DE3140348A1 - Verfahren zur gleichzeitigen herstellung mehrfacher elektrischer verbindungen, insbesondere zum elektrischen anschluss eines halbleiterbauelementes - Google Patents

Verfahren zur gleichzeitigen herstellung mehrfacher elektrischer verbindungen, insbesondere zum elektrischen anschluss eines halbleiterbauelementes

Info

Publication number
DE3140348A1
DE3140348A1 DE19813140348 DE3140348A DE3140348A1 DE 3140348 A1 DE3140348 A1 DE 3140348A1 DE 19813140348 DE19813140348 DE 19813140348 DE 3140348 A DE3140348 A DE 3140348A DE 3140348 A1 DE3140348 A1 DE 3140348A1
Authority
DE
Germany
Prior art keywords
gold
conductive paste
contact surface
elements
silver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19813140348
Other languages
German (de)
English (en)
Inventor
Georges 27930 Cierrey Florens, (Verstorben)
Philippe 27000 Evreux Jourdain
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE3140348A1 publication Critical patent/DE3140348A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE19813140348 1980-10-15 1981-10-10 Verfahren zur gleichzeitigen herstellung mehrfacher elektrischer verbindungen, insbesondere zum elektrischen anschluss eines halbleiterbauelementes Withdrawn DE3140348A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8022083A FR2492164B1 (fr) 1980-10-15 1980-10-15 Procede de realisation simultanee de liaisons electriques multiples, notamment pour le raccordement electrique d'une micro-plaquette de semiconducteurs

Publications (1)

Publication Number Publication Date
DE3140348A1 true DE3140348A1 (de) 1982-08-26

Family

ID=9246931

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813140348 Withdrawn DE3140348A1 (de) 1980-10-15 1981-10-10 Verfahren zur gleichzeitigen herstellung mehrfacher elektrischer verbindungen, insbesondere zum elektrischen anschluss eines halbleiterbauelementes

Country Status (6)

Country Link
US (1) US4442966A (https=)
JP (1) JPS5799750A (https=)
DE (1) DE3140348A1 (https=)
FR (1) FR2492164B1 (https=)
GB (1) GB2090071B (https=)
IE (1) IE52529B1 (https=)

Cited By (3)

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Publication number Priority date Publication date Assignee Title
DE3446789A1 (de) * 1984-12-21 1986-07-03 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Verfahren zum herstellen von halbleiterbauelementen
EP0234347A1 (en) * 1986-02-24 1987-09-02 International Business Machines Corporation Electrically conductive composition and use thereof
US4859268A (en) * 1986-02-24 1989-08-22 International Business Machines Corporation Method of using electrically conductive composition

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JPH0638437B2 (ja) * 1985-03-12 1994-05-18 カシオ計算機株式会社 半導体ペレツトの接合方法
US4684055A (en) * 1985-09-09 1987-08-04 Harris Corporation Method of selectively soldering the underside of a substrate having leads
JPH074995B2 (ja) * 1986-05-20 1995-01-25 株式会社東芝 Ｉｃカ−ド及びその製造方法
DE3785720T2 (de) * 1986-09-25 1993-08-12 Toshiba Kawasaki Kk Verfahren zum herstellen eines filmtraegers.
FR2618254B1 (fr) * 1987-07-16 1990-01-05 Thomson Semiconducteurs Procede et structure de prise de contact sur des plots de circuit integre.
EP0396522A3 (en) * 1989-05-05 1992-01-22 International Business Machines Corporation Universal electrical interconnection system and method
JPH03125443A (ja) * 1989-10-09 1991-05-28 Sharp Corp 実装基板の電極及び該実装基板の電極を有する液晶表示装置
US5056706A (en) * 1989-11-20 1991-10-15 Microelectronics And Computer Technology Corporation Liquid metal paste for thermal and electrical connections
US5074947A (en) * 1989-12-18 1991-12-24 Epoxy Technology, Inc. Flip chip technology using electrically conductive polymers and dielectrics
US5611140A (en) * 1989-12-18 1997-03-18 Epoxy Technology, Inc. Method of forming electrically conductive polymer interconnects on electrical substrates
US4995551A (en) * 1990-04-24 1991-02-26 Microelectronics And Computer Technology Corporation Bonding electrical leads to pads on electrical components
US5076485A (en) * 1990-04-24 1991-12-31 Microelectronics And Computer Technology Corporation Bonding electrical leads to pads with particles
MY129942A (en) * 1990-08-23 2007-05-31 Siemens Ag Method and apparatus for connecting a semiconductor chip to a carrier.
DE4032397A1 (de) * 1990-10-12 1992-04-16 Bosch Gmbh Robert Verfahren zur herstellung einer hybriden halbleiterstruktur und nach dem verfahren hergestellte halbleiterstruktur
US5866951A (en) * 1990-10-12 1999-02-02 Robert Bosch Gmbh Hybrid circuit with an electrically conductive adhesive
US5288007A (en) * 1991-10-04 1994-02-22 International Business Machine Corporation Apparatus and methods for making simultaneous electrical connections
US5193732A (en) * 1991-10-04 1993-03-16 International Business Machines Corporation Apparatus and methods for making simultaneous electrical connections
JPH05206379A (ja) * 1991-10-04 1993-08-13 Internatl Business Mach Corp <Ibm> マルチチップモジュールおよびその製造方法
US5170930A (en) * 1991-11-14 1992-12-15 Microelectronics And Computer Technology Corporation Liquid metal paste for thermal and electrical connections
US6077725A (en) * 1992-09-03 2000-06-20 Lucent Technologies Inc Method for assembling multichip modules
US5545589A (en) * 1993-01-28 1996-08-13 Matsushita Electric Industrial Co., Ltd. Method of forming a bump having a rugged side, a semiconductor device having the bump, and a method of mounting a semiconductor unit and a semiconductor device
US5766670A (en) * 1993-11-17 1998-06-16 Ibm Via fill compositions for direct attach of devices and methods for applying same
US5450290A (en) * 1993-02-01 1995-09-12 International Business Machines Corporation Printed circuit board with aligned connections and method of making same
US5445308A (en) * 1993-03-29 1995-08-29 Nelson; Richard D. Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal
US5328087A (en) * 1993-03-29 1994-07-12 Microelectronics And Computer Technology Corporation Thermally and electrically conductive adhesive material and method of bonding with same
CA2156941A1 (en) * 1995-08-21 1997-02-22 Jonathan H. Orchard-Webb Method of making electrical connections to integrated circuit
US5741430A (en) * 1996-04-25 1998-04-21 Lucent Technologies Inc. Conductive adhesive bonding means
US6558979B2 (en) * 1996-05-21 2003-05-06 Micron Technology, Inc. Use of palladium in IC manufacturing with conductive polymer bump
JP3030271B2 (ja) 1997-05-19 2000-04-10 富士通株式会社 半導体部品の実装方法
US6110760A (en) * 1998-02-12 2000-08-29 Micron Technology, Inc. Methods of forming electrically conductive interconnections and electrically interconnected substrates
US6108210A (en) * 1998-04-24 2000-08-22 Amerasia International Technology, Inc. Flip chip devices with flexible conductive adhesive
US6297564B1 (en) 1998-04-24 2001-10-02 Amerasia International Technology, Inc. Electronic devices employing adhesive interconnections including plated particles
US6580035B1 (en) 1998-04-24 2003-06-17 Amerasia International Technology, Inc. Flexible adhesive membrane and electronic device employing same
US6406988B1 (en) 1998-04-24 2002-06-18 Amerasia International Technology, Inc. Method of forming fine pitch interconnections employing magnetic masks
US6589376B1 (en) 1998-04-28 2003-07-08 International Business Machines Corporation Method and composition for mounting an electronic component and device formed therewith
US6428650B1 (en) 1998-06-23 2002-08-06 Amerasia International Technology, Inc. Cover for an optical device and method for making same
US6136128A (en) * 1998-06-23 2000-10-24 Amerasia International Technology, Inc. Method of making an adhesive preform lid for electronic devices
US6409859B1 (en) 1998-06-30 2002-06-25 Amerasia International Technology, Inc. Method of making a laminated adhesive lid, as for an Electronic device
US6399178B1 (en) 1998-07-20 2002-06-04 Amerasia International Technology, Inc. Rigid adhesive underfill preform, as for a flip-chip device
US6221752B1 (en) * 1998-08-20 2001-04-24 United Microelectronics Corp. Method of mending erosion of bonding pad
US6316289B1 (en) 1998-11-12 2001-11-13 Amerasia International Technology Inc. Method of forming fine-pitch interconnections employing a standoff mask
US6246587B1 (en) * 1998-12-03 2001-06-12 Intermedics Inc. Surface mounted device with grooves on a termination lead and methods of assembly
US6535393B2 (en) * 1998-12-04 2003-03-18 Micron Technology, Inc. Electrical device allowing for increased device densities
US6255208B1 (en) 1999-01-25 2001-07-03 International Business Machines Corporation Selective wafer-level testing and burn-in
US6177729B1 (en) 1999-04-03 2001-01-23 International Business Machines Corporation Rolling ball connector
DE10117880B4 (de) * 2001-04-10 2009-01-29 Mühlbauer Ag Verfahren zum Vereinzeln von elektronischen Bauteilen aus einem Verbund
US7743963B1 (en) 2005-03-01 2010-06-29 Amerasia International Technology, Inc. Solderable lid or cover for an electronic circuit
JP2009246166A (ja) * 2008-03-31 2009-10-22 Fujitsu Ltd 電子部品パッケージおよび基板ユニット並びにプリント配線板およびその製造方法
US9240563B2 (en) * 2010-10-11 2016-01-19 Koninklijke Philips N.V. Multi-device OLED
ITTO20110980A1 (it) 2011-10-27 2013-04-28 St Microelectronics Srl Struttura incapsulante schermata e relativo metodo di fabbricazione
JP6507826B2 (ja) * 2015-04-28 2019-05-08 日立化成株式会社 導電性接合体および該接合体の製造方法
CN110744163B (zh) * 2019-11-11 2022-04-19 重庆理工大学 一种抗热迁移微焊点结构及其制备方法
CN112839439A (zh) * 2019-11-25 2021-05-25 Oppo（重庆）智能科技有限公司 印刷线路板组件及制备方法、电子设备

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DD82790A (https=) *
DE2234462B2 (de) * 1971-11-16 1975-06-12 E.I. Du Pont De Nemours And Co., Wilmington, Del. (V.St.A.) Durch Siebdruck aufbringbare Metallisierungsmasse und deren Verwendung zum Einkapseln von Halbleiterkörpern
DE2925509A1 (de) * 1978-07-18 1980-01-31 Mitsumi Electric Co Packung fuer schaltungselemente

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US3463698A (en) * 1965-06-14 1969-08-26 Fuji Tsushinki Seizo Kk Laminated plate for electrical apparatus and method for making same
US3697308A (en) * 1969-11-10 1972-10-10 Trw Inc Boron reinforced polyimide composites
JPS5279773A (en) * 1975-12-26 1977-07-05 Seiko Epson Corp Bonding method of ic
CA1097495A (en) * 1976-05-24 1981-03-17 James H. Aumiller Electrically conductive adhesive
US4147669A (en) * 1977-03-28 1979-04-03 Rockwell International Corporation Conductive adhesive for providing electrical and thermal conductivity
DE2829917A1 (de) * 1978-07-07 1980-01-24 Semikron Gleichrichterbau Verfahren zum herstellen von halbleiterbauelementen
US4233103A (en) * 1978-12-20 1980-11-11 The United States Of America As Represented By The Secretary Of The Air Force High temperature-resistant conductive adhesive and method employing same

Patent Citations (3)

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DD82790A (https=) *
DE2234462B2 (de) * 1971-11-16 1975-06-12 E.I. Du Pont De Nemours And Co., Wilmington, Del. (V.St.A.) Durch Siebdruck aufbringbare Metallisierungsmasse und deren Verwendung zum Einkapseln von Halbleiterkörpern
DE2925509A1 (de) * 1978-07-18 1980-01-31 Mitsumi Electric Co Packung fuer schaltungselemente

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IBM Technical Disclosure Bulletin Bd. 23, No. 3, August 1980, S. 966 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3446789A1 (de) * 1984-12-21 1986-07-03 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Verfahren zum herstellen von halbleiterbauelementen
EP0234347A1 (en) * 1986-02-24 1987-09-02 International Business Machines Corporation Electrically conductive composition and use thereof
US4859268A (en) * 1986-02-24 1989-08-22 International Business Machines Corporation Method of using electrically conductive composition

Also Published As

Publication number Publication date
FR2492164B1 (fr) 1987-01-23
JPH0128502B2 (https=) 1989-06-02
FR2492164A1 (fr) 1982-04-16
IE812380L (en) 1982-04-15
IE52529B1 (en) 1987-12-09
US4442966A (en) 1984-04-17
JPS5799750A (en) 1982-06-21
GB2090071B (en) 1984-05-23
GB2090071A (en) 1982-06-30

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8128 New person/name/address of the agent

Representative=s name: KUNZE, K., DIPL.-ING. DR.-ING., PAT.-ASS., 2000 HA

8139 Disposal/non-payment of the annual fee