DE3201802A1 - Bondverfahren fuer elektronische bauelemente - Google Patents

Bondverfahren fuer elektronische bauelemente

Info

Publication number
DE3201802A1
DE3201802A1 DE19823201802 DE3201802A DE3201802A1 DE 3201802 A1 DE3201802 A1 DE 3201802A1 DE 19823201802 DE19823201802 DE 19823201802 DE 3201802 A DE3201802 A DE 3201802A DE 3201802 A1 DE3201802 A1 DE 3201802A1
Authority
DE
Germany
Prior art keywords
solder
substrate
component
ing
unmetallized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19823201802
Other languages
German (de)
English (en)
Inventor
Donald 18049 Emmaus Pa. Jaffe
Richard Clyde 18052 Whitehall Pa. Kershner
Nicholas Theodore 18106 Wescosville Pa. Panousis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of DE3201802A1 publication Critical patent/DE3201802A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE19823201802 1981-01-27 1982-01-21 Bondverfahren fuer elektronische bauelemente Withdrawn DE3201802A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/228,954 US4396140A (en) 1981-01-27 1981-01-27 Method of bonding electronic components

Publications (1)

Publication Number Publication Date
DE3201802A1 true DE3201802A1 (de) 1982-08-26

Family

ID=22859235

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823201802 Withdrawn DE3201802A1 (de) 1981-01-27 1982-01-21 Bondverfahren fuer elektronische bauelemente

Country Status (7)

Country Link
US (1) US4396140A (en, 2012)
JP (1) JPS57143896A (en, 2012)
CA (1) CA1187678A (en, 2012)
DE (1) DE3201802A1 (en, 2012)
FR (1) FR2498504A1 (en, 2012)
GB (1) GB2094203B (en, 2012)
IT (1) IT1195912B (en, 2012)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19807279A1 (de) * 1998-02-23 1999-09-02 Friedrich Elektronisches Bauelement und Verfahren zu seiner Herstellung

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JPS5934817A (ja) * 1982-08-18 1984-02-25 株式会社クボタ 果実収穫装置
US4515304A (en) * 1982-09-27 1985-05-07 Northern Telecom Limited Mounting of electronic components on printed circuit boards
JPS59138396A (ja) * 1983-01-28 1984-08-08 富士通株式会社 チツプキヤリアの予備半田付け方法
US4505035A (en) * 1983-04-11 1985-03-19 At&T Technologies, Inc. Methods of aligning and mounting a plurality of electrical leads to a plurality of terminals
JPS6092829U (ja) * 1983-11-30 1985-06-25 アルプス電気株式会社 マイクロ波トランジスタの取付構造体
CA1281810C (en) * 1984-02-20 1991-03-19 Stephen P. Rogerson Mounting of saw devices
US4754371A (en) * 1984-04-27 1988-06-28 Nec Corporation Large scale integrated circuit package
US4607782A (en) * 1985-05-24 1986-08-26 Contact Systems, Inc. Method and apparatus for soldering electrical components to circuit boards
JPS629642A (ja) * 1985-07-05 1987-01-17 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
DE3625238A1 (de) * 1985-07-31 1987-02-12 Murata Manufacturing Co Elektronisches bauteil mit anschlussdraehten und verfahren zur herstellung dieses bauteils
FR2598055B1 (fr) * 1986-04-28 1990-08-31 Talco Sa Procede de brasage de composants de surface sur un circuit imprime
US4722470A (en) * 1986-12-01 1988-02-02 International Business Machines Corporation Method and transfer plate for applying solder to component leads
CA1278876C (en) * 1986-12-25 1991-01-08 Sho Masujima Adhesive mounted electronic circuit element
AU1491488A (en) * 1987-03-19 1988-10-10 Western Digital Corporation Solder paste replacement method and article
US4759491A (en) * 1987-05-18 1988-07-26 American Telephone And Telegraph Company Method and apparatus for applying bonding material to component leads
US4898320A (en) * 1988-11-21 1990-02-06 Honeywell, Inc. Method of manufacturing a high-yield solder bumped semiconductor wafer
JPH0693465B2 (ja) * 1988-12-12 1994-11-16 ローム株式会社 ペレットのダイボンディング方法
US5040717A (en) * 1990-03-27 1991-08-20 Metcal, Inc. Solder delivery system
US5090926A (en) * 1991-02-26 1992-02-25 North American Specialties Corporation Solderable lead
US5241134A (en) * 1990-09-17 1993-08-31 Yoo Clarence S Terminals of surface mount components
US5145104A (en) * 1991-03-21 1992-09-08 International Business Machines Corporation Substrate soldering in a reducing atmosphere
US5159171A (en) * 1991-09-03 1992-10-27 Motorola, Inc. Method and apparatus for solder laser printing
NL195026C (nl) * 1992-04-22 2003-06-18 Yamaha Corporation Werkwijze voor het bewerken van een raam van elektrische geleiders voor een halfgeleiderelement.
US5541447A (en) * 1992-04-22 1996-07-30 Yamaha Corporation Lead frame
US5343366A (en) * 1992-06-24 1994-08-30 International Business Machines Corporation Packages for stacked integrated circuit chip cubes
US5234149A (en) * 1992-08-28 1993-08-10 At&T Bell Laboratories Debondable metallic bonding method
US6476487B2 (en) 1992-10-30 2002-11-05 Showa Denko K.K. Solder circuit
US6939173B1 (en) 1995-06-12 2005-09-06 Fci Americas Technology, Inc. Low cross talk and impedance controlled electrical connector with solder masses
TW267265B (en) * 1995-06-12 1996-01-01 Connector Systems Tech Nv Low cross talk and impedance controlled electrical connector
US5860585A (en) * 1996-05-31 1999-01-19 Motorola, Inc. Substrate for transferring bumps and method of use
US6093035A (en) * 1996-06-28 2000-07-25 Berg Technology, Inc. Contact for use in an electrical connector
US6024584A (en) * 1996-10-10 2000-02-15 Berg Technology, Inc. High density connector
US5829668A (en) * 1996-09-03 1998-11-03 Motorola Corporation Method for forming solder bumps on bond pads
JPH1079400A (ja) * 1996-09-05 1998-03-24 Oki Electric Ind Co Ltd 半導体装置の実装方法及び半導体装置の構造
US6042389A (en) * 1996-10-10 2000-03-28 Berg Technology, Inc. Low profile connector
US6241535B1 (en) 1996-10-10 2001-06-05 Berg Technology, Inc. Low profile connector
SG71046A1 (en) 1996-10-10 2000-03-21 Connector Systems Tech Nv High density connector and method of manufacture
US6250192B1 (en) * 1996-11-12 2001-06-26 Micron Technology, Inc. Method for sawing wafers employing multiple indexing techniques for multiple die dimensions
US6139336A (en) * 1996-11-14 2000-10-31 Berg Technology, Inc. High density connector having a ball type of contact surface
US5975921A (en) 1997-10-10 1999-11-02 Berg Technology, Inc. High density connector system
TW362342B (en) * 1997-10-27 1999-06-21 Sony Video Taiwan Co Ltd Method for combining e-mail network with pager
US6093042A (en) * 1998-12-10 2000-07-25 Berg Technology, Inc. High density connector with low insertion force
US6406316B1 (en) 1998-01-31 2002-06-18 Fci Americas Technology, Inc. Electrical connector with multiple housings
US6155860A (en) 1998-01-31 2000-12-05 Berg Technology, Inc. Socket for electrical component
US6115262A (en) * 1998-06-08 2000-09-05 Ford Motor Company Enhanced mounting pads for printed circuit boards
FR2789225B1 (fr) * 1999-02-02 2004-09-03 Thomson Csf Circuit integre de type montable en surface
JP2001060596A (ja) * 1999-08-19 2001-03-06 Shinko Electric Ind Co Ltd 半導体装置の製造方法
US6989591B1 (en) 2000-07-18 2006-01-24 Atmel Grenoble S.A. Method for making an integrated circuit of the surface-mount type and resulting circuit
US7537461B2 (en) * 2003-07-16 2009-05-26 Gryphics, Inc. Fine pitch electrical interconnect assembly
US7297003B2 (en) * 2003-07-16 2007-11-20 Gryphics, Inc. Fine pitch electrical interconnect assembly
CN100459833C (zh) * 2003-07-16 2009-02-04 格瑞费克斯公司 具有联锁接触系统的电互连组件
US20050191880A1 (en) * 2004-02-27 2005-09-01 Po-Hsiung Lin Electronic card connector
US20070109756A1 (en) * 2005-02-10 2007-05-17 Stats Chippac Ltd. Stacked integrated circuits package system
US8044502B2 (en) 2006-03-20 2011-10-25 Gryphics, Inc. Composite contact for fine pitch electrical interconnect assembly
JP4894464B2 (ja) * 2006-11-01 2012-03-14 山一電機株式会社 半田付き接触子及びその製造方法
CN101568224B (zh) * 2008-04-22 2012-01-25 鸿富锦精密工业（深圳）有限公司 电路板及具有该电路板的电子装置
US8366485B2 (en) 2009-03-19 2013-02-05 Fci Americas Technology Llc Electrical connector having ribbed ground plate
EP2624034A1 (en) 2012-01-31 2013-08-07 Fci Dismountable optical coupling device
US9257778B2 (en) 2012-04-13 2016-02-09 Fci Americas Technology High speed electrical connector
USD727268S1 (en) 2012-04-13 2015-04-21 Fci Americas Technology Llc Vertical electrical connector
USD727852S1 (en) 2012-04-13 2015-04-28 Fci Americas Technology Llc Ground shield for a right angle electrical connector
US8944831B2 (en) 2012-04-13 2015-02-03 Fci Americas Technology Llc Electrical connector having ribbed ground plate with engagement members
USD718253S1 (en) 2012-04-13 2014-11-25 Fci Americas Technology Llc Electrical cable connector
US9543703B2 (en) 2012-07-11 2017-01-10 Fci Americas Technology Llc Electrical connector with reduced stack height
USD751507S1 (en) 2012-07-11 2016-03-15 Fci Americas Technology Llc Electrical connector
USD745852S1 (en) 2013-01-25 2015-12-22 Fci Americas Technology Llc Electrical connector
USD720698S1 (en) 2013-03-15 2015-01-06 Fci Americas Technology Llc Electrical cable connector
US9472904B2 (en) 2014-08-18 2016-10-18 Amphenol Corporation Discrete packaging adapter for connector
CN108581118B (zh) * 2017-03-17 2022-01-11 泰科电子(上海)有限公司 焊膏自动供应系统
US10912940B2 (en) * 2017-09-22 2021-02-09 Advanced Bionics Ag Connection joints for joining wires and pads constructed of different conductive materials and methods of making the same

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Publication number Priority date Publication date Assignee Title
GB964831A (en) * 1961-06-05 1964-07-22 Burroughs Corp Improvements in a method of fabricating sub-miniature semi-conductor matrix apparatus
DE2415120A1 (de) * 1974-03-28 1975-10-02 Siemens Ag Verfahren zur herstellung von halbleiterchips tragenden chiptraegern

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US3516155A (en) * 1967-02-02 1970-06-23 Bunker Ramo Method and apparatus for assembling electrical components
US3849870A (en) * 1971-06-15 1974-11-26 Amp Inc Method of fabricating selectively applied flowable solder joints
BE793732A (fr) * 1972-01-10 1973-05-02 Grace W R & Co Composition contenant un polyene et un polythiol
DE2728330A1 (de) * 1977-06-23 1979-01-11 Siemens Ag Verfahren zum verloeten von kontaktteilen und/oder halbleiterplaettchen
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US4332341A (en) * 1979-12-26 1982-06-01 Bell Telephone Laboratories, Incorporated Fabrication of circuit packages using solid phase solder bonding

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Publication number Priority date Publication date Assignee Title
GB964831A (en) * 1961-06-05 1964-07-22 Burroughs Corp Improvements in a method of fabricating sub-miniature semi-conductor matrix apparatus
DE2415120A1 (de) * 1974-03-28 1975-10-02 Siemens Ag Verfahren zur herstellung von halbleiterchips tragenden chiptraegern

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19807279A1 (de) * 1998-02-23 1999-09-02 Friedrich Elektronisches Bauelement und Verfahren zu seiner Herstellung
DE19807279C2 (de) * 1998-02-23 2000-02-17 Dieter Friedrich Verfahren zum Herstellen eines elektronischen Bauelementes

Also Published As

Publication number Publication date
FR2498504A1 (fr) 1982-07-30
US4396140A (en) 1983-08-02
GB2094203A (en) 1982-09-15
IT1195912B (it) 1988-11-03
CA1187678A (en) 1985-05-28
IT8219272A0 (it) 1982-01-25
GB2094203B (en) 1985-02-20
JPS57143896A (en) 1982-09-06
FR2498504B1 (en, 2012) 1985-04-19

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8130 Withdrawal
8127 New person/name/address of the applicant

Owner name: AT & T TECHNOLOGIES, INC., NEW YORK, N.Y., US