の表面実装部品と間に規定されることによって、ネジによってヒートシンクを発熱部品へ取り付ける際、ヒートシンクがネジを取り付ける側に傾くことがない。   When the heat sink is attached to the heat generating component with screws by the insertion hole being on the axis defined by the heat generating component and the first surface mounting component, and being defined between the heat generating component and the first surface mounting component, The heat sink does not tilt toward the screw mounting side.

好ましい実施形態においては、上記第１の面の上記軸の両側にそれぞれ第２の表面実装部品がさらに実装され、該第２の表面実装部品が上記ヒートシンクをさらに支持する。   In a preferred embodiment, a second surface mount component is further mounted on each side of the shaft of the first surface, and the second surface mount component further supports the heat sink.

発熱部品と第１の表面実装部品とで規定される軸の両側に第２の表面実装部品をさらに実装することで、第２の表面実装部品が上記軸の両側からヒートシンクを支持するので、ネジによってヒートシンクを発熱部品へ取り付ける際、ヒートシンクが上記軸に垂直な方向に傾くことがない。   Since the second surface mount component supports the heat sink from both sides of the shaft by further mounting the second surface mount component on both sides of the shaft defined by the heat generating component and the first surface mount component, Therefore, when the heat sink is attached to the heat-generating component, the heat sink does not tilt in the direction perpendicular to the axis.

好ましい実施形態においては、上記挿通孔が、上記発熱部品と上記第１の表面実装部品とで規定される三角形の周上又はその内側に規定される。   In a preferred embodiment, the insertion hole is defined on the circumference of a triangle defined by the heat-generating component and the first surface-mounted component or on the inside thereof.

これによって、ヒートシンクは発熱部品と第１の表面実装部品とによって三点支持されるので、発熱部品へより安定的に実装され、かつ、１つのネジでヒートシンクを発熱部品へ取り付けることができる。   Accordingly, since the heat sink is supported at three points by the heat generating component and the first surface mounting component, the heat sink can be more stably mounted on the heat generating component, and the heat sink can be attached to the heat generating component with one screw.

好ましい実施形態においては、上記発熱部品と上記ヒートシンクとの間に挟み込まれる絶縁シートをさらに備え、上記第１の表面実装部品の高さが、該発熱部品の高さと該絶縁シートの厚みとを足した長さと略同一である。   In a preferred embodiment, an insulating sheet sandwiched between the heat generating component and the heat sink is further provided, and the height of the first surface mounting component is determined by adding the height of the heat generating component and the thickness of the insulating sheet. It is almost the same as the length.

発熱部品の高さよりも第１の表面実装部品の高さが高い場合、発熱部品とヒートシンクとの間に絶縁シートを挟み込むことによって、高さを揃えることができる。   When the height of the first surface mount component is higher than the height of the heat generating component, the height can be made uniform by sandwiching an insulating sheet between the heat generating component and the heat sink.

好ましい実施形態においては、上記第１の面に実装され、上記ヒートシンクがネジ止めされるときに該ヒートシンクの回転を係止する、前記発熱部品よりも高さが高い１又は複数の第３の表面実装部品をさらに備える。   In a preferred embodiment, one or more third surfaces that are mounted on the first surface and lock the rotation of the heat sink when the heat sink is screwed, and are higher than the heat-generating component. A mounting component is further provided.

発熱部品よりも高さが高い第３の表面実装部品をネジの回転方向側に実装することで、ネジをヒートシンクのネジ孔へ螺合させるときに、ヒートシンクの回転を係止することができる。   By mounting the third surface mount component having a height higher than that of the heat generating component on the screw rotation direction side, the rotation of the heat sink can be locked when the screw is screwed into the screw hole of the heat sink.

好ましい実施形態においては、上記第１の面に実装され、上記ヒートシンクの実装位置を規定する、前記発熱部品よりも高さが高い１又は複数の第４の表面実装部品をさらに備える。   In a preferred embodiment, the semiconductor device further includes one or a plurality of fourth surface mount components mounted on the first surface and defining a mounting position of the heat sink and having a height higher than that of the heat generating component.

発熱部品よりも高さが高い第４の表面実装部品を実装することで、ヒートシンクを発熱部品に取り付けるときのヒートシンクの実装位置を決めることができる。   By mounting the fourth surface mount component having a height higher than that of the heat generating component, the mounting position of the heat sink when the heat sink is attached to the heat generating component can be determined.

本発明の好ましい実施形態によるヒートシンク取付方法は、発熱部品と、発熱部品に取り付けられるヒートシンクを支持する１又は複数の第１の表面実装部品とを半田リフローによってプリント基板の第１の面へ実装する工程と、該ヒートシンクを該発熱部品及び該第１の表面実装部品の上部へ当接する工程と、該プリント基板の第２の面からネジによってヒートシンクを該発熱部品へ取り付ける工程とを含む。   In a heat sink mounting method according to a preferred embodiment of the present invention, a heat generating component and one or a plurality of first surface-mounted components that support the heat sink mounted on the heat generating component are mounted on the first surface of the printed circuit board by solder reflow. A step of abutting the heat sink on top of the heat generating component and the first surface mount component, and attaching a heat sink to the heat generating component with a screw from the second surface of the printed circuit board.

本発明のヒートシンク取付方法によれば、ヒートシンクを支持する表面実装部品を半田リフローによってプリント基板へ実装することができるので、手作業実装が必要なスペーサーを用いる場合よりも、製造コストを抑えることができる。   According to the heat sink mounting method of the present invention, the surface mounting component that supports the heat sink can be mounted on the printed circuit board by solder reflow, so that the manufacturing cost can be reduced compared to the case where a spacer that requires manual mounting is used. it can.

本発明のヒートシンク取付構造によると、発熱部品と同一面に実装される第１の表面実装部品がヒートシンクを支持する。これによって、ネジによってヒートシンクを発熱部品へ取り付ける際、ヒートシンクが傾くことがない。   According to the heat sink mounting structure of the present invention, the first surface mount component mounted on the same surface as the heat generating component supports the heat sink. This prevents the heat sink from tilting when the heat sink is attached to the heat-generating component with screws.

本発明の好ましい実施形態によるヒートシンク取付構造を示す断面図である。It is sectional drawing which shows the heat sink attachment structure by preferable embodiment of this invention. 本発明の好ましい実施形態によるヒートシンク取付構造を示す平面図である。It is a top view which shows the heat sink attachment structure by preferable embodiment of this invention. 本発明の別の好ましい実施形態よるヒートシンク取付構造を示す平面図である。It is a top view which shows the heat sink attachment structure by another preferable embodiment of this invention. 本発明のさらに別の好ましい実施形態よるヒートシンク取付構造を示す平面図である。It is a top view which shows the heat sink attachment structure by another preferable embodiment of this invention. 本発明のさらに別の好ましい実施形態によるヒートシンク取付構造を示す断面図である。It is sectional drawing which shows the heat sink attachment structure by another preferable embodiment of this invention. 本発明のさらに別の好ましい実施形態によるヒートシンク取付構造を示す平面図である。It is a top view which shows the heat sink attachment structure by another preferable embodiment of this invention. 従来のヒートシンク取付構造を示す側面図である。It is a side view which shows the conventional heat sink attachment structure.

以下、本発明の好ましい実施形態によるヒートシンク取付構造について、図を参照して説明するが、本発明はこれらの実施形態には限定されない。なお、図中同一又は相当部分には同一符号を付してその説明を援用する。   Hereinafter, although the heat sink attachment structure by preferable embodiment of this invention is demonstrated with reference to figures, this invention is not limited to these embodiment. In addition, the same code | symbol is attached | subjected to the same or an equivalent part in a figure, and the description is used.

図１は、本発明の好ましい実施形態によるヒートシンク取付構造を示す断面図である。本発明の好ましい実施形態によるヒートシンク取付構造は、発熱部品１と、ヒートシンク２と、プリント基板３と、ネジ４と、表面実装部品５とを備える。   FIG. 1 is a cross-sectional view showing a heat sink mounting structure according to a preferred embodiment of the present invention. A heat sink mounting structure according to a preferred embodiment of the present invention includes a heat generating component 1, a heat sink 2, a printed circuit board 3, a screw 4, and a surface mount component 5.

発熱部品１は、例えば、チップ状の集積回路（ＩＣチップ）であり、プリント基板３の一方の面（以下、表面）へ半田リフローにより実装される。表面実装部品５、５は、発熱部品１と同一面に半田リフローにより実装される。表面実装部品５は、例えば、トランジスタ等で、その高さＬ１が発熱部品１の高さと略同一である。ヒートシンク２は、放熱性、即ち、熱伝導率の高い材料により形成されており、上記材料としては、例えば、アルミニウム、銅、その他の金属材料が使用される。ヒートシンク２は、略平面の板形状を有し、実装された発熱部品１の上部へ当接される。このとき、表面実装部品５もヒートシンクと当接し、表面実装部品５がヒートシンク２を支持する。また、ヒートシンク２は複数のネジ孔２１、２１が規定されている。ネジ孔２１、２１は、ネジ切りが施されており、ネジ４を螺合することができる。プリント基板３は、複数の挿通孔３１、３１が規定されており、プリント基板３の他方の面（以下、裏面）からネジ４が挿通される。挿通孔３１を挿通したネジ４は、ヒートシンク２のネジ孔２１へ螺合される。このように、発熱部品１と略同一の高さを有する表面実装部品５を発熱部品１と同一面上の周辺に実装することで、表面実装部品５がヒートシンク２を支持するので、ネジ４によってヒートシンク２を発熱部品１へ取り付ける際、ヒートシンク２が傾くことがないので、確実にヒートシンクが発熱部品へ取り付けられる。また、ヒートシンク２の支持部品を半田リフローによって実装可能な表面実装部品とすることで、実装効率が向上する。なお、表面実装部品５は、プリント基板３上で構成されている回路とは無関係なものでもよく、配線がつながっていなくてもよい。   The heat generating component 1 is, for example, a chip-like integrated circuit (IC chip), and is mounted on one surface (hereinafter referred to as a surface) of the printed board 3 by solder reflow. The surface mounted components 5 and 5 are mounted on the same surface as the heat generating component 1 by solder reflow. The surface mounted component 5 is, for example, a transistor or the like, and its height L1 is substantially the same as the height of the heat generating component 1. The heat sink 2 is formed of a material having heat dissipation, that is, high thermal conductivity. As the material, for example, aluminum, copper, or other metal materials are used. The heat sink 2 has a substantially flat plate shape and is brought into contact with the upper portion of the mounted heat generating component 1. At this time, the surface mount component 5 also contacts the heat sink, and the surface mount component 5 supports the heat sink 2. The heat sink 2 has a plurality of screw holes 21 and 21 defined therein. The screw holes 21 and 21 are threaded and can be screwed together. The printed circuit board 3 has a plurality of insertion holes 31, 31, and the screw 4 is inserted from the other surface (hereinafter, the back surface) of the printed circuit board 3. The screw 4 inserted through the insertion hole 31 is screwed into the screw hole 21 of the heat sink 2. Thus, by mounting the surface mount component 5 having substantially the same height as the heat generating component 1 around the same surface as the heat generating component 1, the surface mount component 5 supports the heat sink 2. When the heat sink 2 is attached to the heat generating component 1, the heat sink 2 is not inclined, so that the heat sink is securely attached to the heat generating component. In addition, mounting efficiency is improved by using a surface mounting component that can be mounted by solder reflow as the support component of the heat sink 2. The surface mount component 5 may be irrelevant to the circuit configured on the printed circuit board 3 and may not be connected to wiring.

次に、プリント基板３に規定される挿通孔３１について図２を参照してより詳細に説明する。図２は、本発明の好ましい実施形態によるヒートシンク取付構造を示す平面図である。なお、図２において、ヒートシンク２とネジ４は図示していない。プリント基板３に規定される挿通孔３１は、発熱部品１と表面実装部品５とで規定される軸上にあり、発熱部品１と表面実装部品５と間に規定される。例えば、発熱部品１の中心と表面実装部品５の中心を通る軸Ｘ上の発熱部品１と表面実装部品５との間に、孔の中心が位置するように挿通孔３１が規定される。なお、ヒートシンク２のネジ孔２１は、挿通孔３１の規定位置に合わせて適宜好ましい位置に規定すればよい。このように、挿入孔３１が、発熱部品１と表面実装部品５とで規定される軸上にあり、発熱部品１と表面実装部品５と間に規定されることによって、ネジ４によってヒートシンク２を発熱部品１へ取り付ける際、ヒートシンク２がネジを取り付ける側に傾くことがない。   Next, the insertion hole 31 defined in the printed circuit board 3 will be described in more detail with reference to FIG. FIG. 2 is a plan view showing a heat sink mounting structure according to a preferred embodiment of the present invention. In FIG. 2, the heat sink 2 and the screw 4 are not shown. The insertion hole 31 defined in the printed circuit board 3 is on an axis defined by the heat generating component 1 and the surface mount component 5, and is defined between the heat generating component 1 and the surface mount component 5. For example, the insertion hole 31 is defined so that the center of the hole is located between the heat-generating component 1 and the surface-mounted component 5 on the axis X passing through the center of the heat-generating component 1 and the surface-mounted component 5. Note that the screw hole 21 of the heat sink 2 may be appropriately defined at a preferable position in accordance with the specified position of the insertion hole 31. Thus, the insertion hole 31 is on the axis defined by the heat generating component 1 and the surface mount component 5, and is defined between the heat generating component 1 and the surface mount component 5. When attaching to the heat generating component 1, the heat sink 2 does not tilt toward the side where the screw is attached.

次に、図１及び図２で説明したヒートシンク取付構造について、その実装方法を説明する。まず、発熱部品１及び表面実装部品５、５が半田リフローによってプリント基板３の表面へ実装される。そして、挿通孔３１とネジ孔２１の位置が重なるようにヒートシンク２が発熱部品１及び表面実装部品５、５の上部へ当接される。そして、プリント基板３の裏面からネジ４、４が挿通孔３１、３１へ挿通され、ヒートシンク２のネジ孔２１、２１へ螺合される。この方法では、ヒートシンク２を支持する表面実装部品５を半田リフローによってプリント基板３へ実装することができるので、手作業実装が必要なスペーサーを用いる場合よりも、製造コストを抑えることができる。なお、プリント基板３の裏面からヒートシンク２をネジ止めするという工程が煩雑な場合は、プリント基板３の裏面を上にしてネジ止め作業を行えるようにヒートシンク２とプリント基板３を固定する治具を用いればよい。   Next, a mounting method of the heat sink mounting structure described in FIGS. 1 and 2 will be described. First, the heat generating component 1 and the surface mounting components 5 and 5 are mounted on the surface of the printed circuit board 3 by solder reflow. The heat sink 2 is brought into contact with the heat generating component 1 and the upper parts of the surface mount components 5 and 5 so that the positions of the insertion hole 31 and the screw hole 21 overlap. Then, screws 4 and 4 are inserted into the insertion holes 31 and 31 from the back surface of the printed circuit board 3 and screwed into the screw holes 21 and 21 of the heat sink 2. In this method, since the surface-mounted component 5 that supports the heat sink 2 can be mounted on the printed circuit board 3 by solder reflow, the manufacturing cost can be reduced as compared with the case where a spacer that requires manual mounting is used. If the process of screwing the heat sink 2 from the back surface of the printed circuit board 3 is complicated, a jig for fixing the heat sink 2 and the printed circuit board 3 so that the screwing operation can be performed with the back surface of the printed circuit board 3 facing up is provided. Use it.

次に、よりヒートシンク２を発熱部品１の上部へ安定実装することができる本発明の別の好ましい実施形態によるヒートシンク取付構造について図３を参照して説明する。図３は、本発明の別の好ましいに実施形態よるヒートシンク取付構造を示す平面図である。なお、図３において、ヒートシンク２とネジ４は図示していない。本実施例において、発熱部品１、ヒートシンク２、プリント基板３及びネジ４は図１及び図２で説明したものと同じであるが、高さが発熱部品１の高さと略同一の表面実装部品６、６、６、６がさらに実装される点で異なる。本実施例では、発熱部品１と表面実装部品５とで規定される軸Ｘの両側それぞれに、高さが発熱部品１と略同一の表面実装部品６、６がさらに実装される。これにより、表面実装部品５に加えて、軸Ｘの両側から表面実装部品６によってもヒートシンク２が支持されるので、ネジ４によってヒートシンク２を発熱部品１へ取り付ける際、ヒートシンク２が軸Ｘに垂直な方向に傾くことなく、ヒートシンク２を発熱部品１へ取り付けることができる。   Next, a heat sink mounting structure according to another preferred embodiment of the present invention in which the heat sink 2 can be more stably mounted on the heat generating component 1 will be described with reference to FIG. FIG. 3 is a plan view showing a heat sink mounting structure according to another preferred embodiment of the present invention. In FIG. 3, the heat sink 2 and the screw 4 are not shown. In this embodiment, the heat generating component 1, the heat sink 2, the printed circuit board 3 and the screw 4 are the same as those described in FIGS. 1 and 2, but the height of the surface mounting component 6 is substantially the same as the height of the heat generating component 1. , 6, 6 and 6 are different in that they are further mounted. In this embodiment, surface-mounted components 6 and 6 having substantially the same height as the heat-generating component 1 are further mounted on both sides of the axis X defined by the heat-generating component 1 and the surface-mounted component 5. Thus, in addition to the surface mount component 5, the heat sink 2 is supported by the surface mount component 6 from both sides of the axis X. Therefore, when the heat sink 2 is attached to the heat generating component 1 with the screw 4, the heat sink 2 is perpendicular to the axis X. The heat sink 2 can be attached to the heat generating component 1 without tilting in any direction.

次に、本発明のさらに別の好ましい実施形態によるヒートシンク取付構造について図４を参照して説明する。図４は、本発明のさらに別の好ましいに実施形態よるヒートシンク取付構造を示す平面図である。図４に示すように、発熱部品１と表面実装部品５、５とが、三角形の頂点に位置するようにプリント基板３へ実装される。例えば、発熱部品１の中心と表面実装部品５、５の中心とを結ぶ線が三角形を規定するように、発熱部品１と表面実装部品５、５とがプリント基板３へ実装される。そして、発熱部品１と表面実装部品５、５とで規定される三角形の周上又はその内側に挿通孔３１が規定される。例えば、図４に示すように、発熱部品１の中心と表面実装部品５、５の中心とで規定される三角形の内側に挿通孔３１の中心が位置されるように、挿通孔３１がプリント基板３に規定される。これによって、ヒートシンク２を発熱部品１に当接させる際、ヒートシンク２は発熱部品１と表面実装部品５、５とによって三点支持されるので、発熱部品１へより安定的に実装され、かつ、１つのネジ４でヒートシンク２を発熱部品１へ取り付けることができる。   Next, a heat sink mounting structure according to still another preferred embodiment of the present invention will be described with reference to FIG. FIG. 4 is a plan view showing a heat sink mounting structure according to still another preferred embodiment of the present invention. As shown in FIG. 4, the heat-generating component 1 and the surface-mounted components 5 and 5 are mounted on the printed circuit board 3 so as to be positioned at the apex of the triangle. For example, the heat-generating component 1 and the surface-mounted components 5 and 5 are mounted on the printed circuit board 3 so that a line connecting the center of the heat-generating component 1 and the centers of the surface-mounted components 5 and 5 defines a triangle. And the insertion hole 31 is prescribed | regulated on the circumference | surroundings of the triangle prescribed | regulated by the heat-emitting component 1 and the surface mount components 5 and 5 or its inner side. For example, as shown in FIG. 4, the insertion hole 31 is a printed circuit board so that the center of the insertion hole 31 is positioned inside a triangle defined by the center of the heat generating component 1 and the centers of the surface mount components 5 and 5. 3 is specified. As a result, when the heat sink 2 is brought into contact with the heat generating component 1, the heat sink 2 is supported by the heat generating component 1 and the surface mount components 5, 5 so that the heat sink 2 is more stably mounted on the heat generating component 1, and The heat sink 2 can be attached to the heat generating component 1 with one screw 4.

以上、本発明に係るヒートシンク取付構造の好ましい実施形態の例について説明したが、上述した実施の形態は本発明を実施するための例示に過ぎない。図１及び図２で説明したヒートシンク取付構造では、表面実装部品５の高さを発熱部品１と略同一のものを用いたが、図５に示すように、発熱部品１の高さよりも表面実装部品５の高さが高い場合、発熱部品１とヒートシンク２との間に、熱伝導性が高く、弾性を有する絶縁シートを挟み込むことによって、高さを揃えることができる。このとき、表面実装部品５の高さＬ１は、発熱部品１の高さと絶縁シート９との厚みを足したものと略同一である。弾性を有する絶縁シートを用いる理由は、発熱部品１又は表面実装部品５の寸法誤差があったとしても、絶縁シートの弾性によってその誤差を吸収するためである。   As mentioned above, although the example of preferable embodiment of the heat sink attachment structure concerning this invention was demonstrated, embodiment mentioned above is only the illustration for implementing this invention. In the heat sink mounting structure described with reference to FIGS. 1 and 2, the surface mount component 5 has substantially the same height as the heat generating component 1, but as shown in FIG. When the height of the component 5 is high, the height can be made uniform by sandwiching an insulating sheet having high thermal conductivity and elasticity between the heat generating component 1 and the heat sink 2. At this time, the height L1 of the surface mount component 5 is substantially the same as the sum of the height of the heat generating component 1 and the thickness of the insulating sheet 9. The reason why the insulating sheet having elasticity is used is that even if there is a dimensional error of the heat generating component 1 or the surface mounting component 5, the error is absorbed by the elasticity of the insulating sheet.

また、図１及び図２で説明したヒートシンク取付構造では、複数のネジ４を用いてヒートシンク２を発熱部品１へ取り付けるようにしたが、図６に示すように、１つのネジ４でヒートシンク２を発熱部品１へ取り付けるようにしてもよい。この場合、ネジ４をヒートシンク２のネジ孔２１へ螺合させる際にヒートシンク２が回転してしまうのを防止するため、発熱部品１よりも高さが高い表面実装部品７を、ネジ４の回転方向側にヒートシンク２と当接する位置に実装してもよい。また、ヒートシンク２を発熱部品１に取り付ける際のヒートシンク２の実装位置を決めるため、発熱部品１よりも高さが高い表面実装部品８をさらに実装してもよい。本実施例では、回転防止用の表面実装部品７もヒートシンクの実装位置を決める役割を有し、表面実装部品７、８によってヒートシンクの実装位置が決められる。   1 and 2, the heat sink 2 is attached to the heat-generating component 1 using a plurality of screws 4. However, as shown in FIG. You may make it attach to the heat-emitting component 1. FIG. In this case, in order to prevent the heat sink 2 from rotating when the screw 4 is screwed into the screw hole 21 of the heat sink 2, the surface mount component 7 having a height higher than that of the heat generating component 1 is used to rotate the screw 4. You may mount in the position contact | abutted with the heat sink 2 on the direction side. Further, in order to determine the mounting position of the heat sink 2 when the heat sink 2 is attached to the heat generating component 1, a surface mount component 8 having a height higher than that of the heat generating component 1 may be further mounted. In the present embodiment, the surface mounting component 7 for preventing rotation also has a role of determining the mounting position of the heat sink, and the mounting position of the heat sink is determined by the surface mounting components 7 and 8.

また、本実施例では発熱部品１を表面実装可能なものとしたが、リードピン挿入型のものであってもよい。   In the present embodiment, the heat generating component 1 can be surface-mounted, but a lead pin insertion type may be used.

本発明は、発熱部品が使用される電子機器に採用され得るが、特にオーディオ機器に好適に採用され得る。   The present invention can be employed in an electronic device in which a heat-generating component is used, but can be particularly suitably employed in an audio device.

１ 発熱部品
２ ヒートシンク
２１ ネジ孔
３ プリント基板
３１ 挿通孔
４ ネジ
５、６、７、８ 表面実装部品
９ 絶縁シート DESCRIPTION OF SYMBOLS 1 Heat generating component 2 Heat sink 21 Screw hole 3 Printed circuit board 31 Insertion hole 4 Screw 5, 6, 7, 8 Surface mount component 9 Insulation sheet

Claims (8)

プリント基板と、
該プリント基板の第１の面に実装される発熱部品と、
該発熱部品へ取り付けられるヒートシンクと、
該プリント基板の該第１の面に実装されてその高さが該発熱部品と略同一または該発熱部品よりも高い１又は複数の第１の表面実装部品および１又は複数の第３の表面実装部品と、
を備え；
該プリント基板は、第２の面からネジが挿通される１又は複数の挿通孔が規定され、
該ヒートシンクは、該ネジが螺合される１又は複数のネジ孔が規定され、該ネジによって該発熱部品へ取り付けられ、
該第１の表面実装部品および該第３の表面実装部品が該ヒートシンクを支持し、該ヒートシンクがネジ止めされるときに該ヒートシンクの回転を該第３の表面実装部品が係止する、ヒートシンク取付構造。 A printed circuit board,
A heat generating component mounted on the first surface of the printed circuit board;
A heat sink attached to the heat generating component;
One or more first surface mount components and one or more third surface mounts mounted on the first surface of the printed circuit board and having a height substantially the same as or higher than the heat generation components Parts ,
Comprising:
The printed circuit board has one or more insertion holes through which screws are inserted from the second surface,
The heat sink has one or a plurality of screw holes into which the screws are screwed, and is attached to the heat generating component by the screws.
Heat sink mounting wherein the first surface mount component and the third surface mount component support the heat sink and the third surface mount component locks rotation of the heat sink when the heat sink is screwed Construction. プリント基板と、A printed circuit board,
該プリント基板の第１の面に実装される発熱部品と、A heat generating component mounted on the first surface of the printed circuit board;
該発熱部品へ取り付けられるヒートシンクと、A heat sink attached to the heat generating component;
該プリント基板の該第１の面に実装されてその高さが該発熱部品と略同一または該発熱部品よりも高い１又は複数の第１の表面実装部品および１又は複数の第４の表面実装部品と、One or more first surface mount components and one or more fourth surface mounts mounted on the first surface of the printed circuit board and having a height substantially the same as or higher than the heat generation components Parts,
を備え；Comprising:
該プリント基板は、第２の面からネジが挿通される１又は複数の挿通孔が規定され、The printed circuit board has one or more insertion holes through which screws are inserted from the second surface,
該ヒートシンクは、該ネジが螺合される１又は複数のネジ孔が規定され、該ネジによって該発熱部品へ取り付けられ、The heat sink has one or more screw holes into which the screws are screwed, and is attached to the heat-generating component by the screws.
該第１の表面実装部品および該ヒートシンクの実装位置を規定する該第４の表面実装部品が該ヒートシンクを支持する、ヒートシンク取付構造。A heat sink mounting structure in which the first surface mount component and the fourth surface mount component defining a mounting position of the heat sink support the heat sink. 前記挿通孔が、前記発熱部品と前記第１の表面実装部品とで規定される軸上にあり、該発熱部品と該第１の表面実装部品との間に規定される、請求項１または２に記載のヒートシンク取付構造。 The insertion hole is located on the axis defined by the the heat generating component and the first surface mount component is defined between the heat generating component and the first surface mount components, according to claim 1 or 2 The heat sink mounting structure described in 1. 前記第１の面の前記軸の両側にそれぞれ第２の表面実装部品がさらに実装され、該第２の表面実装部品が前記ヒートシンクをさらに支持する、請求項３に記載のヒートシンク取付構造。 The heat sink mounting structure according to claim 3 , wherein a second surface mount component is further mounted on each side of the shaft of the first surface, and the second surface mount component further supports the heat sink. 前記挿通孔が、前記発熱部品と前記第１の表面実装部品とで規定される三角形の周上又はその内側に規定される、請求項１または２に記載のヒートシンク取付構造。 The heat sink mounting structure according to claim 1 or 2 , wherein the insertion hole is defined on or inside a triangle defined by the heat generating component and the first surface mounting component. 前記発熱部品と前記ヒートシンクとの間に挟み込まれる絶縁シートをさらに備え、
前記第１の表面実装部品の高さが、該発熱部品の高さと該絶縁シートの厚みとを足した長さと略同一である、請求項１〜５のいずれかに記載のヒートシンク取付構造。 Further comprising an insulating sheet sandwiched between the heat generating component and the heat sink;
The height of the first surface mount components, is substantially the same as the length obtained by adding the height and thickness of the insulating sheet heat-generating component, the heat sink mounting structure according to any one of claims 1-5. 発熱部品と、発熱部品に取り付けられるヒートシンクを支持してその高さが該発熱部品と略同一または該発熱部品よりも高い１又は複数の第１の表面実装部品および１又は複数の第３の表面実装部品と、を半田リフローによってプリント基板の第１の面へ実装する工程と、
該ヒートシンクを該発熱部品及び該第１の表面実装部品および該第３の表面実装部品の上部へ当接する工程と、
該プリント基板の第２の面からネジによってヒートシンクを該発熱部品へ取り付けて、該ヒートシンクの回転を該第３の表面実装部品が係止するように該ヒートシンクをネジ止めする工程と、を含むヒートシンク取付方法。 One or a plurality of first surface-mount components and one or a plurality of third surfaces supporting a heat-generating component and a heat sink attached to the heat-generating component and having a height substantially equal to or higher than that of the heat-generating component a mounting component, a step of mounting the first surface of the printed circuit board by solder reflow,
Abutting the heat sink on top of the heat generating component and the first surface mount component and the third surface mount component ;
Heat sinking by a screw from the second surface of the printed circuit board to the heat-generating component, the heat sink comprising the steps of screwing the heat sink so that the rotation of the heat sink surface mount components of said third locking Mounting method. 発熱部品と、発熱部品に取り付けられるヒートシンクを支持してその高さが該発熱部品と略同一または該発熱部品よりも高い１又は複数の第１の表面実装部品および１又は複数の第４の表面実装部品と、を半田リフローによってプリント基板の第１の面へ実装する工程と、One or a plurality of first surface-mounted components and one or a plurality of fourth surfaces supporting a heat-generating component and a heat sink attached to the heat-generating component and having a height substantially the same as or higher than the heat-generating component Mounting the mounting component on the first surface of the printed circuit board by solder reflow;
該ヒートシンクを該発熱部品及び該第１の表面実装部品および該ヒートシンクの実装位置を規定する該第４の表面実装部品の上部へ当接する工程と、  Abutting the heat sink on top of the heat generating component and the first surface mount component and the fourth surface mount component defining a mounting position of the heat sink;
該プリント基板の第２の面からネジによってヒートシンクを該発熱部品へ取り付ける工程とを含むヒートシンク取付方法。  Attaching the heat sink to the heat generating component with a screw from the second surface of the printed circuit board.
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