DE3106563A1 - Vorrichtung zur montage von anschlussdrahtlosen elektronischen bauelementen auf einem substrat - Google Patents

Vorrichtung zur montage von anschlussdrahtlosen elektronischen bauelementen auf einem substrat

Info

Publication number
DE3106563A1
DE3106563A1 DE19813106563 DE3106563A DE3106563A1 DE 3106563 A1 DE3106563 A1 DE 3106563A1 DE 19813106563 DE19813106563 DE 19813106563 DE 3106563 A DE3106563 A DE 3106563A DE 3106563 A1 DE3106563 A1 DE 3106563A1
Authority
DE
Germany
Prior art keywords
component
substrate
pipette
slide
mounting head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19813106563
Other languages
German (de)
English (en)
Inventor
Godwin Jeroom Odo Ghislenus van 3200 Kessel Hooreweder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE3106563A1 publication Critical patent/DE3106563A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y10T156/1768—Means simultaneously conveying plural articles from a single source and serially presenting them to an assembly station
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53478—Means to assemble or disassemble with magazine supply

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE19813106563 1980-02-25 1981-02-21 Vorrichtung zur montage von anschlussdrahtlosen elektronischen bauelementen auf einem substrat Withdrawn DE3106563A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8001114A NL8001114A (nl) 1980-02-25 1980-02-25 Inrichting voor de montage van aansluitdraadloze plaat- of blokvormige elektronische onderdelen op een substraat.

Publications (1)

Publication Number Publication Date
DE3106563A1 true DE3106563A1 (de) 1982-09-23

Family

ID=19834878

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813106563 Withdrawn DE3106563A1 (de) 1980-02-25 1981-02-21 Vorrichtung zur montage von anschlussdrahtlosen elektronischen bauelementen auf einem substrat

Country Status (12)

Country Link
US (1) US4393579A (en:Method)
JP (1) JPS56133896A (en:Method)
BE (1) BE887642A (en:Method)
CA (1) CA1164635A (en:Method)
DE (1) DE3106563A1 (en:Method)
FR (1) FR2476963A1 (en:Method)
GB (1) GB2076703B (en:Method)
HK (1) HK20784A (en:Method)
IT (1) IT1144101B (en:Method)
NL (1) NL8001114A (en:Method)
SE (1) SE8101163L (en:Method)
SG (1) SG27483G (en:Method)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3424323A1 (de) * 1983-07-01 1985-01-10 Sanyo Electric Co., Ltd., Moriguchi, Osaka Automatische montagevorrichtung
DE10040095B4 (de) * 1999-08-17 2016-03-10 The Whitaker Corp. Vorrichtung zum Bestücken von Leiterplatten

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57102094A (en) * 1980-12-17 1982-06-24 Matsushita Electric Ind Co Ltd Device for mounting leadless electric part
US4604795A (en) * 1981-02-19 1986-08-12 Burndy Corporation Apparatus for installing terminals on wires and insulation pods on terminals
JPS57211430A (en) * 1981-06-16 1982-12-25 Sony Corp Method for supplying parts to automatic assembly machine and carrier for it
DE3150945A1 (de) * 1981-12-23 1983-07-07 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zum ueberbringen von anschlussbeinlosen bauelementen auf eine vorgesehene setzposition einer schaltungsplatine
JPS5984846U (ja) * 1982-11-29 1984-06-08 大日本スクリ−ン製造株式会社 Ｉｃデバイス用ハンドリング装置
US4502829A (en) * 1983-04-01 1985-03-05 Usm Corporation Electronic component sensing system
SE454643B (sv) * 1983-06-13 1988-05-16 Sincotron Aps Sett och anordning for att pa ett kretskort montera elektroniska komponenter
US4510683A (en) * 1983-10-27 1985-04-16 Sperry Corporation Force assembler apparatus for robots
US4627156A (en) * 1983-12-27 1986-12-09 Usm Corporation Placement head for micro-component assembly machine
CA1246625A (en) * 1984-04-06 1988-12-13 Stanley R. Vancelette Placement mechanism
SE8403625D0 (sv) * 1984-07-09 1984-07-09 Mydata Automation Ab Kassettmagasin for ytmonteringsmaskin
US4587703A (en) * 1985-01-16 1986-05-13 Apple Computer, Inc. Method and apparatus using a multifaceted turret for robotic assembly
EP0190372A1 (en) * 1985-01-29 1986-08-13 TEKMA KINOMAT S.p.A. Process for the automatic positioning of chips on printed circuits and machine for carrying out the same
US4670981A (en) * 1986-03-17 1987-06-09 Nitto Kogyo Kabushiki Kaisha Method of mounting electronic parts on the predetermined positions of a printed circuit board
US4733462A (en) * 1986-06-24 1988-03-29 Sony Corporation Apparatus for positioning circuit components at predetermined positions and method therefor
NL8602563A (nl) * 1986-10-13 1988-05-02 Philips Nv Inrichting voor het opnemen en plaatsen van componenten.
JPH0191500A (ja) * 1987-01-20 1989-04-11 Ikegami Tsushinki Co Ltd チップ部品の自動装着装置
US4817273A (en) * 1987-04-30 1989-04-04 Reliability Incorporated Burn-in board loader and unloader
US4875279A (en) * 1987-08-21 1989-10-24 E. I. Du Pont De Nemours And Company Die attach pickup tools
US4914808A (en) * 1987-10-16 1990-04-10 Sanyo Electric Co., Ltd Automatic electronic parts mounting apparatus for repeatedly mounting in forward and reverse sequences
US5044875A (en) * 1988-02-16 1991-09-03 International Business Machines Corporation Method and apparatus for positioning components
US4831696A (en) * 1988-05-06 1989-05-23 American Telephone And Telegraph Company Component insertion machine apparatus
US4857133A (en) * 1988-05-20 1989-08-15 Hybond, Inc. Method and apparatus for bonding with consistent uniform bond thickness
US5038453A (en) * 1988-07-22 1991-08-13 Rohm Co., Ltd. Method of manufacturing semiconductor devices, and leadframe and differential overlapping apparatus therefor
JPH0250440A (ja) * 1988-08-12 1990-02-20 Mitsubishi Electric Corp ダイボンド装置
US4941795A (en) * 1988-11-21 1990-07-17 At&T Bell Laboratories Component insertion machine apparatus
US5176525A (en) * 1991-04-17 1993-01-05 Data I/O Corporation Modular socket apparatus
US5547537A (en) * 1992-05-20 1996-08-20 Kulicke & Soffa, Investments, Inc. Ceramic carrier transport for die attach equipment
US5323528A (en) * 1993-06-14 1994-06-28 Amistar Corporation Surface mount placement system
EP1076357A1 (de) * 1999-08-11 2001-02-14 SiMoTec GmbH Montagevorrichtung zur Herstellung microsystemtechnischer Produkte
KR100702286B1 (ko) * 2000-01-14 2007-03-30 시바우라 메카트로닉스 가부시키가이샤 부품실장장치 및 부품실장방법
US6691859B2 (en) * 2001-12-20 2004-02-17 Autosplice Systems, Inc. Automatic feeder for strip-supported contacts
AU2003232594A1 (en) * 2003-04-07 2004-11-04 Georg Rudolf Sillner Device for working and/or machining semiconductor chips or components and a transfer and reversing module
CN203236382U (zh) * 2012-12-17 2013-10-16 鸿准精密模具（昆山）有限公司 夹持装置
CN105496093B (zh) * 2016-01-19 2021-05-07 苏州復朗特精密电子科技有限公司 可自动夹取展示物的展示装置
US10214340B2 (en) * 2016-07-01 2019-02-26 Intel Corporation Containers for holding and dispensing stacks of electronic device components
CN105965233B (zh) * 2016-07-18 2018-06-01 海门市苍云机械有限公司 电子排水阀阀芯组装机的阀芯柱上料机构

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2840892A (en) * 1956-06-25 1958-07-01 Waldes Kohinoor Inc Apparatus for assembling retaining rings
US3475805A (en) * 1967-06-26 1969-11-04 Ibm Apparatus for positioning articles on substrates
JPS5537879B2 (en:Method) * 1973-10-15 1980-09-30
FR2379909A1 (fr) * 1977-02-04 1978-09-01 Cii Honeywell Bull Procede et appareil de montage de dispositifs sur un substrat
GB2040569B (en) * 1978-12-26 1983-09-01 Murata Manufacturing Co Chip-like electronic component series and method for supplying chip-like electronic components
JPS5599795A (en) * 1979-01-25 1980-07-30 Matsushita Electric Ind Co Ltd Device for mounting electronic part
JPS55118698A (en) * 1979-03-05 1980-09-11 Matsushita Electric Ind Co Ltd Device for mounting electronic part
JPS55118690A (en) * 1979-03-05 1980-09-11 Matsushita Electric Ind Co Ltd Device for carrying electronic part
US4327483A (en) * 1979-06-07 1982-05-04 Universal Instruments Corporation Apparatus for selecting, transporting, and inserting single in-line components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3424323A1 (de) * 1983-07-01 1985-01-10 Sanyo Electric Co., Ltd., Moriguchi, Osaka Automatische montagevorrichtung
DE10040095B4 (de) * 1999-08-17 2016-03-10 The Whitaker Corp. Vorrichtung zum Bestücken von Leiterplatten

Also Published As

Publication number Publication date
NL8001114A (nl) 1981-09-16
GB2076703A (en) 1981-12-09
BE887642A (fr) 1981-08-24
HK20784A (en) 1984-03-16
CA1164635A (en) 1984-04-03
SG27483G (en) 1984-02-17
JPS56133896A (en) 1981-10-20
IT8167242A0 (it) 1981-02-20
FR2476963A1 (fr) 1981-08-28
IT1144101B (it) 1986-10-29
GB2076703B (en) 1983-03-16
US4393579A (en) 1983-07-19
SE8101163L (sv) 1981-08-26
FR2476963B1 (en:Method) 1982-07-02

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Legal Events

Date Code Title Description
8140 Disposal/non-payment of the annual fee for main application