TWI334074B - Electric module and fabricating method thereof - Google Patents

Description

1334074

* 达达号: TW3663PA IX. Description of the Invention: [Technical Field] The present invention relates to an electronic component and an assembly method thereof, and more particularly to an electronic component for arranging a plate against a semiconductor component And its assembly method. [Prior Art] The development of science and technology is changing with each passing day, and various electronic devices are constantly being updated. Various electronic components are provided in the • electronic device to provide specific electrical functions. Referring to Figure 1, a schematic diagram of a conventional electronic component 900 is shown. The electronic component 9A includes a circuit board 910, a semiconductor component 920, an abutting plate 930, a latching component 940, and a heat dissipating component 950. The semiconductor component 920 is soldered to the circuit board 910. The abutting plate 930 and the heat dissipating component 950 are disposed on the semiconductor component 920, and the heat dissipation component is formed by abutting the board 930 and the heat dissipating component 950. Many of the powerful semiconductor components 92 have heat dissipation problems during operation. Such a semiconductor element 920 is, for example, a central processing unit (CPU), a South Bridge Chip, a North Bridge Chip, or a Video Chip. For example, overheating of the Northbridge chip can cause system crashes or restarts. In order to improve the heat dissipation problem, the thermal energy of the semiconductor element 920 can be transferred to the heat dissipating element 950 by the abutting plate and then transmitted to the outside. Referring to FIG. 1 and FIG. 2 simultaneously, FIG. 2 is a diagram showing the circuit board 910, the semiconductor component 920, the abutting plate 930, and the latching component 94 〇 6 1334074 of FIG. 1 :

A perspective view of the TW3663PA. Since the abutting plate 930 must be completely bonded to the semiconductor element 920, the thermal energy of the semiconductor element 920 can be transferred to the heat dissipating member 950. Therefore, the abutting plate 930 is locked to the circuit board 910 by the locking component 940 such that the abutting plate 930 is in close contact with the semiconductor component 920. During the locking of the abutment plate 930 and the circuit board 910, the assembly member 940 is locked to the circuit board 910. However, when the pad 930 and the circuit board 910 are locked, the semiconductor element 920 is often defective. For example, when the lock is applied, the solder ball 922a, the solder ball 922, or the solder ball 922 are short-circuited due to the uneven force generated on the semiconductor element 92. In particular, after the semiconductor element 920 is subjected to a reflow process, the substrate 923 of the semiconductor device 920 often has a plate bending phenomenon, and the above-described problem of occurrence of defects is more likely to occur. Further, the semiconductor device 92 is gradually adopting a lead-free process for environmental protection ( Under the trend of Lead-Free Process, the soldering strength of solder balls 922 tends to be weak, making the above-mentioned undesirable phenomena more difficult to control. Therefore, how to improve these various phenomena is an important research and development direction for the industry. SUMMARY OF THE INVENTION The present invention relates to a device, an electronic component, and an assembly method thereof, which utilize a buffer hole to provide an appropriate amount of cushioning deformation against a plate, so that the phenomenon of damage of the solder ball during assembly is reduced, and the yield of the electronic component can be greatly increased. improve. An electronic component according to an embodiment of the invention includes a circuit board, a semiconductor component, an abutment plate and a plurality of latching components. Including 7 1334074

Sanda number: TW3663PA semiconductor component soldering fine plate, abutting plate is more expensive == In one preferred embodiment, the abutting plate has a plurality of locking holes and a plurality of buffer holes, and the locking holes are disposed at The shirts of the boards are placed, and the buffer holes are placed in the vicinity of the locking holes. Each of the locking elements extends through each of the locking holes and is mounted on the circuit board. When the abutting plate and the circuit board are locked through the locking hole, the pressure at the partial locking can be absorbed by the buffer hole near the locking hole, and

Ensure that the semi-conductive Hit and the solder balls of the board (5) are damaged. According to another embodiment of the present invention, a method of assembling an electronic component is provided, the steps comprising: (a) providing a circuit board; (b) soldering a semiconductor 70 to the circuit board; (e) setting-abutting The plate is on the semiconductor component, the abutting plate has a plurality of locking holes and a plurality of buffer holes, the locking holes are disposed at each corner of the abutting plate, the buffer holes are disposed near the locking holes; and (d) 70 pieces of locks are passed through the respective locking holes, and the locking elements are locked to the circuit board. The use of the buffer hole to provide an appropriate amount of cushioning deformation of the abutment plate can make the electronic component and the assembly method thereof disclosed by the present invention have the following advantages: _ the first and the abutting plate have an area larger than the area of the semiconductor component, so that the buffer hole The buffer deformation provided is limited to areas other than the semiconductor elements without affecting the semiconductor elements. The first buffer hole is disposed between the locking hole and the center point to slow down the inward transmission of the locking hole. Thirdly, if the distance between the buffer hole and the locking hole is equal, and the buffer hole t area is equal', the buffer shape variables generated by each of the buffer holes are equal. Fourth, although a plurality of buffer holes are arranged along an arc, a plurality of buffer holes 8 ^ 34074

Sanda number: TW3063PA - between hold - fixed distance. Not only can the cushioning effect be achieved, but the strength of the abutment plate can be maintained. Fifth, the buffer hole is a circular structure or an elliptical structure. Therefore, the circular structure or the ellipsoidal structure of the buffer hole can avoid the phenomenon of cracking against the board. Sixth, in the reflow process, when the substrate of the semiconductor element is bent, the buffer deformation provided by the buffer hole can effectively reduce the stress on the substrate. Seventh, under the lead-free process, the buffer shape provided by the buffer hole can effectively reduce the impact of stress on the solder ball. In order to make the above description of the present invention more comprehensible, a preferred embodiment will be described below in detail with reference to the accompanying drawings. FIG. The electronic component of the preferred embodiment. The electronic component 100 includes a circuit board 110, a semiconductor component 12, a chip 130, a plurality of latching components 140, and a heat dissipating component 150. The semiconductor component 120 is soldered to the circuit board 110. The abutting plate 13 is disposed on the semiconductor element 120. The heat dissipating member 150 is disposed on the abutting plate 130. The abutting plate 130 has a plurality of locking holes 131 and a plurality of buffer holes 132. Each of the locking elements 140 extends through each of the locking holes 131 and locks the abutting plate 130 to the circuit board 110. In this embodiment, the semiconductor component 120 can be a central processing unit (CPU), a South Bridge Chip, a North Bridge Chip, or a 9 1334074.

: TW3663PA Display Processing Chip (Video Chip). A heat dissipating paste may be applied between the abutting plate 13A and the semiconductor element 120 to increase heat dissipation efficiency. The abutting plate 13 is used to conduct the thermal energy of the semiconductor component 120 to the heat dissipating component 150. In the present embodiment, the material of the abutting plate 130 may be selected from a material having a high thermal conductivity, such as metal. The heat dissipating component 150 can be a heat sink fin or a heat dissipating fan. The abutting plate 130 and the heat dissipating component 150 can form a heat dissipating mold stage. In the present embodiment, the locking component 140 is exemplified by a screw. Referring to Fig. 4, a schematic view of the circuit board 11A of Fig. 3, the semiconductor element 120, the abutting plate 130, and the latching member 140 is shown. In Fig. 4, the locking member 140 is not fully inserted into the locking hole 131 to clearly show the positional relationship of the locking hole 131 and the buffer hole 132. The locking holes ι31 are disposed at respective corners of the abutting plate 130, and the buffer holes 132 are disposed near the locking holes 131. The buffer holes 132 are used to provide proper cushioning deformation, so that the defects caused by the locking members 140 during the locking process can be greatly reduced. As for the detailed structure of the electronic component 10 and the assembly method thereof, the electronic component assembly flowchart shown in Figs. 5 to 5 is described in detail below. Lu First, please refer to the fifth map. A circuit board 11 is provided. Next, the semiconductor device 120 is soldered on the board no. Please refer to FIG. In this embodiment, the semiconductor device 12 is a Ball Grid Array Chip 'BGA Chip». The semiconductor device 120 is attacked on the circuit board 110 and after the reflow process (Ref jnw), the semiconductor device 120 The solder ball 122 can be soldered to the board ι1〇. In addition, the lock post 170 can be soldered to the circuit board 110 at the same time in this step. 1334074

• TW3: TW3663PA Please refer to FIG. 5C' to place an abutting plate 130 on the semiconductor element 120. The abutting plate 130 has a plurality of locking holes 131 and a plurality of buffer holes 132. The locking hole 131 can correspond to the locking post 170.

As shown in FIG. 5D, the locking holes 131 are disposed at respective corners of the abutting plate 130, and the buffer holes 132 are disposed adjacent to the locking holes 131. The area of the abutting plate 130 is larger than the area of the semiconductor component 120, such that the latching holes 131 and the buffer holes 132 are located outside the semiconductor component 120 (i.e., outside the dotted line). Thereby, the buffer deformation provided by the buffer hole 132 is limited to a region other than the semiconductor element 120 without affecting the semiconductor element 120. The buffer hole 132 of the present embodiment and the locking hole 131 are described in more detail below. As shown in FIG. 5D, the abutting plate 130 has a center point ρ, and the buffer holes 132 are disposed between the respective locking holes 131 and the center point ρ to relieve the stress transmitted inward by the locking hole 131. In addition, the distance between the buffer holes 132 and the respective locking holes 131 is exclusive, and the areas of the buffer holes 132 are equal. Therefore, the buffer shape variables generated by each of the buffer holes 132 are equal. Further, each of the buffer holes 132 is disposed in the vicinity of the locking hole 131 along an arc c. The area of each of the buffer holes 132 is smaller than the area of each of the locking holes. When a plurality of buffer holes 132 are disposed in the arc (;, the plurality of buffer holes 132 and the locking holes 13H) still have a distance, and the effect of the cushioning is maintained, and the strength against the plate 130 can be maintained.

‘Sanda number: TW3663PA, if the stress is concentrated at the corners, it may cause the abutting plate 130 to crack from the corners. Since the circular structure or the elliptical structure does not have any ribs, the phenomenon of cracking against the plate 130 can be avoided. Next, please refer to Figure 5E. The locking members 140 are inserted through the respective locking holes 131 of the board 130 to be locked to the locking posts 170 of the circuit board 11A against the board 130. In this step, since the buffer holes 132 provide appropriate buffer deformation, the semiconductor element 120 is affected by the stress to the maximum.

low. Even in the reflow process, when the substrate 123 of the semiconductor device 12 is bent, the buffer deformation provided by the buffer hole 132 can effectively reduce the stress on the substrate 123. Or, under the Lead-Free Process, the cushioning deformation provided by the buffer holes 132 can also effectively reduce the impact of stress on the solder balls 122. According to the above embodiment, although the semiconductor device of the present embodiment is described by taking a ballast array wafer as an example, and the function of the abutting plate is to exemplify the conduction of thermal energy, it is not intended to limit the technical scope of the present invention. The various embodiments of the semiconductor component and the abutment plate do not depart from the technical scope of the present invention. Further, according to the above embodiment, the correspondence relationship between the locking hole and the retarding hole of the abutting plate is exemplified by the 5D drawing. However, it is not intended to limit the technical scope of the present invention. For example, the number, shape, position, and arrangement of the buffer holes can be adjusted according to different semiconductor components and the abutting plates, which are still within the technical scope of the present invention. The present invention has been described above with reference to a preferred embodiment, which is not intended to limit the invention. Those skilled in the art to which the present invention pertains can make various kinds of 12 1334074 without departing from the spirit and scope of the present invention.

'Sanda number: TW3663PA • The change and retouch. Therefore, the scope of the invention is defined by the scope of the appended claims.

13 1334074

'三达编号: TW3663PA - [Simple diagram of the diagram] Figure 1 is a schematic diagram of a conventional electronic component; Figure 2 is a perspective view of the circuit board, semiconductor component, abutment plate and the lock component of Fig. 1, Fig. 3 A schematic diagram of an electronic component according to a preferred embodiment of the present invention; FIG. 4 is a schematic diagram of a circuit board, a semiconductor component, an abutting plate, and a locking component of FIG. 3; and FIGS. 5A-5E are a preferred embodiment of the present invention. A schematic diagram of the structure of each step of the method of assembling the electronic components of the example. [Description of Main Components] 100, 900: Electronic Components 110, 910: Circuit Boards 120, 920: Semiconductor Components 122, 922: Tin Balls 123, 923: Substrates 130, 930: Abutting Plates® 13 931: Locking Holes 132: buffer holes 140, 940: locking elements 150, 950: heat dissipating elements • 170: locking post 922a: cracked solder ball P: center point C: arc

Claims (1)

1334074 - Sanda number: TW3663PA X. Patent application scope: 1. An electronic component comprising: a circuit board; a semiconductor component soldered to the circuit board; and an abutting plate disposed on the semiconductor component The backing plate has a plurality of locking holes and a plurality of buffer holes, wherein the locking holes are disposed at respective corners of the abutting plate, the buffer holes are disposed adjacent to the locking holes; and the plurality of locking elements Φ wherein the locking components extend through the locking holes, and the abutting plate is locked to the circuit board, so that the abutting plate is in close contact with the semiconductor component. 2. The electronic component of claim 1, wherein the area of the abutting plate is larger than the area of the semiconductor component, and the locking holes on the abutting plate and the buffer holes are located in the semiconductor The component is outside the area of contact with the abutment plate. 3. The electronic component of claim 1, wherein the abutting plate has a center point, and the buffer holes are disposed between each of the locking holes and the center point. 4. The electronic component of claim 1, wherein each of the buffer holes has an area smaller than an area of each of the locking holes. 5. The electronic component of claim 1, wherein the semiconductor component is a ball, a Ball Grid Array Chip (BGA Chip). 15 1334074: TW3663PA The electronic component of claim 1, wherein the two buffer holes are circular or elliptical. Μ I:: Please: The electronic component described in item 1 of the range includes: a heat sink element disposed on the abutment plate. 8. A method of assembling an electronic component, comprising: (a) providing a circuit board; (b) soldering a semiconductor component on the circuit board; (c) providing - abutting a board on the semiconductor component, the abutting The plate has a locking hole and a plurality of buffer holes, and the locking holes are disposed at each corner of the abutting plate. The buffer holes are disposed near the locking holes; and (d) The locking component extends through each of the locking holes and locks the locking components to the circuit board. 9. The method of assembling an electronic component according to claim 8, wherein in the step (c), the area of the abutting plate is larger than the area of the semiconductor piece, and the abutting plate The locking holes and the buffer holes are located outside the contact area of the semiconductor component and the abutting plate. The assembly method of the electric hand assembly of claim 8, wherein in the step (c), the abutting plate has a center point, and the buffer holes are disposed in each of the locking holes And between the center points. 11. The method of assembling an electronic component according to claim 8, wherein in the step (c), each of the buffer holes has an area smaller than an area of each of the locking holes. 12. The method of assembling an electronic component according to claim 8, wherein in the step (b), the semiconductor component is a ball lining crystal 16 1334074 • Sanda number: TW3663PA • piece (Bal1 Grid Array Chip, BGA Chip). 13. The method of assembling an electronic component according to claim 8, wherein in the step (c), the buffer holes are a circular structure or an elliptical structure. 14. The method of assembling an electronic component according to claim 8, wherein in the step (c), a heat dissipating member is further disposed on the abutting plate. 17