BR7803561A - Dispositivo e conjunto semicondutor - Google Patents

Dispositivo e conjunto semicondutor

Info

Publication number
BR7803561A
BR7803561A BR7803561A BR7803561A BR7803561A BR 7803561 A BR7803561 A BR 7803561A BR 7803561 A BR7803561 A BR 7803561A BR 7803561 A BR7803561 A BR 7803561A BR 7803561 A BR7803561 A BR 7803561A
Authority
BR
Brazil
Prior art keywords
assembly
semiconductor device
semiconductor
Prior art date
Application number
BR7803561A
Other languages
English (en)
Inventor
T Sakaue
M Nakajima
K Narita
N Kawasaki
Original Assignee
Hitachi Ltd
Hitachi Haramachi Semi Conduct
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Haramachi Semi Conduct filed Critical Hitachi Ltd
Publication of BR7803561A publication Critical patent/BR7803561A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
BR7803561A 1977-06-07 1978-06-02 Dispositivo e conjunto semicondutor BR7803561A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6760477A JPS542067A (en) 1977-06-07 1977-06-07 Semiconductor device

Publications (1)

Publication Number Publication Date
BR7803561A true BR7803561A (pt) 1979-03-20

Family

ID=13349685

Family Applications (1)

Application Number Title Priority Date Filing Date
BR7803561A BR7803561A (pt) 1977-06-07 1978-06-02 Dispositivo e conjunto semicondutor

Country Status (4)

Country Link
US (1) US4305088A (pt)
JP (1) JPS542067A (pt)
BR (1) BR7803561A (pt)
DE (1) DE2824607A1 (pt)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057704B2 (ja) * 1979-05-25 1985-12-16 日本電気株式会社 半導体装置の製造方法
JPS5746662A (en) * 1980-09-04 1982-03-17 Toshiba Corp Semiconductor rectifier
FR2495381A1 (fr) * 1980-12-01 1982-06-04 Sev Alternateurs Composant electronique discret, notamment diode, ainsi que pont redresseur et alternateur de vehicules automobiles le comportant
FR2512275A3 (fr) * 1981-08-29 1983-03-04 Bosch Gmbh Robert Dispositif redresseur de courant avec plaquette a diode a semi-conducteur
US4546409A (en) * 1982-04-02 1985-10-08 Mitsubishi Denki Kabushiki Kaisha Device for cooling semiconductor elements
JPS59158339U (ja) * 1983-04-06 1984-10-24 株式会社日立製作所 半導体装置
JPS6047340U (ja) * 1983-09-08 1985-04-03 三菱電機株式会社 ソリツドステ−トリレ−
US4751199A (en) * 1983-12-06 1988-06-14 Fairchild Semiconductor Corporation Process of forming a compliant lead frame for array-type semiconductor packages
US4792672A (en) * 1985-04-12 1988-12-20 Grumman Aerospace Corporation Detector buffer board
JPH0249447A (ja) * 1988-05-20 1990-02-19 Hitachi Ltd 半導体装置とその製造方法
US5132584A (en) * 1988-11-07 1992-07-21 Mitsubishi Denki Kabushiki Kaisha Vehicular AC generator with vibration damper system
JP2858166B2 (ja) * 1990-10-08 1999-02-17 株式会社日立製作所 半導体整流素子及びそれを使った全波整流装置
DE19624052A1 (de) * 1996-06-17 1996-12-12 Voith Sulzer Papiermasch Gmbh Dreischichtenstoffauflauf
DE19946255A1 (de) * 1999-09-27 2001-03-29 Philips Corp Intellectual Pty Gleichrichteranordnung
JP2002359328A (ja) * 2001-03-29 2002-12-13 Hitachi Ltd 半導体装置
FR2829661B1 (fr) * 2001-08-17 2004-12-03 Valeo Equip Electr Moteur Module de composants electroniques de puissance et procede d'assemblage d'un tel module
TWI287282B (en) * 2002-03-14 2007-09-21 Fairchild Kr Semiconductor Ltd Semiconductor package having oxidation-free copper wire
EP1443546A3 (en) * 2003-01-28 2009-05-06 Hitachi Ltd. Working method of metal material and semiconductor apparatus fabricated by the method
JP6304974B2 (ja) * 2013-08-27 2018-04-04 三菱電機株式会社 半導体装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2597734A (en) * 1948-11-15 1952-05-20 Hazeltine Research Inc Electrical crystal contact device
US2671189A (en) * 1949-11-28 1954-03-02 Siemens Ag Semiconductor amplifier having a resiliently adjustably mounted semiconductor
US2779903A (en) * 1953-04-30 1957-01-29 Motorola Inc Semi-conductor unit
US2869053A (en) * 1953-05-22 1959-01-13 Motorola Inc Transistor unit
US2712619A (en) * 1954-06-17 1955-07-05 Westinghouse Air Brake Co Dry disk rectifier assemblies
US2927953A (en) * 1957-01-28 1960-03-08 Itt Electrical lead conductor
US3050666A (en) * 1959-11-13 1962-08-21 Diodes Inc Yieldable electrode for semiconductor devices
US3258661A (en) * 1962-12-17 1966-06-28 Sealed semiconductor device
JPS4740289Y1 (pt) * 1969-01-31 1972-12-06
US3612957A (en) * 1970-04-15 1971-10-12 Union Carbide Corp Molded capacitor and method
US3925809A (en) * 1973-07-13 1975-12-09 Ford Motor Co Semi-conductor rectifier heat sink
US4057825A (en) * 1975-07-18 1977-11-08 Hitachi, Ltd. Semiconductor device with composite metal heat-radiating plate onto which semiconductor element is soldered

Also Published As

Publication number Publication date
US4305088A (en) 1981-12-08
DE2824607A1 (de) 1978-12-14
JPS542067A (en) 1979-01-09

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Legal Events

Date Code Title Description
B15K Others concerning applications: alteration of classification

Free format text: PROCEDIMENTO AUTOMATICO DE RECLASSIFICACAO. AS CLASSIFICACOES IPC ANTERIORES ERAM: H01L 25/02; H01L 23/34; H01L 23/48.

Ipc: H01L 23/00 (2006.01), H01L 23/433 (2006.01), H01L

Ipc: H01L 23/00 (2006.01), H01L 23/433 (2006.01), H01L