DE3134918C2 - - Google Patents
Info
- Publication number
- DE3134918C2 DE3134918C2 DE19813134918 DE3134918A DE3134918C2 DE 3134918 C2 DE3134918 C2 DE 3134918C2 DE 19813134918 DE19813134918 DE 19813134918 DE 3134918 A DE3134918 A DE 3134918A DE 3134918 C2 DE3134918 C2 DE 3134918C2
- Authority
- DE
- Germany
- Prior art keywords
- silver
- electrode
- metal
- substrate
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
- C23C18/1865—Heat
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19813134918 DE3134918A1 (de) | 1981-09-03 | 1981-09-03 | "elektrode auf waermebestaendigem isolierendem substrat und verfahren zur herstellung derselben" |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19813134918 DE3134918A1 (de) | 1981-09-03 | 1981-09-03 | "elektrode auf waermebestaendigem isolierendem substrat und verfahren zur herstellung derselben" |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3134918A1 DE3134918A1 (de) | 1983-03-17 |
DE3134918C2 true DE3134918C2 (US07829113-20101109-C00009.png) | 1991-04-11 |
Family
ID=6140792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19813134918 Granted DE3134918A1 (de) | 1981-09-03 | 1981-09-03 | "elektrode auf waermebestaendigem isolierendem substrat und verfahren zur herstellung derselben" |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE3134918A1 (US07829113-20101109-C00009.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19643912B4 (de) * | 1996-10-30 | 2004-07-08 | Infineon Technologies Ag | Folienkondensator zum Einbau in eine Chipkarte |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62205615A (ja) * | 1986-03-05 | 1987-09-10 | 株式会社村田製作所 | セラミツクスの金属化方法 |
DE3727825A1 (de) * | 1987-08-20 | 1989-03-02 | Siemens Ag | Serienverschaltetes duennschichtsolarmodul aus kristallinem silizium |
DE3727826A1 (de) * | 1987-08-20 | 1989-03-02 | Siemens Ag | Serienverschaltetes duennschicht-solarmodul aus kristallinem silizium |
US5587111A (en) * | 1990-03-29 | 1996-12-24 | Vacuum Metallurgical Co., Ltd. | Metal paste, process for producing same and method of making a metallic thin film using the metal paste |
JPH03281783A (ja) * | 1990-03-29 | 1991-12-12 | Vacuum Metallurgical Co Ltd | 金属薄膜の形成方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE355443C (de) * | 1921-11-10 | 1922-06-27 | Quintin Marino | Verfahren zum UEberziehen von keramischen und aehnlichen Waren mit einem festhaftenden metallischen UEberzug |
DE828672C (de) * | 1942-02-27 | 1952-01-21 | Eugen Duerrwaechter Dr Ing | Verfahren zur Herstellung von Versilberungspraeparaten |
DE926459C (de) * | 1952-10-06 | 1955-04-18 | Philips Nv | Verfahren zum Oberflaechen-Versilbern |
US2968583A (en) * | 1957-04-25 | 1961-01-17 | Western Electric Co | Capacitor sections and methods of making the same |
DE1227822B (de) * | 1963-02-14 | 1966-10-27 | Du Pont | Metallisierende Palladium-Silber-Legierungsmasse zur Verwendung bei der Herstellung von Kondensator-Elektroden |
BE679454A (US07829113-20101109-C00009.png) * | 1965-04-26 | 1966-09-16 | ||
US3450545A (en) * | 1966-05-31 | 1969-06-17 | Du Pont | Noble metal metalizing compositions |
US3859128A (en) * | 1968-02-09 | 1975-01-07 | Sprague Electric Co | Composition for resistive material and method of making |
DE2035945C3 (de) * | 1970-07-20 | 1974-01-03 | E.I. Du Pont De Nemours And Co., Wilmington, Del. (V.St.A.) | Silbermasse und ihre Verwendung |
US3801364A (en) * | 1971-02-03 | 1974-04-02 | Matsushita Electric Ind Co Ltd | Method for making printed circuits which include printed resistors |
DE2359432C3 (de) * | 1973-11-29 | 1984-08-09 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur Herstellung von mit Aluminium beschichteten Folien für Kondensatoren und Vorrichtung zur Durchführung des Verfahrens |
US3948706A (en) * | 1973-12-13 | 1976-04-06 | International Business Machines Corporation | Method for metallizing ceramic green sheets |
DE2433419C3 (de) * | 1974-07-11 | 1979-10-25 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Keramisches elektrisches Bauelement und Verfahren zu seiner Herstellung |
DE2552181A1 (de) * | 1975-11-21 | 1977-06-02 | Licentia Gmbh | Verfahren zum herstellen einer elektrisch leitenden kontaktierungsschicht |
GB1556638A (en) * | 1977-02-09 | 1979-11-28 | Matsushita Electric Ind Co Ltd | Method for manufacturing a ceramic electronic component |
-
1981
- 1981-09-03 DE DE19813134918 patent/DE3134918A1/de active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19643912B4 (de) * | 1996-10-30 | 2004-07-08 | Infineon Technologies Ag | Folienkondensator zum Einbau in eine Chipkarte |
Also Published As
Publication number | Publication date |
---|---|
DE3134918A1 (de) | 1983-03-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
8110 | Request for examination paragraph 44 | ||
8128 | New person/name/address of the agent |
Representative=s name: RUSCHKE, H., DIPL.-ING., 8000 MUENCHEN RUSCHKE, O. |
|
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |