WO2018185859A1 - Protective structure of semiconductor element and air conditioner - Google Patents

Protective structure of semiconductor element and air conditioner Download PDF

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Publication number
WO2018185859A1
WO2018185859A1 PCT/JP2017/014148 JP2017014148W WO2018185859A1 WO 2018185859 A1 WO2018185859 A1 WO 2018185859A1 JP 2017014148 W JP2017014148 W JP 2017014148W WO 2018185859 A1 WO2018185859 A1 WO 2018185859A1
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WO
WIPO (PCT)
Prior art keywords
semiconductor element
spacer
circuit board
screw
recess
Prior art date
Application number
PCT/JP2017/014148
Other languages
French (fr)
Japanese (ja)
Inventor
建太 櫻井
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2017/014148 priority Critical patent/WO2018185859A1/en
Publication of WO2018185859A1 publication Critical patent/WO2018185859A1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
    • F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
    • F24F1/20—Electric components for separate outdoor units
    • F24F1/22—Arrangement or mounting thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
    • F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
    • F24F1/20—Electric components for separate outdoor units
    • F24F1/24—Cooling of electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a semiconductor element protection structure and an air conditioner.
  • devices such as a compressor, a heat exchanger, a blower, and an electric motor that drives the blower are installed, and further, a semiconductor element such as a power semiconductor element for driving and controlling the compressor and the electric motor is mounted.
  • An electrical box that houses the circuit board is installed.
  • the spacer used in Patent Document 1 does not have a structure in consideration of prevention of destruction of the elements inside the semiconductor element due to vibration. Therefore, the semiconductor element due to vibration has a function of raising the height of the semiconductor element. There is a problem that it is not possible to meet the need to improve the reliability of electrical products by preventing the destruction of the elements inside.
  • the present invention has been made in view of the above, and an object of the present invention is to obtain a protective structure of a semiconductor element that can improve the reliability of an electrical product including the semiconductor element.
  • a protective structure for a semiconductor device includes a circuit board, a spacer disposed on the first surface of the circuit board, and a semiconductor disposed on the spacer.
  • the semiconductor element protection structure according to the present invention has the effect of providing a semiconductor element protection structure capable of improving the reliability of an electrical product provided with the semiconductor element.
  • FIG. 1 The block diagram which shows the structure of the outdoor unit of the air conditioner provided with the protection structure of the semiconductor element concerning Embodiment 1 of this invention.
  • Figure 4 is a cross-sectional view showing the protective structure of the semiconductor element according to the first embodiment of the present invention, and is a cross-sectional view taken along line IV-IV in FIG.
  • FIG. 6 is a cross-sectional view showing a protective structure of a semiconductor element according to a second embodiment of the present invention, and is a cross-sectional view taken along line VI-VI in FIG.
  • the top view which shows the state which looked at the heat radiator of the protection structure of the semiconductor element concerning Embodiment 2 of this invention from the board
  • FIG. 1 is a configuration diagram illustrating a configuration of an outdoor unit 1 of an air conditioner including a semiconductor element protection structure according to a first embodiment of the present invention.
  • FIG. 1 the state seen through the wall surface of the outdoor unit 1 is shown.
  • FIG. 2 is a perspective view illustrating a configuration of the electrical component box 4 of the outdoor unit 1 of the air conditioner according to the first embodiment of the present invention.
  • FIG. 2 the state seen through the wall surface of the electrical component box 4 is shown.
  • 1 and 2 show the main configuration.
  • FIG. 3 is a schematic diagram for explaining the protective structure of the semiconductor element according to the first embodiment of the present invention.
  • the opening 10b of the electrical component box 4 is connected to the radiator 5 from the outside of the electrical component box 4. It is a schematic diagram shown about the case where it sees through.
  • FIG. 4 is a cross-sectional view showing the protective structure of the semiconductor device according to the first embodiment of the present invention, and is a cross-sectional view taken along line IV-IV in FIG.
  • An outdoor unit 1 shown in FIG. 1 is an outdoor unit that constitutes a part of an air conditioner, and includes a compressor 3 that compresses refrigerant, a fan 2 that sends outside air to a heat exchanger (not shown), a compressor 3, and a fan.
  • the air conditioner includes an outdoor unit 1 arranged outdoors and an indoor unit (not shown) arranged indoors.
  • the outdoor unit 1 and the indoor unit are connected by a refrigerant pipe and an internal / external communication line, and a refrigerant for performing heat exchange flows through the refrigerant pipe.
  • the air conditioner forms one complete refrigeration cycle with the outdoor unit 1 and the indoor unit.
  • the air conditioner uses a refrigerant that circulates between the outdoor unit 1 and the indoor unit through the refrigerant pipe, performs heat transfer between the indoor air that is the air-conditioning target space and the outdoor air, To achieve air conditioning.
  • the electrical component box 4 mainly includes a casing 10 configured in a rectangular parallelepiped shape, a circuit board 6 fixed inside the casing 10, and an electronic circuit in the circuit board 6.
  • a lead-type first semiconductor element 7 mounted on a component surface 6a that is a first surface of a circuit board 6 on which a component is mounted, and a second semiconductor element 8 mounted on the component surface 6a of the circuit board 6
  • the spacer 9 mounted on the component surface 6a of the circuit board 6 and on which the first semiconductor element 7 is placed in the first recess 9c, and the anti-substrate side face 7b of the first semiconductor element so as to be blown by the fan 2
  • a heat dissipating member 5 disposed in contact with the heat dissipating member.
  • the surface facing the circuit substrate 6 side is the substrate side surface 7 a of the first semiconductor element, which is the element substrate side surface, and the surface facing the direction opposite to the element substrate side surface is the element opposite substrate side surface.
  • the side surface 7b is the opposite side of the semiconductor element 1.
  • the radiator 5 is disposed in a region other than the region where the first semiconductor element 7 is disposed on the first semiconductor element 7 and the spacer 9 while being in contact with the non-substrate side surface 7b of the first semiconductor element. . That is, the heat radiator 5 is disposed so as to cover the region other than the region where the first semiconductor element 7 is disposed on the spacer 9 and the first semiconductor element 7. A substrate side surface 5a of the radiator that is a surface facing the circuit board 6 side of the radiator 5 is in close contact with the non-substrate side surface 7b of the first semiconductor element.
  • the substrate side surface 5a of the heat radiating body has the same shape as the non-substrate side surface 7b of the first semiconductor element in order to increase the heat conduction efficiency from the first semiconductor element 7 to the heat radiating body 5.
  • the radiator 5 is made of a material having high thermal conductivity such as copper or aluminum.
  • a side surface 10a on the air passage side which is a side surface on the side where the air blown by the fan 2 flows, in the housing 10 is communicated with the outside of the housing 10 so that the opposite side surface 7b of the first semiconductor element is the housing.
  • An opening 10b formed so as to be exposed on the side surface 10a on the air passage side of the body 10 is provided.
  • the circuit board 6 is provided in a state where the in-plane direction is parallel to the in-plane direction of the side surface 10 a on the air path side of the housing 10 and the component surface 6 a faces the side surface 10 a of the air path side of the housing 10. .
  • the circuit board 6 is fixed to the side surface 10a on the air passage side of the housing 10 by a screw (not shown).
  • the first semiconductor element 7 is a power semiconductor element, and constitutes a power conversion unit composed of components such as an insulated gate bipolar transistor (Insulated Gate Bipolar Transistor) or a feedback diode.
  • the first semiconductor element 7 has a rectangular parallelepiped shape, and is provided on the component surface 6 a of the circuit board 6 at a position corresponding to the opening 10 b on the side surface 10 a on the air passage side of the housing 10.
  • the anti-substrate side surface 7b of the first semiconductor element is disposed on the same surface as the side surface 10a on the air passage side of the housing 10, for example, as shown in FIG.
  • the first semiconductor element 7 is provided with a plurality of lead terminals 7e on a pair of side surfaces 7c and 7d facing each other.
  • the second semiconductor element 8 includes a PWM signal generation circuit that generates a drive signal for driving the power conversion unit in pulse width modulation (PWM), and a noise filter circuit for removing noise included in the AC power supply. A circuit is formed.
  • the second semiconductor element 8 is a state in which the opposite side surface 8a of the second semiconductor element, which is the opposite side surface of the element facing the circuit substrate 6 side, faces the side surface 10a on the air path side of the housing 10. And provided on the component surface 6 a of the circuit board 6.
  • the arrangement positions of the first semiconductor element 7 and the second semiconductor element 8 are not limited to the positions in the illustrated example.
  • the spacer 9 includes a height adjusting portion 9a made of an insulating resin and two fixing portions 9b.
  • the height adjusting unit 9a is provided for height adjustment of the first semiconductor element 7, that is, by separating the first semiconductor element 7 from the component surface 6a of the circuit board 6 by a desired height. In order to adjust the height of the first semiconductor element 7 from the surface 6 a, it is installed between the first semiconductor element 7 and the circuit board 6.
  • the two fixing portions 9b are regions for fixing the spacer 9 to the circuit board 6 and the heat radiating body 5, and are provided at both ends in the longitudinal direction of the height adjusting portion 9a.
  • the first semiconductor element 7 is disposed on the height adjusting portion 9 a of the spacer 9.
  • the spacer 9 has a first recess 9c on which the first semiconductor element 7 is placed on the spacer non-substrate side surface 9e.
  • a surface facing the circuit board 6 side is a spacer substrate side surface 9 d and a surface facing the opposite direction to the spacer substrate side surface 9 d is a spacer anti-substrate side surface 9 e.
  • the fixing portion 9b has an annular shape in which a through hole 9ba for inserting a screw is provided in the center.
  • the height adjusting portion 9a is provided in the shape of an elongated bar by connecting the two fixing portions 9b, and has a first recess 9c on the spacer non-substrate side surface 9e.
  • the depth of the first recess 9 c is the same as the thickness of the first semiconductor element 7.
  • the 1st semiconductor element 7 is arrange
  • the height from the component surface 6a of the non-substrate side surface 7b of the first semiconductor element is the same as the height from the component surface 6a of the region other than the first recess 9c and the fixing portion 9b in the height adjusting portion 9a. It is said.
  • a wiring pattern (not shown) can be arranged on the component surface 6 a of the substrate 6.
  • the width and shape of the height adjusting portion 9a are not particularly limited as long as the width and shape can stably hold the first semiconductor element 7.
  • the region other than the first recess 9c in the circuit board 6 and the spacer 9 The fixing portion 9 b and the heat dissipating body 5 are fixed by screws 11. That is, the screw 11 fixes the circuit board 6, the spacer 9, and the radiator 5 in a region other than the region where the first semiconductor element 7 is disposed within the spacer substrate side surface 9 d of the spacer 9.
  • the first semiconductor element 7 is in close contact with the heat sink 5 without bringing the screw 11 into contact with the first semiconductor element 7. 5, the first semiconductor element 7, and the circuit board 6 can be fixed by screws 11.
  • the spacer 9 is disposed between the first semiconductor element 7 and the circuit board 6, and the screw 11 is brought into contact with the first semiconductor element 7.
  • the spacer 9 can be screwed to the radiator 5 without any problem.
  • the spacer 9 is placed on the component surface 6 a of the circuit board 6 by aligning the through hole 9 ba provided in the fixing portion 9 b of the spacer 9.
  • the first semiconductor element 7 is placed in the first recess 9 c in the height adjusting portion 9 a of the spacer 9.
  • the lead terminal 7e of the first semiconductor element 7 is inserted into the through hole 6d formed in the circuit board 6, and soldered to the through hole 6d. Thereby, the spacer 9 is fixed between the first semiconductor element 7 and the circuit board 6.
  • the spacer 9 between the first semiconductor element 7 and the circuit board 6 contact between the first semiconductor element 7 and the circuit board 6 can be avoided, and the circuit from the first semiconductor element 7 to the circuit can be avoided.
  • the thermal influence on the substrate 6 and the thermal influence from the circuit board 6 to the first semiconductor element 7 can be reduced, and the first influence on the circuit board 6 facing the first semiconductor element 7 is the first A pattern made of a conductive material such as a copper foil can be wired on the component surface 6a of the circuit board 6 corresponding to a region not held by the height adjusting portion 9a in the semiconductor element 7.
  • the screw hole 5b provided at the position facing the fixing portion 9b of the spacer 9 on the substrate side surface 5a of the heat radiator is aligned with the position of the through hole 9ba of the spacer 9, so that the heat radiator 5 becomes the first semiconductor element. 7 and on the spacer 9.
  • the circuit board 6 has a through hole 6c in the circuit board 6, a through hole 9ba in the spacer 9, and a screw in the radiator 5 from the side opposite to the component surface 6b that is the second surface of the circuit board 6 facing in the direction opposite to the component surface 6a.
  • the screw 11 is passed through the hole 5 b, and the fixing portion 9 b, which is an area other than the first recess 9 c in the circuit board 6 and the spacer 9, and the heat radiating body 5 are screwed and fixed by the screw 11.
  • the fixing portion 9b which is a region other than the first concave portion 9c in the circuit board 6 and the spacer 9, and the heat radiating body 5 are screwed and fixed by the screw 11 in two regions facing each other across the first concave portion 9c.
  • the first semiconductor element 7 is sandwiched between the bottom surface 9 ca of the first recess in the height adjusting portion 9 a of the spacer 9 and the radiator 5.
  • the circuit board 6, the spacer 9, and the heat radiating body 5 can be stably and surely fixed by screw-fixing with the screw 11 in two regions facing each other across the first recess 9c. Further, since the screw 11 can be fixed by the screw 11 from the side opposite to the component surface 6b, the fixing work is easy.
  • the length of the first recess 9c is the same as that of the first semiconductor element 7 in the longitudinal direction of the height adjusting portion 9a. Thereby, since the movement of the first semiconductor element 7 is restricted in the longitudinal direction of the height adjusting portion 9a, the first semiconductor element 7 is stably held in the first recess 9c. However, even when the length of the first recess 9 c is longer than that of the first semiconductor element 7 in the longitudinal direction of the height adjustment portion 9 a, the first semiconductor element 7 has the first height in the height adjustment portion 9 a of the spacer 9. There is no problem because it is sandwiched and fixed between the bottom surface 9ca of the one recess and the radiator 5.
  • the second semiconductor element 8 in the electrical component box 4 controls the first semiconductor element 7 so that the commercial power supplied to the first semiconductor element 7 is converted into a converter (not shown) in the first semiconductor element 7. Is converted into a DC power source, and a DC power source is converted into an AC power source of a desired frequency by an inverter unit (not shown) in the first semiconductor element 7. The converted AC power is supplied to an electric motor (not shown) built in the compressor 3.
  • the refrigerant circulates in a heat exchanger (not shown) of the outdoor unit 1, and heat exchange is performed between the air around the heat exchanger and the refrigerant.
  • the first semiconductor element 7 and the second semiconductor element 8 are controlled to rotate an electric motor (not shown) that drives the fan 2 at an appropriate rotational speed.
  • the fan 2 rotates, negative pressure is generated, and air on the outside of the heat exchanger is taken into the air blowing chamber of the outdoor unit 1.
  • fever exchange in a heat exchanger is encouraged by the wind which arises at this time flowing through a heat exchanger.
  • the amount of heat generated by the first semiconductor element 7 is increased by controlling the operation of the fan 2 and the compressor 3. The heat is radiated into the blower chamber 1 and the heat is urged by the wind flowing through the blower chamber.
  • the circuit board 6, the fixing portion 9 b of the spacer 9, and the heat radiating body 5 are screw-fixed by the screws 11. That is, in the semiconductor element protection structure according to the first embodiment, the non-substrate side surface 7b of the first semiconductor element is in close contact with the substrate side surface 5a of the radiator without bringing the screw 11 into contact with the first semiconductor element 7. In this state, the heat radiating body 5, the first semiconductor element 7, the spacer 9, and the circuit board 6 can be screw-fixed by the screws 11. With this configuration, since the screw 11 does not contact the first semiconductor element 7, the pressure applied to the first semiconductor element 7 due to vibration during transportation of the outdoor unit 1 is reduced, and the elements inside the first semiconductor element 7 are reduced. The occurrence of destruction can be suppressed.
  • the reliability of the outdoor unit 1 of the air conditioner including the first semiconductor element 7 can be improved and the long-term of the outdoor unit 1 can be improved.
  • the semiconductor element protection structure according to the first embodiment is particularly suitable for a power semiconductor element protection structure.
  • the first semiconductor element 7 and the radiator 5 are screw-fixed, even when the first semiconductor element 7 and the radiator 5 are screw-fixed, the elements inside the first semiconductor element 7 are not fixed. There is a risk of destruction.
  • the first semiconductor element 7 and the heat radiating body 5 are not screw-fixed, so that the pressure on the first semiconductor element 7 can be prevented, and the first semiconductor Occurrence of destruction of the element inside the element 7 can be suppressed.
  • FIG. FIG. 5 is a schematic diagram for explaining a protective structure of a semiconductor element according to the second embodiment of the present invention.
  • An opening 10b of the electrical component box 4 is connected to the radiator 51 from the outside of the electrical component box 4.
  • FIG. 6 is a cross-sectional view showing the protective structure of a semiconductor element according to the second embodiment of the present invention, and is a cross-sectional view taken along line VI-VI in FIG.
  • FIG. 7: is a top view which shows the state which looked at the heat sink 51 of the protection structure of the semiconductor element concerning Embodiment 2 of this invention from the board
  • the semiconductor element protection structure according to the second embodiment is different from the semiconductor element protection structure according to the first embodiment in that a heat radiator 51 is used instead of the heat radiator 5 and a spacer 91 is used instead of the spacer 9. It is the point used.
  • a heat radiator 51 is used instead of the heat radiator 5
  • a spacer 91 is used instead of the spacer 9. It is the point used.
  • the same parts as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. Only different parts will be described here.
  • the first semiconductor element 7 is made to contact the spacer 91 and the radiator without contacting the screw 11 to the first semiconductor element 7 as in the case of the first embodiment.
  • the circuit board 6, the spacer 91, and the heat radiating body 51 are screwed and fixed by the screw 11 while being sandwiched by 51.
  • the radiator 51 is a facing surface facing the first semiconductor element 7, and is a surface facing the circuit board 6 side of the radiator 51, on a substrate facing side 51 a of the radiator, facing the first semiconductor element 7.
  • a second recess 51c is provided.
  • the depth of the second recess 51 c is the same as the thickness of the first semiconductor element 7.
  • the 1st semiconductor element 7 is arrange
  • the second recess 51c is provided in the entire region facing the first semiconductor element 7 on the substrate side surface 51a of the radiator, and the entire surface of the anti-substrate side surface 7b of the first semiconductor element is formed on the bottom surface 51ca of the second recess. It is in close contact.
  • the spacer 91 is not provided with the first recessed portion 9c in the height adjusting portion 9a in the spacer 9 in the first embodiment, and the spacer 91 has a height adjusting portion 91a corresponding to the height adjusting portion 9a in the spacer 9 and a spacer. 9 and the fixing portion 91b corresponding to the fixing portion 9b have the same thickness. Therefore, the spacer non-substrate side surface 91c, which is the surface facing the circuit substrate 6 side in the spacer 91, is a flat shape without unevenness.
  • the first semiconductor element 7 is sandwiched between the spacer non-substrate side surface 91c of the spacer 91 and the bottom surface 51ca of the second recess of the heat radiator 51.
  • the fixing portion 91 b and the radiator 51 in the circuit board 6 and the spacer 91 are screwed by the screw 11. That is, in the semiconductor element protection structure according to the second embodiment, the non-substrate side surface 7 b of the first semiconductor element is not in contact with the second recess of the heat radiator 51 without bringing the screw 11 into contact with the first semiconductor element 7.
  • the heat radiator 51, the spacer 91, and the circuit board 6 can be screwed by the screw 11 in a state of being in close contact with the bottom surface 51ca.
  • the spacer 91 is placed on the component surface 6 a of the circuit board 6 by aligning the through hole 91 ba provided in the fixing portion 91 b of the spacer 91.
  • the first semiconductor element 7 is placed on the height adjusting portion 91 a of the spacer 91.
  • the lead terminal 7e of the first semiconductor element 7 is inserted into the through hole 6d formed in the circuit board 6, and soldered to the through hole 6d. Thereby, the spacer 91 is fixed between the first semiconductor element 7 and the circuit board 6.
  • the spacer 91 between the first semiconductor element 7 and the circuit board 6 contact between the first semiconductor element 7 and the circuit board 6 can be avoided, and the circuit from the first semiconductor element 7 can be avoided.
  • the thermal influence on the substrate 6 and the thermal influence on the first semiconductor element 7 from the circuit board 6 can be reduced, and a conductive material such as a copper foil is provided on the circuit board 6 facing the first semiconductor element 7.
  • the pattern can be wired.
  • the screw hole 51b provided at the position facing the fixing portion 91b of the spacer 91 on the substrate side surface 51a of the heat radiator is aligned with the position of the through hole 91ba of the spacer 91, so that the heat radiator 51 becomes the first semiconductor element. 7 and on the spacer 9.
  • the first semiconductor element 7 is fitted and accommodated in the second recess 51c provided on the substrate side surface 51a of the heat radiating body.
  • the screw 11 is passed through the through hole 6c of the circuit board 6, the through hole 91ba of the spacer 91, and the screw hole 51b of the heat dissipating body 51 from the side opposite to the component surface 6b of the circuit board 6, and the first semiconductor element 7 is the spacer.
  • the fixing portion 91b and the heat dissipating body 51 of the circuit board 6 and the spacer 91 are screw-fixed by the screw 11 in a state sandwiched between the spacer non-substrate side surface 91c of 91 and the bottom surface 51ca of the second recess of the heat dissipating body 51.
  • the circuit board 6, the fixing portion 91b of the spacer 91, and the heat radiating body 51 are screw-fixed by the screw 11 in two regions facing each other with the second recess 51c interposed therebetween.
  • the protective structure of the semiconductor element according to the second embodiment is the same as the protective structure of the semiconductor element according to the first embodiment, without bringing the screw 11 into contact with the first semiconductor element 7.
  • the heat dissipating body 51, the spacer 91, and the circuit board 6 can be screwed together with the screw 11 in a state where the opposite side surface 7 b of the semiconductor element 1 is in close contact with the bottom surface 51 ca of the second recess of the heat dissipating body 51. Therefore, according to the semiconductor element protection structure according to the second embodiment, the same effect as the semiconductor element protection structure according to the first embodiment can be obtained.
  • the semiconductor element protection structure according to the first and second embodiments is applied to the outdoor unit 1 of an air conditioner.
  • Such a semiconductor element protection structure may be applied to an indoor unit of an air conditioner.
  • the same effect as described above can be obtained, and the reliability of the indoor unit of the air conditioner including the semiconductor element can be improved, and the indoor unit can be used for a long time.
  • the configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
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  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Provided is a protective structure of a semiconductor element, comprising: a circuit substrate (6); a spacer (9) disposed on a first surface of the circuit substrate (6); a semiconductor element disposed on the spacer (9); a heat dissipation body (5) that is disposed on the semiconductor element and in regions on the spacer (9) other than where the semiconductor element is disposed, the heat dissipation body (5) being in contact with a non-substrate-facing surface of the element, such surface opposite the surface of the semiconductor element facing the circuit substrate (6); and screws (11) that screw and hold in place the circuit substrate (6), the spacer (9), and the heat dissipation body (5), within a plane of a substrate-facing spacer surface (9d) of the spacer (9), such surface facing the circuit substrate (6), and in regions other than where the semiconductor element is disposed.

Description

半導体素子の保護構造および空気調和機Semiconductor device protection structure and air conditioner
　本発明は、半導体素子の保護構造および空気調和機に関するものである。 The present invention relates to a semiconductor element protection structure and an air conditioner.
　空気調和機の室外機には、圧縮機、熱交換器、送風機、および送風機を駆動する電動機といった装置が設置され、さらに圧縮機および電動機を駆動制御するためのパワー半導体素子といった半導体素子が実装された回路基板を収納する電気品箱が設置されている。 In the outdoor unit of the air conditioner, devices such as a compressor, a heat exchanger, a blower, and an electric motor that drives the blower are installed, and further, a semiconductor element such as a power semiconductor element for driving and controlling the compressor and the electric motor is mounted. An electrical box that houses the circuit board is installed.
　従来、この種の半導体素子を回路基板に実装する際には、半導体素子の高さ出しに用いるスペーサが回路基板と半導体素子との間に設けられている。特許文献１では、放熱体が取り付けられた回路基板と半導体素子との間にスペーサを設けることで、半導体素子と回路基板との接触を避けて、半導体素子から回路基板への熱的影響を少なくするとともに半導体素子と回路基板との間に銅箔などのパターンを配置可能とする構造が開示されている。 Conventionally, when this type of semiconductor element is mounted on a circuit board, a spacer used for raising the height of the semiconductor element is provided between the circuit board and the semiconductor element. In Patent Document 1, by providing a spacer between a semiconductor substrate and a circuit board to which a heat dissipating body is attached, contact between the semiconductor element and the circuit board is avoided, and a thermal influence from the semiconductor element to the circuit board is reduced. In addition, a structure is disclosed in which a pattern such as a copper foil can be arranged between a semiconductor element and a circuit board.
特開２０１５－１３３４５４号公報Japanese Patent Laying-Open No. 2015-133454
　しかしながら、上記特許文献１の技術によれば、半導体素子と放熱体とが螺子固定されており、螺子が半導体素子と接触している構造とされている。このため、半導体素子と放熱体との螺子による取り付け時の振動、または半導体素子が取り付けられた電気品の輸送時の振動による圧力が半導体素子において螺子が接触している部分にかかり、半導体素子の内部の素子の破壊が発生するおそれがある。 However, according to the technique disclosed in Patent Document 1, the semiconductor element and the heat dissipating body are screw-fixed, and the screw is in contact with the semiconductor element. For this reason, the vibration due to the screw between the semiconductor element and the heat radiating member or the vibration due to the vibration during the transportation of the electrical product to which the semiconductor element is attached is applied to the portion of the semiconductor element where the screw is in contact, There is a risk of destruction of internal elements.
　すなわち、特許文献１で用いられているスペーサは、振動による半導体素子の内部の素子の破壊の防止を考慮した構造ではないため、半導体素子の高さ出しの機能を有しながら、振動による半導体素子の内部の素子の破壊を防止することで電気品の信頼性を向上させる、というニーズに対応することができない、という問題があった。 That is, the spacer used in Patent Document 1 does not have a structure in consideration of prevention of destruction of the elements inside the semiconductor element due to vibration. Therefore, the semiconductor element due to vibration has a function of raising the height of the semiconductor element. There is a problem that it is not possible to meet the need to improve the reliability of electrical products by preventing the destruction of the elements inside.
　本発明は、上記に鑑みてなされたものであって、半導体素子を備えた電気品の信頼性の向上を図ることができる半導体素子の保護構造を得ることを目的とする。 The present invention has been made in view of the above, and an object of the present invention is to obtain a protective structure of a semiconductor element that can improve the reliability of an electrical product including the semiconductor element.
　上述した課題を解決し、目的を達成するために、本発明にかかる半導体素子の保護構造は、回路基板と、回路基板の第１面上に配置されたスペーサと、スペーサ上に配置された半導体素子と、半導体素子の回路基板を向く面と反対方向を向く素子反基板側面と接触した状態で、スペーサ上における半導体素子の配置領域以外の領域および半導体素子上に配置された放熱体と、スペーサの回路基板を向くスペーサ基板側面の面内における半導体素子の配置領域以外の領域で回路基板とスペーサと放熱体とを螺子固定する螺子と、を備える。 In order to solve the above-described problems and achieve the object, a protective structure for a semiconductor device according to the present invention includes a circuit board, a spacer disposed on the first surface of the circuit board, and a semiconductor disposed on the spacer. A region other than the region where the semiconductor element is disposed on the spacer and a heat dissipating member disposed on the semiconductor element in a state where the element is in contact with the side opposite to the surface facing the circuit board of the semiconductor element. A screw that fixes the circuit board, the spacer, and the heat dissipating member in a region other than the region where the semiconductor element is disposed in the side surface of the spacer substrate facing the circuit board.
　本発明にかかる半導体素子の保護構造は、半導体素子備えた電気品の信頼性の向上を図ることができる半導体素子の保護構造が得られる、という効果を奏する。 The semiconductor element protection structure according to the present invention has the effect of providing a semiconductor element protection structure capable of improving the reliability of an electrical product provided with the semiconductor element.
本発明の実施の形態１にかかる半導体素子の保護構造を備えた空気調和機の室外機の構成を示す構成図The block diagram which shows the structure of the outdoor unit of the air conditioner provided with the protection structure of the semiconductor element concerning Embodiment 1 of this invention. 本発明の実施の形態１にかかる空気調和機の室外機の電気品箱の構成を示す斜視図The perspective view which shows the structure of the electrical component box of the outdoor unit of the air conditioner concerning Embodiment 1 of this invention. 本発明の実施の形態１にかかる半導体素子の保護構造を説明するための模式図であり、電気品箱の開口部を電気品箱の外部側から放熱体を透過して見た場合について示す模式図It is a schematic diagram for demonstrating the protection structure of the semiconductor element concerning Embodiment 1 of this invention, and is the model shown about the case where the opening part of an electrical component box is seen through a heat radiator from the exterior side of an electrical component box Figure 本発明の実施の形態１にかかる半導体素子の保護構造を表す断面図であり、図３における線分ＩＶ－ＩＶにおける断面図4 is a cross-sectional view showing the protective structure of the semiconductor element according to the first embodiment of the present invention, and is a cross-sectional view taken along line IV-IV in FIG. 本発明の実施の形態２にかかる半導体素子の保護構造を説明するための模式図であり、電気品箱の開口部を電気品箱の外部側から放熱体を透過して見た場合について示す模式図It is a schematic diagram for demonstrating the protection structure of the semiconductor element concerning Embodiment 2 of this invention, and is the model shown about the case where the opening part of an electrical component box is seen through a heat radiator from the exterior side of an electrical component box Figure 本発明の実施の形態２にかかる半導体素子の保護構造を表す断面図であり、図５における線分ＶＩ－ＶＩにおける断面図FIG. 6 is a cross-sectional view showing a protective structure of a semiconductor element according to a second embodiment of the present invention, and is a cross-sectional view taken along line VI-VI in FIG. 本発明の実施の形態２にかかる半導体素子の保護構造の放熱体を回路基板側を向く面である放熱体の基板側面から見た状態を示す平面図The top view which shows the state which looked at the heat radiator of the protection structure of the semiconductor element concerning Embodiment 2 of this invention from the board | substrate side surface of the heat sink which is a surface which faces the circuit board side.
　以下に、本発明の実施の形態にかかる半導体素子の保護構造および空気調和機を図面に基づいて詳細に説明する。なお、この実施の形態によりこの発明が限定されるものではない。また、以下に示す図面においては、理解の容易のため、各部材の縮尺が実際とは異なる場合がある。各図面間においても同様である。また、理解の容易のため、断面図以外の図にハッチングを付す場合がある。 Hereinafter, a semiconductor element protection structure and an air conditioner according to an embodiment of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments. In the drawings shown below, the scale of each member may be different from the actual scale for easy understanding. The same applies between the drawings. Further, for ease of understanding, hatching may be added to drawings other than the cross-sectional view.
実施の形態１．
　図１は、本発明の実施の形態１にかかる半導体素子の保護構造を備えた空気調和機の室外機１の構成を示す構成図である。図１においては、室外機１の壁面を透過して見た状態を示している。図２は、本発明の実施の形態１にかかる空気調和機の室外機１の電気品箱４の構成を示す斜視図である。図２においては、電気品箱４の壁面を透過して見た状態を示している。また、図１および図２においては、主要な構成について示している。図３は、本発明の実施の形態１にかかる半導体素子の保護構造を説明するための模式図であり、電気品箱４の開口部１０ｂを電気品箱４の外部側から、放熱体５を透過して見た場合について示す模式図である。図４は、本発明の実施の形態１にかかる半導体素子の保護構造を表す断面図であり、図３における線分ＩＶ－ＩＶにおける断面図である。 Embodiment 1 FIG.
FIG. 1 is a configuration diagram illustrating a configuration of an outdoor unit 1 of an air conditioner including a semiconductor element protection structure according to a first embodiment of the present invention. In FIG. 1, the state seen through the wall surface of the outdoor unit 1 is shown. FIG. 2 is a perspective view illustrating a configuration of the electrical component box 4 of the outdoor unit 1 of the air conditioner according to the first embodiment of the present invention. In FIG. 2, the state seen through the wall surface of the electrical component box 4 is shown. 1 and 2 show the main configuration. FIG. 3 is a schematic diagram for explaining the protective structure of the semiconductor element according to the first embodiment of the present invention. The opening 10b of the electrical component box 4 is connected to the radiator 5 from the outside of the electrical component box 4. It is a schematic diagram shown about the case where it sees through. FIG. 4 is a cross-sectional view showing the protective structure of the semiconductor device according to the first embodiment of the present invention, and is a cross-sectional view taken along line IV-IV in FIG.
　図１に示す室外機１は、空気調和機の一部を構成する室外機であり、冷媒を圧縮する圧縮機３と、図示しない熱交換器に外気を送り込むファン２と、圧縮機３およびファン２を駆動制御する回路を搭載した回路基板６といった部品を収納する電気品箱４などが設置されている。空気調和機は、屋外に配置された室外機１と、室内に配置された図示しない室内機と、を備える。室外機１と室内機とは、冷媒配管および内外通信線で接続されており、冷媒配管には熱交換を行うための冷媒が流れている。空気調和機は、１つの完結した冷凍サイクルを室外機１と室内機とで形成している。空気調和機は、冷媒配管を通って室外機１と室内機との間を循環する冷媒を使用して、空調対象空間である室内の空気と室外の空気との間で熱移動を行い、室内に対する空気調和を実現する。 An outdoor unit 1 shown in FIG. 1 is an outdoor unit that constitutes a part of an air conditioner, and includes a compressor 3 that compresses refrigerant, a fan 2 that sends outside air to a heat exchanger (not shown), a compressor 3, and a fan. An electrical component box 4 for storing components such as a circuit board 6 on which a circuit for driving and controlling 2 is mounted. The air conditioner includes an outdoor unit 1 arranged outdoors and an indoor unit (not shown) arranged indoors. The outdoor unit 1 and the indoor unit are connected by a refrigerant pipe and an internal / external communication line, and a refrigerant for performing heat exchange flows through the refrigerant pipe. The air conditioner forms one complete refrigeration cycle with the outdoor unit 1 and the indoor unit. The air conditioner uses a refrigerant that circulates between the outdoor unit 1 and the indoor unit through the refrigerant pipe, performs heat transfer between the indoor air that is the air-conditioning target space and the outdoor air, To achieve air conditioning.
　図２から図４に示すように、電気品箱４は、主たる構成として、直方体状に構成された筐体１０と、筐体１０の内部に固定される回路基板６と、回路基板６において電子部品が搭載される回路基板６の第１面である部品面６ａに実装されたリードタイプの第１の半導体素子７と、回路基板６の部品面６ａに実装された第２の半導体素子８と、回路基板６の部品面６ａに実装されて第１凹部９ｃに第１の半導体素子７が載置されたスペーサ９と、ファン２による送風が当たるように第１の半導体素子の反基板側面７ｂと接触して配置された放熱体５と、を有して構成されている。第１の半導体素子７においては、回路基板６側を向く面を素子基板側面である第１の半導体素子の基板側面７ａとし、素子基板側面と反対方向を向く面を素子反基板側面である第１の半導体素子の反基板側面７ｂとする。 As shown in FIG. 2 to FIG. 4, the electrical component box 4 mainly includes a casing 10 configured in a rectangular parallelepiped shape, a circuit board 6 fixed inside the casing 10, and an electronic circuit in the circuit board 6. A lead-type first semiconductor element 7 mounted on a component surface 6a that is a first surface of a circuit board 6 on which a component is mounted, and a second semiconductor element 8 mounted on the component surface 6a of the circuit board 6 The spacer 9 mounted on the component surface 6a of the circuit board 6 and on which the first semiconductor element 7 is placed in the first recess 9c, and the anti-substrate side face 7b of the first semiconductor element so as to be blown by the fan 2 And a heat dissipating member 5 disposed in contact with the heat dissipating member. In the first semiconductor element 7, the surface facing the circuit substrate 6 side is the substrate side surface 7 a of the first semiconductor element, which is the element substrate side surface, and the surface facing the direction opposite to the element substrate side surface is the element opposite substrate side surface. The side surface 7b is the opposite side of the semiconductor element 1.
　放熱体５は、第１の半導体素子の反基板側面７ｂと接触した状態で第１の半導体素子７上およびスペーサ９上における第１の半導体素子７の配置領域以外の領域に、配置されている。すなわち、放熱体５は、スペーサ９上における第１の半導体素子７の配置領域以外の領域および第１の半導体素子７上を覆って配置されている。放熱体５の回路基板６側を向く面である放熱体の基板側面５ａが、第１の半導体素子の反基板側面７ｂと密着している。放熱体の基板側面５ａは、第１の半導体素子７から放熱体５への熱伝導効率を高めるために第１の半導体素子の反基板側面７ｂと同じ形状とされている。放熱体５は、銅またはアルミニウムといった熱伝導率の高い材料によって構成されている。 The radiator 5 is disposed in a region other than the region where the first semiconductor element 7 is disposed on the first semiconductor element 7 and the spacer 9 while being in contact with the non-substrate side surface 7b of the first semiconductor element. . That is, the heat radiator 5 is disposed so as to cover the region other than the region where the first semiconductor element 7 is disposed on the spacer 9 and the first semiconductor element 7. A substrate side surface 5a of the radiator that is a surface facing the circuit board 6 side of the radiator 5 is in close contact with the non-substrate side surface 7b of the first semiconductor element. The substrate side surface 5a of the heat radiating body has the same shape as the non-substrate side surface 7b of the first semiconductor element in order to increase the heat conduction efficiency from the first semiconductor element 7 to the heat radiating body 5. The radiator 5 is made of a material having high thermal conductivity such as copper or aluminum.
　筐体１０においてファン２による送風が流れる側の側面である風路側の側面１０ａには、筐体１０の内部を筐体１０の外部と連通させて第１の半導体素子の反基板側面７ｂが筐体１０の風路側の側面１０ａに露出するように形成された開口部１０ｂが設けられている。回路基板６は、面内方向が筐体１０の風路側の側面１０ａの面内方向と平行とされて、筐体１０の風路側の側面１０ａに部品面６ａが対向した状態で設けられている。回路基板６は、図示しない螺子によって筐体１０の風路側の側面１０ａに固定されている。 A side surface 10a on the air passage side, which is a side surface on the side where the air blown by the fan 2 flows, in the housing 10 is communicated with the outside of the housing 10 so that the opposite side surface 7b of the first semiconductor element is the housing. An opening 10b formed so as to be exposed on the side surface 10a on the air passage side of the body 10 is provided. The circuit board 6 is provided in a state where the in-plane direction is parallel to the in-plane direction of the side surface 10 a on the air path side of the housing 10 and the component surface 6 a faces the side surface 10 a of the air path side of the housing 10. . The circuit board 6 is fixed to the side surface 10a on the air passage side of the housing 10 by a screw (not shown).
　第１の半導体素子７はパワー半導体素子であり、絶縁ゲートバイポーラトランジスタ（Ｉｎｓｕｌａｔｅｄ　Ｇａｔｅ　Ｂｉｐｏｌａｒ　Ｔｒａｎｓｉｓｔｏｒ）または帰還ダイオードといった部品で構成された電力変換部を成すものである。第１の半導体素子７は、直方体形状を有し、回路基板６の部品面６ａにおいて、筐体１０の風路側の側面１０ａにおける開口部１０ｂに対応する位置に設けられている。第１の半導体素子の反基板側面７ｂは、例えば図４に示すように、筐体１０の風路側の側面１０ａと同一面上に配設されている。また、第１の半導体素子７は、対向する一対の側面７ｃおよび側面７ｄに、複数のリード端子７ｅが設けられている。 The first semiconductor element 7 is a power semiconductor element, and constitutes a power conversion unit composed of components such as an insulated gate bipolar transistor (Insulated Gate Bipolar Transistor) or a feedback diode. The first semiconductor element 7 has a rectangular parallelepiped shape, and is provided on the component surface 6 a of the circuit board 6 at a position corresponding to the opening 10 b on the side surface 10 a on the air passage side of the housing 10. The anti-substrate side surface 7b of the first semiconductor element is disposed on the same surface as the side surface 10a on the air passage side of the housing 10, for example, as shown in FIG. In addition, the first semiconductor element 7 is provided with a plurality of lead terminals 7e on a pair of side surfaces 7c and 7d facing each other.
　第２の半導体素子８は、電力変換部をパルス幅変調（Ｐｕｌｓｅ　Ｗｉｄｔｈ　Ｍｏｄｕｌａｔｉｏｎ：ＰＷＭ）駆動する駆動信号を生成するＰＷＭ信号生成回路、および交流電源に含まれるノイズを除去するためのノイズフィルタ回路といった回路を成すものである。第２の半導体素子８は、回路基板６側を向く面と反対方向を向く素子反基板側面である第２の半導体素子の反基板側面８ａが筐体１０の風路側の側面１０ａと対向した状態で回路基板６の部品面６ａに設けられている。なお、第１の半導体素子７および第２の半導体素子８の配置位置は、図示例の位置に限定されるものではない。 The second semiconductor element 8 includes a PWM signal generation circuit that generates a drive signal for driving the power conversion unit in pulse width modulation (PWM), and a noise filter circuit for removing noise included in the AC power supply. A circuit is formed. The second semiconductor element 8 is a state in which the opposite side surface 8a of the second semiconductor element, which is the opposite side surface of the element facing the circuit substrate 6 side, faces the side surface 10a on the air path side of the housing 10. And provided on the component surface 6 a of the circuit board 6. The arrangement positions of the first semiconductor element 7 and the second semiconductor element 8 are not limited to the positions in the illustrated example.
　スペーサ９は、絶縁性を有する樹脂によって構成された高さ調整部９ａと２つの固定部９ｂとを備える。高さ調整部９ａは、第１の半導体素子７の高さ出しのため、すなわち、第１の半導体素子７を回路基板６の部品面６ａから所望の高さだけ離間させて回路基板６の部品面６ａからの第１の半導体素子７の高さを調整するために第１の半導体素子７と回路基板６との間に設置されている。２つの固定部９ｂは、スペーサ９を回路基板６および放熱体５と固定するための領域であって高さ調整部９ａの長手方向における両端側に設けられている。第１の半導体素子７は、スペーサ９の高さ調整部９ａ上に配置されている。また、スペーサ９は、第１の半導体素子７を載置する第１凹部９ｃをスペーサ反基板側面９ｅに有する。スペーサ９においては、回路基板６側を向く面をスペーサ基板側面９ｄとし、スペーサ基板側面９ｄと反対方向を向く面をスペーサ反基板側面９ｅとする。 The spacer 9 includes a height adjusting portion 9a made of an insulating resin and two fixing portions 9b. The height adjusting unit 9a is provided for height adjustment of the first semiconductor element 7, that is, by separating the first semiconductor element 7 from the component surface 6a of the circuit board 6 by a desired height. In order to adjust the height of the first semiconductor element 7 from the surface 6 a, it is installed between the first semiconductor element 7 and the circuit board 6. The two fixing portions 9b are regions for fixing the spacer 9 to the circuit board 6 and the heat radiating body 5, and are provided at both ends in the longitudinal direction of the height adjusting portion 9a. The first semiconductor element 7 is disposed on the height adjusting portion 9 a of the spacer 9. In addition, the spacer 9 has a first recess 9c on which the first semiconductor element 7 is placed on the spacer non-substrate side surface 9e. In the spacer 9, a surface facing the circuit board 6 side is a spacer substrate side surface 9 d and a surface facing the opposite direction to the spacer substrate side surface 9 d is a spacer anti-substrate side surface 9 e.
　固定部９ｂは、螺子を挿通させるための貫通孔９ｂａが中央に設けられている環状形状を有している。高さ調整部９ａは、２つの固定部９ｂを連結して細長の棒状に設けられており、スペーサ反基板側面９ｅに第１凹部９ｃを有する。第１凹部９ｃの深さは、第１の半導体素子７の厚みと同じ寸法とされている。そして、第１の半導体素子７は、第１凹部９ｃに嵌め込まれた状態で配置されている。また、固定部９ｂにおける第１凹部９ｃ以外の領域の高さは、高さ調整部９ａと同じ高さとされている。これにより、第１の半導体素子の反基板側面７ｂの部品面６ａからの高さは、高さ調整部９ａにおける第１凹部９ｃ以外の領域および固定部９ｂの部品面６ａからの高さと同じ高さとされている。 The fixing portion 9b has an annular shape in which a through hole 9ba for inserting a screw is provided in the center. The height adjusting portion 9a is provided in the shape of an elongated bar by connecting the two fixing portions 9b, and has a first recess 9c on the spacer non-substrate side surface 9e. The depth of the first recess 9 c is the same as the thickness of the first semiconductor element 7. And the 1st semiconductor element 7 is arrange | positioned in the state inserted by the 1st recessed part 9c. Further, the height of the region other than the first recess 9c in the fixing portion 9b is the same as that of the height adjusting portion 9a. Thereby, the height from the component surface 6a of the non-substrate side surface 7b of the first semiconductor element is the same as the height from the component surface 6a of the region other than the first recess 9c and the fixing portion 9b in the height adjusting portion 9a. It is said.
　高さ調整部９ａの形状を、第１の半導体素子７の面積よりも狭い細長の棒状とすることによって、第１の半導体素子７における高さ調整部９ａで保持されていない領域に対応する回路基板６の部品面６ａに、図示しない配線パターンを配置することができる。高さ調整部９ａの幅および形状は、第１の半導体素子７を安定して保持できる幅および形状であればよく、特に限定されない。 A circuit corresponding to a region of the first semiconductor element 7 that is not held by the height adjustment section 9a by making the shape of the height adjustment section 9a narrow and narrower than the area of the first semiconductor element 7. A wiring pattern (not shown) can be arranged on the component surface 6 a of the substrate 6. The width and shape of the height adjusting portion 9a are not particularly limited as long as the width and shape can stably hold the first semiconductor element 7.
　そして、第１の半導体素子７がスペーサ９の高さ調整部９ａにおける第１凹部の底面９ｃａと放熱体５とで挟まれた状態で、回路基板６とスペーサ９における第１凹部９ｃ以外の領域である固定部９ｂと放熱体５とが、螺子１１によって螺子固定されている。すなわち、螺子１１は、スペーサ９のスペーサ基板側面９ｄの面内における第１の半導体素子７の配置領域以外の領域で回路基板６とスペーサ９と放熱体５とを固定する。これにより、本実施の形態１にかかる半導体素子の保護構造では、第１の半導体素子７に螺子１１を接触させることなく、第１の半導体素子７が放熱体５に密着した状態で、放熱体５と第１の半導体素子７と回路基板６を螺子１１によって螺子固定することができる。 Then, in the state where the first semiconductor element 7 is sandwiched between the bottom surface 9ca of the first recess in the height adjusting portion 9a of the spacer 9 and the heat dissipating body 5, the region other than the first recess 9c in the circuit board 6 and the spacer 9 The fixing portion 9 b and the heat dissipating body 5 are fixed by screws 11. That is, the screw 11 fixes the circuit board 6, the spacer 9, and the radiator 5 in a region other than the region where the first semiconductor element 7 is disposed within the spacer substrate side surface 9 d of the spacer 9. Thus, in the semiconductor element protection structure according to the first embodiment, the first semiconductor element 7 is in close contact with the heat sink 5 without bringing the screw 11 into contact with the first semiconductor element 7. 5, the first semiconductor element 7, and the circuit board 6 can be fixed by screws 11.
　放熱体５と第１の半導体素子７とを回路基板６に螺子固定するための螺子１１が第１の半導体素子７に接触している場合には、室外機１の輸送時の振動による圧力が第１の半導体素子７の内部であって螺子１１が接触している部分にかかり、第１の半導体素子７の内部の素子の破壊が発生するおそれがある。 When the screw 11 for screw-fixing the radiator 5 and the first semiconductor element 7 to the circuit board 6 is in contact with the first semiconductor element 7, the pressure due to vibration during transportation of the outdoor unit 1 is reduced. There is a risk that the element inside the first semiconductor element 7 will be damaged by being applied to the part inside the first semiconductor element 7 where the screw 11 is in contact.
　しかしながら、本実施の形態１にかかる半導体素子の保護構造では、スペーサ９が第１の半導体素子７と回路基板６との間に配置され、且つ、第１の半導体素子７に螺子１１を接触させることなくスペーサ９を放熱体５と螺子固定できる。この構成により、室外機１の輸送時の振動による圧力が第１の半導体素子７の内部にかかることを防ぐことができ、第１の半導体素子７の内部の素子の破壊の発生を抑制することができる。 However, in the semiconductor element protection structure according to the first embodiment, the spacer 9 is disposed between the first semiconductor element 7 and the circuit board 6, and the screw 11 is brought into contact with the first semiconductor element 7. The spacer 9 can be screwed to the radiator 5 without any problem. With this configuration, it is possible to prevent pressure due to vibration during transportation of the outdoor unit 1 from being applied to the inside of the first semiconductor element 7, and to suppress the occurrence of destruction of elements inside the first semiconductor element 7. Can do.
　上述した本実施の形態１にかかる半導体素子の保護構造を形成するには、第１の半導体素子７を回路基板６に搭載する前に、回路基板６に形成された貫通孔６ｃの位置に、スペーサ９の固定部９ｂに設けられた貫通孔９ｂａを位置合わせして回路基板６の部品面６ａ上にスペーサ９が載置される。つぎに、スペーサ９の高さ調整部９ａにおける第１凹部９ｃに第１の半導体素子７が載置される。また、第１の半導体素子７のリード端子７ｅが、回路基板６に形成されたスルーホール６ｄに挿入され、スルーホール６ｄにはんだ付けされる。これにより、スペーサ９が、第１の半導体素子７と回路基板６との間に固定される。 In order to form the protective structure of the semiconductor element according to the first embodiment described above, before mounting the first semiconductor element 7 on the circuit board 6, the position of the through hole 6c formed in the circuit board 6 is The spacer 9 is placed on the component surface 6 a of the circuit board 6 by aligning the through hole 9 ba provided in the fixing portion 9 b of the spacer 9. Next, the first semiconductor element 7 is placed in the first recess 9 c in the height adjusting portion 9 a of the spacer 9. Further, the lead terminal 7e of the first semiconductor element 7 is inserted into the through hole 6d formed in the circuit board 6, and soldered to the through hole 6d. Thereby, the spacer 9 is fixed between the first semiconductor element 7 and the circuit board 6.
　このように、第１の半導体素子７と回路基板６との間にスペーサ９を設けることにより、第１の半導体素子７と回路基板６との接触を避けて、第１の半導体素子７から回路基板６への熱的影響および回路基板６から第１の半導体素子７への熱的影響を少なくすることができるとともに、第１の半導体素子７と対向する回路基板６上であって第１の半導体素子７における高さ調整部９ａで保持されていない領域に対応する回路基板６の部品面６ａに銅箔といった導電材料によるパターンを配線することができる。 In this way, by providing the spacer 9 between the first semiconductor element 7 and the circuit board 6, contact between the first semiconductor element 7 and the circuit board 6 can be avoided, and the circuit from the first semiconductor element 7 to the circuit can be avoided. The thermal influence on the substrate 6 and the thermal influence from the circuit board 6 to the first semiconductor element 7 can be reduced, and the first influence on the circuit board 6 facing the first semiconductor element 7 is the first A pattern made of a conductive material such as a copper foil can be wired on the component surface 6a of the circuit board 6 corresponding to a region not held by the height adjusting portion 9a in the semiconductor element 7.
　その後、放熱体の基板側面５ａにおけるスペーサ９の固定部９ｂに対向する位置に設けられた螺子孔５ｂをスペーサ９の貫通孔９ｂａの位置に位置合わせして、放熱体５が第１の半導体素子７上およびスペーサ９上に配置される。 Thereafter, the screw hole 5b provided at the position facing the fixing portion 9b of the spacer 9 on the substrate side surface 5a of the heat radiator is aligned with the position of the through hole 9ba of the spacer 9, so that the heat radiator 5 becomes the first semiconductor element. 7 and on the spacer 9.
　そして、回路基板６において部品面６ａと反対方向を向く回路基板６の第２面である反部品面６ｂ側から、回路基板６の貫通孔６ｃ、スペーサ９の貫通孔９ｂａおよび放熱体５の螺子孔５ｂに螺子１１が通され、回路基板６とスペーサ９における第１凹部９ｃ以外の領域である固定部９ｂと放熱体５とが螺子１１によって螺子固定される。これにより、回路基板６とスペーサ９における第１凹部９ｃ以外の領域である固定部９ｂと放熱体５とが、第１凹部９ｃを挟んで対向する２箇所の領域で螺子１１によって螺子固定される。これにより、第１の半導体素子７がスペーサ９の高さ調整部９ａにおける第１凹部の底面９ｃａと放熱体５とで挟まれた状態となる。 The circuit board 6 has a through hole 6c in the circuit board 6, a through hole 9ba in the spacer 9, and a screw in the radiator 5 from the side opposite to the component surface 6b that is the second surface of the circuit board 6 facing in the direction opposite to the component surface 6a. The screw 11 is passed through the hole 5 b, and the fixing portion 9 b, which is an area other than the first recess 9 c in the circuit board 6 and the spacer 9, and the heat radiating body 5 are screwed and fixed by the screw 11. As a result, the fixing portion 9b, which is a region other than the first concave portion 9c in the circuit board 6 and the spacer 9, and the heat radiating body 5 are screwed and fixed by the screw 11 in two regions facing each other across the first concave portion 9c. . As a result, the first semiconductor element 7 is sandwiched between the bottom surface 9 ca of the first recess in the height adjusting portion 9 a of the spacer 9 and the radiator 5.
　第１凹部９ｃを挟んで対向する２箇所の領域で螺子１１によって螺子固定することで、回路基板６とスペーサ９と放熱体５とを安定して確実に固定することができる。また、反部品面６ｂ側から螺子１１によって螺子固定できるため、固定作業が容易である。 The circuit board 6, the spacer 9, and the heat radiating body 5 can be stably and surely fixed by screw-fixing with the screw 11 in two regions facing each other across the first recess 9c. Further, since the screw 11 can be fixed by the screw 11 from the side opposite to the component surface 6b, the fixing work is easy.
　なお、高さ調整部９ａの長手方向において、第１凹部９ｃの長さは、第１の半導体素子７と同じ寸法とされる。これにより、高さ調整部９ａの長手方向において第１の半導体素子７の動きが規制されるため、第１凹部９ｃにおいて第１の半導体素子７が安定して保持される。ただし、高さ調整部９ａの長手方向において、第１凹部９ｃの長さが、第１の半導体素子７よりも長い場合でも、第１の半導体素子７はスペーサ９の高さ調整部９ａにおける第１凹部の底面９ｃａと放熱体５とで挟まれて固定されるため問題はない。 It should be noted that the length of the first recess 9c is the same as that of the first semiconductor element 7 in the longitudinal direction of the height adjusting portion 9a. Thereby, since the movement of the first semiconductor element 7 is restricted in the longitudinal direction of the height adjusting portion 9a, the first semiconductor element 7 is stably held in the first recess 9c. However, even when the length of the first recess 9 c is longer than that of the first semiconductor element 7 in the longitudinal direction of the height adjustment portion 9 a, the first semiconductor element 7 has the first height in the height adjustment portion 9 a of the spacer 9. There is no problem because it is sandwiched and fixed between the bottom surface 9ca of the one recess and the radiator 5.
　以下、室外機１の動作を説明する。電気品箱４内の第２の半導体素子８が第１の半導体素子７を制御することによって、第１の半導体素子７に供給された商用電源が、第１の半導体素子７内の図示しないコンバータ部で直流電源に変換され、第１の半導体素子７内の図示しないインバータ部で直流電源が所望周波数の交流電源に変換される。変換された交流電源は圧縮機３に内蔵された図示しない電動機へ供給される。 Hereinafter, the operation of the outdoor unit 1 will be described. The second semiconductor element 8 in the electrical component box 4 controls the first semiconductor element 7 so that the commercial power supplied to the first semiconductor element 7 is converted into a converter (not shown) in the first semiconductor element 7. Is converted into a DC power source, and a DC power source is converted into an AC power source of a desired frequency by an inverter unit (not shown) in the first semiconductor element 7. The converted AC power is supplied to an electric motor (not shown) built in the compressor 3.
　交流電源が供給された圧縮機３が動作することによって、室外機１の図示しない熱交換器には冷媒が循環し、熱交換器の周囲の空気と冷媒との間で熱交換が行われる。このとき、第１の半導体素子７および第２の半導体素子８では、ファン２を駆動する図示しない電動機を適当な回転数で回転させる制御が行われる。ファン２が回転することで負圧が発生し、熱交換器の外部側の空気が室外機１の送風室に取り込まれる。そして、このとき生じる風が熱交換器を通流することによって、熱交換器における熱交換が促される。一方、ファン２および圧縮機３の運転制御が行われることによって第１の半導体素子７の発熱量が増大するが、第１の半導体素子７で発生した熱は、放熱体５を介して室外機１の送風室内に放熱され、送風室を通流する風によってその放熱が促される。 When the compressor 3 to which AC power is supplied operates, the refrigerant circulates in a heat exchanger (not shown) of the outdoor unit 1, and heat exchange is performed between the air around the heat exchanger and the refrigerant. At this time, the first semiconductor element 7 and the second semiconductor element 8 are controlled to rotate an electric motor (not shown) that drives the fan 2 at an appropriate rotational speed. As the fan 2 rotates, negative pressure is generated, and air on the outside of the heat exchanger is taken into the air blowing chamber of the outdoor unit 1. And the heat | fever exchange in a heat exchanger is encouraged by the wind which arises at this time flowing through a heat exchanger. On the other hand, the amount of heat generated by the first semiconductor element 7 is increased by controlling the operation of the fan 2 and the compressor 3. The heat is radiated into the blower chamber 1 and the heat is urged by the wind flowing through the blower chamber.
　上述したように、本実施の形態１にかかる半導体素子の保護構造は、回路基板６とスペーサ９の固定部９ｂと放熱体５とが、螺子１１によって螺子固定されている。すなわち、本実施の形態１にかかる半導体素子の保護構造では、第１の半導体素子７に螺子１１を接触させることなく、第１の半導体素子の反基板側面７ｂが放熱体の基板側面５ａに密着した状態で、放熱体５と第１の半導体素子７とスペーサ９と回路基板６とを螺子１１によって螺子固定することができる。この構成により、螺子１１が第１の半導体素子７に接触しないため、室外機１の輸送時の振動による第１の半導体素子７への圧力が軽減され、第１の半導体素子７の内部の素子の破壊の発生を抑制することができる。 As described above, in the semiconductor element protection structure according to the first embodiment, the circuit board 6, the fixing portion 9 b of the spacer 9, and the heat radiating body 5 are screw-fixed by the screws 11. That is, in the semiconductor element protection structure according to the first embodiment, the non-substrate side surface 7b of the first semiconductor element is in close contact with the substrate side surface 5a of the radiator without bringing the screw 11 into contact with the first semiconductor element 7. In this state, the heat radiating body 5, the first semiconductor element 7, the spacer 9, and the circuit board 6 can be screw-fixed by the screws 11. With this configuration, since the screw 11 does not contact the first semiconductor element 7, the pressure applied to the first semiconductor element 7 due to vibration during transportation of the outdoor unit 1 is reduced, and the elements inside the first semiconductor element 7 are reduced. The occurrence of destruction can be suppressed.
　したがって、本実施の形態１にかかる半導体素子の保護構造によれば、第１の半導体素子７を備えた空気調和機の室外機１の信頼性の向上を図ることができるとともに室外機１の長期使用が可能となる。そして、本実施の形態１にかかる半導体素子の保護構造は、特にパワー半導体素子の保護構造に好適である。 Therefore, according to the protective structure of the semiconductor element according to the first embodiment, the reliability of the outdoor unit 1 of the air conditioner including the first semiconductor element 7 can be improved and the long-term of the outdoor unit 1 can be improved. Can be used. The semiconductor element protection structure according to the first embodiment is particularly suitable for a power semiconductor element protection structure.
　なお、第１の半導体素子７と放熱体５とを螺子固定する場合には、第１の半導体素子７と放熱体５との螺子固定時においても、第１の半導体素子７の内部の素子の破壊が発生するおそれがある。本実施の形態１にかかる半導体素子の保護構造では、第１の半導体素子７と放熱体５とを螺子固定しないため、第１の半導体素子７への圧力を防ぐことができ、第１の半導体素子７の内部の素子の破壊の発生を抑制することができる。 When the first semiconductor element 7 and the radiator 5 are screw-fixed, even when the first semiconductor element 7 and the radiator 5 are screw-fixed, the elements inside the first semiconductor element 7 are not fixed. There is a risk of destruction. In the protection structure of the semiconductor element according to the first embodiment, the first semiconductor element 7 and the heat radiating body 5 are not screw-fixed, so that the pressure on the first semiconductor element 7 can be prevented, and the first semiconductor Occurrence of destruction of the element inside the element 7 can be suppressed.
実施の形態２．
　図５は、本発明の実施の形態２にかかる半導体素子の保護構造を説明するための模式図であり、電気品箱４の開口部１０ｂを電気品箱４の外部側から、放熱体５１を透過して見た場合について示す模式図である。図６は、本発明の実施の形態２にかかる半導体素子の保護構造を表す断面図であり、図５における線分ＶＩ－ＶＩにおける断面図である。図７は、本発明の実施の形態２にかかる半導体素子の保護構造の放熱体５１を回路基板６側を向く面である放熱体の基板側面５１ａから見た状態を示す平面図である。本実施の形態２にかかる半導体素子の保護構造が実施の形態１にかかる半導体素子の保護構造と異なる点は、放熱体５の代わりに放熱体５１が用いられ、スペーサ９の代わりにスペーサ９１が用いられている点である。以下、実施の形態１と同一部分には同一符号を付してその説明を省略し、ここでは異なる部分についてのみ述べる。 Embodiment 2. FIG.
FIG. 5 is a schematic diagram for explaining a protective structure of a semiconductor element according to the second embodiment of the present invention. An opening 10b of the electrical component box 4 is connected to the radiator 51 from the outside of the electrical component box 4. It is a schematic diagram shown about the case where it sees through. FIG. 6 is a cross-sectional view showing the protective structure of a semiconductor element according to the second embodiment of the present invention, and is a cross-sectional view taken along line VI-VI in FIG. FIG. 7: is a top view which shows the state which looked at the heat sink 51 of the protection structure of the semiconductor element concerning Embodiment 2 of this invention from the board | substrate side surface 51a of the heat sink which is a surface which faces the circuit board 6 side. The semiconductor element protection structure according to the second embodiment is different from the semiconductor element protection structure according to the first embodiment in that a heat radiator 51 is used instead of the heat radiator 5 and a spacer 91 is used instead of the spacer 9. It is the point used. Hereinafter, the same parts as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted. Only different parts will be described here.
　本実施の形態２にかかる半導体素子の保護構造では、実施の形態１の場合と同様に第１の半導体素子７に螺子１１を接触させることなく、第１の半導体素子７がスペーサ９１と放熱体５１とで挟まれた状態で回路基板６とスペーサ９１と放熱体５１とが螺子１１によって螺子固定されている。 In the protection structure of the semiconductor element according to the second embodiment, the first semiconductor element 7 is made to contact the spacer 91 and the radiator without contacting the screw 11 to the first semiconductor element 7 as in the case of the first embodiment. The circuit board 6, the spacer 91, and the heat radiating body 51 are screwed and fixed by the screw 11 while being sandwiched by 51.
　放熱体５１は、第１の半導体素子７と対向する対向面であって放熱体５１の回路基板６側を向く面である放熱体の基板側面５１ａにおける第１の半導体素子７との対向部分に第２凹部５１ｃが設けられている。第２凹部５１ｃの深さは、第１の半導体素子７の厚みと同じ寸法とされている。そして、第１の半導体素子７は、第２凹部５１ｃに嵌め込まれた状態で配置されている。第２凹部５１ｃは、放熱体の基板側面５１ａにおいて第１の半導体素子７に対向する全領域に設けられており、第１の半導体素子の反基板側面７ｂの全面が第２凹部の底面５１ｃａに密着している。 The radiator 51 is a facing surface facing the first semiconductor element 7, and is a surface facing the circuit board 6 side of the radiator 51, on a substrate facing side 51 a of the radiator, facing the first semiconductor element 7. A second recess 51c is provided. The depth of the second recess 51 c is the same as the thickness of the first semiconductor element 7. And the 1st semiconductor element 7 is arrange | positioned in the state inserted by the 2nd recessed part 51c. The second recess 51c is provided in the entire region facing the first semiconductor element 7 on the substrate side surface 51a of the radiator, and the entire surface of the anti-substrate side surface 7b of the first semiconductor element is formed on the bottom surface 51ca of the second recess. It is in close contact.
　一方、スペーサ９１は、実施の形態１におけるスペーサ９において高さ調整部９ａに第１凹部９ｃが設けられておらず、スペーサ９における高さ調整部９ａに対応する高さ調整部９１ａと、スペーサ９における固定部９ｂに対応する固定部９１ｂと、が同じ厚みとされた形状を有する。したがって、スペーサ９１における回路基板６側を向く面と反対方向を向く面であるスペーサ反基板側面９１ｃは、凹凸の無い平坦な形状とされている。 On the other hand, the spacer 91 is not provided with the first recessed portion 9c in the height adjusting portion 9a in the spacer 9 in the first embodiment, and the spacer 91 has a height adjusting portion 91a corresponding to the height adjusting portion 9a in the spacer 9 and a spacer. 9 and the fixing portion 91b corresponding to the fixing portion 9b have the same thickness. Therefore, the spacer non-substrate side surface 91c, which is the surface facing the circuit substrate 6 side in the spacer 91, is a flat shape without unevenness.
　上記のように構成された放熱体５１およびスペーサ９１を用いることにより、第１の半導体素子７がスペーサ９１のスペーサ反基板側面９１ｃと放熱体５１の第２凹部の底面５１ｃａとで挟まれた状態で、回路基板６とスペーサ９１における固定部９１ｂと放熱体５１とが、螺子１１によって螺子固定されている。すなわち、本実施の形態２にかかる半導体素子の保護構造では、第１の半導体素子７に螺子１１を接触させることなく、第１の半導体素子の反基板側面７ｂが放熱体５１の第２凹部の底面５１ｃａに密着した状態で、放熱体５１とスペーサ９１と回路基板６とを螺子１１によって螺子固定することができる。 By using the heat radiator 51 and the spacer 91 configured as described above, the first semiconductor element 7 is sandwiched between the spacer non-substrate side surface 91c of the spacer 91 and the bottom surface 51ca of the second recess of the heat radiator 51. Thus, the fixing portion 91 b and the radiator 51 in the circuit board 6 and the spacer 91 are screwed by the screw 11. That is, in the semiconductor element protection structure according to the second embodiment, the non-substrate side surface 7 b of the first semiconductor element is not in contact with the second recess of the heat radiator 51 without bringing the screw 11 into contact with the first semiconductor element 7. The heat radiator 51, the spacer 91, and the circuit board 6 can be screwed by the screw 11 in a state of being in close contact with the bottom surface 51ca.
　上述した本実施の形態２にかかる半導体素子の保護構造を形成するには、第１の半導体素子７を回路基板６に搭載する前に、回路基板６に形成された貫通孔６ｃの位置に、スペーサ９１の固定部９１ｂに設けられた貫通孔９１ｂａを位置合わせして回路基板６の部品面６ａ上にスペーサ９１が載置される。つぎに、スペーサ９１の高さ調整部９１ａ上に第１の半導体素子７が載置される。また、第１の半導体素子７のリード端子７ｅが、回路基板６に形成されたスルーホール６ｄに挿入され、スルーホール６ｄにはんだ付けされる。これにより、スペーサ９１が、第１の半導体素子７と回路基板６との間に固定される。 In order to form the protective structure of the semiconductor element according to the second embodiment described above, before mounting the first semiconductor element 7 on the circuit board 6, the position of the through hole 6c formed in the circuit board 6 is The spacer 91 is placed on the component surface 6 a of the circuit board 6 by aligning the through hole 91 ba provided in the fixing portion 91 b of the spacer 91. Next, the first semiconductor element 7 is placed on the height adjusting portion 91 a of the spacer 91. Further, the lead terminal 7e of the first semiconductor element 7 is inserted into the through hole 6d formed in the circuit board 6, and soldered to the through hole 6d. Thereby, the spacer 91 is fixed between the first semiconductor element 7 and the circuit board 6.
　このように、第１の半導体素子７と回路基板６との間にスペーサ９１を設けることにより、第１の半導体素子７と回路基板６との接触を避けて、第１の半導体素子７から回路基板６への熱的影響および回路基板６から第１の半導体素子７への熱的影響を少なくすることができるとともに、第１の半導体素子７と対向する回路基板６上に銅箔といった導電材料によるパターンを配線することができる。 As described above, by providing the spacer 91 between the first semiconductor element 7 and the circuit board 6, contact between the first semiconductor element 7 and the circuit board 6 can be avoided, and the circuit from the first semiconductor element 7 can be avoided. The thermal influence on the substrate 6 and the thermal influence on the first semiconductor element 7 from the circuit board 6 can be reduced, and a conductive material such as a copper foil is provided on the circuit board 6 facing the first semiconductor element 7. The pattern can be wired.
　その後、放熱体の基板側面５１ａにおけるスペーサ９１の固定部９１ｂに対向する位置に設けられた螺子孔５１ｂをスペーサ９１の貫通孔９１ｂａの位置に位置合わせして、放熱体５１が第１の半導体素子７上およびスペーサ９上に配置される。このとき、第１の半導体素子７は、放熱体の基板側面５１ａに設けられた第２凹部５１ｃに嵌め込まれて収容される。 Thereafter, the screw hole 51b provided at the position facing the fixing portion 91b of the spacer 91 on the substrate side surface 51a of the heat radiator is aligned with the position of the through hole 91ba of the spacer 91, so that the heat radiator 51 becomes the first semiconductor element. 7 and on the spacer 9. At this time, the first semiconductor element 7 is fitted and accommodated in the second recess 51c provided on the substrate side surface 51a of the heat radiating body.
　そして、回路基板６の反部品面６ｂ側から、回路基板６の貫通孔６ｃ、スペーサ９１の貫通孔９１ｂａおよび放熱体５１の螺子孔５１ｂに螺子１１が通され、第１の半導体素子７がスペーサ９１のスペーサ反基板側面９１ｃと放熱体５１の第２凹部の底面５１ｃａとで挟まれた状態で、回路基板６とスペーサ９１における固定部９１ｂと放熱体５１とが、螺子１１によって螺子固定される。これにより、回路基板６とスペーサ９１の固定部９１ｂと放熱体５１とが、第２凹部５１ｃを挟んで対向する２箇所の領域で螺子１１によって螺子固定される。 Then, the screw 11 is passed through the through hole 6c of the circuit board 6, the through hole 91ba of the spacer 91, and the screw hole 51b of the heat dissipating body 51 from the side opposite to the component surface 6b of the circuit board 6, and the first semiconductor element 7 is the spacer. The fixing portion 91b and the heat dissipating body 51 of the circuit board 6 and the spacer 91 are screw-fixed by the screw 11 in a state sandwiched between the spacer non-substrate side surface 91c of 91 and the bottom surface 51ca of the second recess of the heat dissipating body 51. . As a result, the circuit board 6, the fixing portion 91b of the spacer 91, and the heat radiating body 51 are screw-fixed by the screw 11 in two regions facing each other with the second recess 51c interposed therebetween.
　上述したように、本実施の形態２にかかる半導体素子の保護構造は、実施の形態１にかかる半導体素子の保護構造と同様に、第１の半導体素子７に螺子１１を接触させることなく、第１の半導体素子の反基板側面７ｂが放熱体５１の第２凹部の底面５１ｃａに密着した状態で、放熱体５１とスペーサ９１と回路基板６とを螺子１１によって螺子固定することができる。したがって、本実施の形態２にかかる半導体素子の保護構造によれば、実施の形態１にかかる半導体素子の保護構造と同様の効果が得られる。 As described above, the protective structure of the semiconductor element according to the second embodiment is the same as the protective structure of the semiconductor element according to the first embodiment, without bringing the screw 11 into contact with the first semiconductor element 7. The heat dissipating body 51, the spacer 91, and the circuit board 6 can be screwed together with the screw 11 in a state where the opposite side surface 7 b of the semiconductor element 1 is in close contact with the bottom surface 51 ca of the second recess of the heat dissipating body 51. Therefore, according to the semiconductor element protection structure according to the second embodiment, the same effect as the semiconductor element protection structure according to the first embodiment can be obtained.
　なお、上記においては、実施の形態１および実施の形態２にかかる半導体素子の保護構造を、空気調和機の室外機１に適用した場合について説明したが、実施の形態１および実施の形態２にかかる半導体素子の保護構造は空気調和機の室内機に適用されてもよい。この場合も上記と同様の効果が得られ、半導体素子を備えた空気調和機の室内機の信頼性の向上を図ることができるとともに室内機の長期使用が可能となる。 In the above description, the case where the semiconductor element protection structure according to the first and second embodiments is applied to the outdoor unit 1 of an air conditioner has been described. Such a semiconductor element protection structure may be applied to an indoor unit of an air conditioner. Also in this case, the same effect as described above can be obtained, and the reliability of the indoor unit of the air conditioner including the semiconductor element can be improved, and the indoor unit can be used for a long time.
　以上の実施の形態に示した構成は、本発明の内容の一例を示すものであり、別の公知の技術と組み合わせることも可能であるし、本発明の要旨を逸脱しない範囲で、構成の一部を省略、変更することも可能である。 The configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.
　１　室外機、２　ファン、３　圧縮機、４　電気品箱、５，５１　放熱体、５ａ，５１ａ　放熱体の基板側面、５ｂ，５１ｂ　螺子孔、６　回路基板、６ａ　部品面、６ｂ　反部品面、６ｃ，９ｂａ，９１ｂａ　貫通孔、６ｄ　スルーホール、７　第１の半導体素子、７ａ　第１の半導体素子の基板側面、７ｂ　第１の半導体素子の反基板側面、７ｃ　側面、７ｄ　側面、７ｅ　リード端子、８　第２の半導体素子、８ａ　第２の半導体素子の反基板側面、９，９１　スペーサ、９ａ，９１ａ　高さ調整部、９ｂ，９１ｂ　固定部、９ｃ　第１凹部、９ｃａ　第１凹部の底面、９ｄ　スペーサ基板側面、９ｅ，９１ｃ　スペーサ反基板側面、１０　筐体、１０ａ　風路側の側面、１０ｂ　開口部、１１　螺子、５１ｃ　第２凹部、５１ｃａ　第２凹部の底面。 1 outdoor unit, 2 fan, 3 compressor, 4 electrical component box, 5,51 radiator, 5a, 51a substrate side of radiator, 5b, 51b screw hole, 6 circuit board, 6a component surface, 6b anti-component surface, 6c, 9ba, 91ba through hole, 6d through hole, 7 first semiconductor element, 7a first semiconductor element substrate side face, 7b first semiconductor element anti-substrate side face, 7c side face, 7d side face, 7e lead terminal, 8 Second semiconductor element, 8a Anti-substrate side surface of second semiconductor element, 9, 91 spacer, 9a, 91a height adjustment part, 9b, 91b fixing part, 9c first recess, 9ca bottom face of first recess, 9d Spacer substrate side surface, 9e, 91c Spacer opposite substrate side surface, 10 housing, 10a side surface on air path side, 10b opening, 11 screw, 51c, second recess, 51ca The bottom surface of the second recess.

Claims (5)

  1. 　回路基板と、
    　前記回路基板の第１面上に配置されたスペーサと、
    　前記スペーサ上に配置された半導体素子と、
    　前記半導体素子の前記回路基板を向く面と反対方向を向く素子反基板側面と接触した状態で、前記スペーサ上における前記半導体素子の配置領域以外の領域および前記半導体素子上に配置された放熱体と、
    　前記スペーサの前記回路基板を向くスペーサ基板側面の面内における前記半導体素子の配置領域以外の領域で前記回路基板と前記スペーサと前記放熱体とを螺子固定する螺子と、
    　を備えることを特徴とする半導体素子の保護構造。     A circuit board;
    A spacer disposed on the first surface of the circuit board;
    A semiconductor element disposed on the spacer;
    A region other than the region where the semiconductor element is disposed on the spacer and a heat dissipating member disposed on the semiconductor element in a state where the semiconductor element is in contact with a side opposite to the surface facing the circuit board of the semiconductor element. ,
    A screw that screw-fixes the circuit board, the spacer, and the heat dissipating member in a region other than the region where the semiconductor element is disposed in a side surface of the spacer substrate facing the circuit substrate of the spacer;
    A protective structure for a semiconductor element, comprising:
  2. 　前記回路基板と前記スペーサと前記放熱体とは、前記第１面の面内方向において前記半導体素子を挟む２箇所の領域で前記螺子によって螺子固定されていること、
    　を特徴とする請求項１に記載の半導体素子の保護構造。     The circuit board, the spacer, and the heat dissipating member are screwed by the screw in two regions sandwiching the semiconductor element in the in-plane direction of the first surface;
    The protective structure for a semiconductor device according to claim 1.
  3. 　前記スペーサは、前記半導体素子の厚みと同じ寸法の深さを有する第１凹部を前記回路基板と反対方向を向くスペーサ反基板側面に有し、
    　前記半導体素子は、前記第１凹部に嵌め込まれて配置され、前記スペーサの前記第１凹部の底面と前記放熱体とで挟まれていること、
    　を特徴とする請求項１または２に記載の半導体素子の保護構造。     The spacer has a first recess having a depth of the same dimension as the thickness of the semiconductor element on the side surface of the spacer opposite to the circuit board,
    The semiconductor element is disposed by being fitted into the first recess, and is sandwiched between the bottom surface of the first recess of the spacer and the radiator.
    The protective structure for a semiconductor element according to claim 1 or 2.
  4. 　前記放熱体は、前記半導体素子と対向する対向面に前記半導体素子の厚みと同じ寸法の深さを有する第２凹部を有し、
    　前記半導体素子は、前記第２凹部に嵌め込まれて配置され、前記放熱体の前記第２凹部の底面と前記スペーサとで挟まれていること、
    　を特徴とする請求項１または２に記載の半導体素子の保護構造。     The radiator has a second recess having a depth of the same dimension as the thickness of the semiconductor element on a facing surface facing the semiconductor element,
    The semiconductor element is disposed by being fitted into the second recess, and is sandwiched between the bottom surface of the second recess of the radiator and the spacer;
    The protective structure for a semiconductor element according to claim 1 or 2.
  5. 　電気部品が収納される電気品箱内に、請求項１から４のいずれか１項に記載の半導体素子の保護構造を備えること、
    　を特徴とする空気調和機。     A protective structure for a semiconductor element according to any one of claims 1 to 4 is provided in an electrical component box in which electrical components are stored.
    Air conditioner characterized by.
PCT/JP2017/014148 2017-04-04 2017-04-04 Protective structure of semiconductor element and air conditioner WO2018185859A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6013751U (en) * 1983-07-07 1985-01-30 富士通株式会社 Heat dissipation structure of heating element
JPH09139451A (en) * 1995-11-15 1997-05-27 Hitachi Ltd Semiconductor device with heat radiating fin, and mounting/dismounting method for the device
JP2011142142A (en) * 2010-01-05 2011-07-21 Onkyo Corp Heat sink mounting structure and heat sink mounting method
JP2015133454A (en) * 2014-01-15 2015-07-23 三菱電機株式会社 Protection structure of semiconductor element and outdoor unit of air conditioner

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6013751U (en) * 1983-07-07 1985-01-30 富士通株式会社 Heat dissipation structure of heating element
JPH09139451A (en) * 1995-11-15 1997-05-27 Hitachi Ltd Semiconductor device with heat radiating fin, and mounting/dismounting method for the device
JP2011142142A (en) * 2010-01-05 2011-07-21 Onkyo Corp Heat sink mounting structure and heat sink mounting method
JP2015133454A (en) * 2014-01-15 2015-07-23 三菱電機株式会社 Protection structure of semiconductor element and outdoor unit of air conditioner

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