CA1164635A

CA1164635A - Device for mounting chip-type electronic components on a substrate

Info

Publication number: CA1164635A
Application number: CA000371259A
Authority: CA
Inventors: Godwin J.O.G. Van Hooreweder
Original assignee: Philips Gloeilampenfabrieken NV
Current assignee: Koninklijke Philips NV
Priority date: 1980-02-25
Filing date: 1981-02-19
Publication date: 1984-04-03
Also published as: GB2076703B; BE887642A; SG27483G; DE3106563A1; NL8001114A; IT1144101B; US4393579A; IT8167242A0; GB2076703A; HK20784A; SE8101163L; FR2476963A1; JPS56133896A; FR2476963B1

Abstract

PHN.9699 9 ABSTRACT:

A device for mounting block-shaped, plate-shaped or cylinder-shaped chip-type electronic components devoid of connection wires on a substrate, comprising a table, means for the positioning of a substrate, and a mounting head which comprises a slide which is displaceable in a guide between a loading position and an unloading position, and a suction device at the area of the unloading position of the slide. A component to be mounted dispensed from a magazine or from a strip-shaped or tape-shaped carrier is transported by the slide from the loading position to the unloading position where the component is picked up and arranged on the substrate by the suction device. As a result of the controlled displacement of the component in only two direction, accurate and reproducible positioning of the component is achieved.

Description

~ 16~35 PHN.9699 1 24 ~.~o "Device for moun-ting chip--type electronic components on a substrate".

The inven-tion relates to a device for mounting chip-type electronic components on a substrate~ cormprising a table, a rnounting head and means for positioning a substra-te.
The increasing emphasis on miniaturization in the electronics industry has resulted in the development of plate-shaped, block-shaped and cylinder-shaped chip-type components devoid of connection wires, that is to say components without the conven-tional, comparatively long radial or a~ial connection wires.
These components without connection wires com-prise contact portions which are provided on opposite faces or sides, such as capacitors, resistors, coils, or short connection studs, such as diodes and transistors.
The components are arranged on a substrate provided with printed wiring, glue or tracks of solder paste being pro-~vided on the component side thereof. The components have dimensions in the order of from 0,5 to several millimeters.
In view of -the small dimensions of the components and con-sidering the possible dense patternc~f tracks, the componentsmust be accurately positioned with respect to the tracks on the substrate.
U.~. Patent Specifica-tion 1,477,027 discloses a device of the described kind in which the components are fed via tubes and apertures and are positioned on a .
slidable plate, situated over the substrate~ in a position which corresponds -to the desired position of -the components on the substrate; subsequently, the plate is displaced while the componen-ts are retained, so that the componen-ts ultima-tely drop onto the substrateO Due to the uncontrolled dropping motion, there is a ris~ tha-t the components start to til-t, rotate and/or land in an unclesirable posi-tion on the substrate.
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PHN.9699 2 zl~.8.8~
The invention has for i-ts object to provide a device which enables accurate positioning and mounting of chip-type componen-ts on a substrate in a controlled and reproducible manner, with a minimum of movements ~nd changes o~ direction.
The object in accordance wi-th the invention is mainly achieved inthat the mounting head comprises a slide which is displaceable in a guide between aloading position and an unloading position and which comprises a recess for accommodating and transporting a component, said mounting head also comprising a suction device which is displaceable in the vertical direction and which serves to pick up a component from the slide when the latter is in the unloading position, the guide comprising a passage 15 wherethrough the suction device can position a pickecl up component onto the substrate positioned underneath the guide~
The slide transports the component linearly and at a comparatively high speed, and in the unloading 20 position of the slide the component is situated in the desired X-Y position over the positioned substrate, just underneath the tip of the suction pipe. Subsequently, the component is picked -up and retained by the suction pipe.
After that~ the slide is returned to the loading position, 25 whilst the pipe with the retained component is displaced through the shaft in -the direction of the substrate~ the component ul-timately being placed on the substrate.
A~ter removal o~ the vacuum, the pipe is returned to the starting position. Thanks to the controlled displacement of the component in only -two directions, the component is accurately posi-tioned on the substrate.
The components are fed by hand or, for example, by mechanical pick up means or by a suction pipe from a vibrating feeder or from a package, like a tape, a cartridge or a magazine and are transported one by one by the slide to the unloading posi-tion. However, the device of~ers special advantages ln combination w-ittL
a strip-shaped or tape-shaped carrier which comprises 4~3~
P~IN.9699 3 2l~.8.80 cavities in which the components are loacted. To this end, a preferred embodiment of the device in accordance with the invention is characterized inthat the mounting head comprises a punch a-t the arQa of the loading position of the slide, the device furthermore cornprising means for transporting and guiding a s-trip~shaped or tape-shaped carrier with components between the punch and the guide.
Thanks to the simple transfer o~ a component from the carrier to the slide by means of the punch which 10 performs only a vertical movement, a comparatively high mounting frequency is obtained; this is important for the successive mounting of a large number of components on one and the same substrate.
In view of their shape, chip-type electronic 15 components are particularly suitable for stacking in elongated magazines. Components which are supplied in stacked form in magazines can also be simply and efficient-ly mounted by means of a fwrther preferred embodiment of the device in accordance with the invention, which is 20 characterized in that the mounting head comprises a holder for a magazine with stacked componen-ts at the area of the loading position of the slide, the device furthermore comprising means for transferring one component a time to the recess în -the slide.
In another embodiment of the device in accordance with the invention, thesuction pipe is rotatable about its centre line, so tha-t the component to be mounted can be positioned on the substrate not only in the X-Y
direction but ~so in the desired angular position, viewed 30 in the circumferential direction.
The invention will be described in detail hereinafter with reference to the accompanying diagrammatic drawing.
Figure 1 is a perspective view of an embodiment 35 of the device in accordance wi-th the invention;
Figure 2 shows the device of Figure 1 in a different position;

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PHN,9699 l~ 2~ .8~

Figure 3 is a cross-sectional view of the ~evice, taken along the line III-III in Figure 1;
Figure 4 is a cross-sectional view of the device, taken along the line IV-IV in Figure 2;
Figure 5 shows a further em'bodiment of the device;
Figure 6 is a cross-sectional view of -the device o-f Figure 5, taken along the line VI-VI;
Figure 7 shows a further embodiment of the device;
Figure 8 is a cross-sectional view, taken along 10 the line VIII-VIII, of the device shown in Figure 7.
Corresponding elements are deno-ted 'by the same reference numerals in the Figures.
The Figures 1 to 4 show a device 1 for mounting a plate-shaped or block-shaped chip-type component A
15 comprising contact faces F and devoid of connection wires on a subs-trate S which is provided with printed wiring, said device 1 comprising a table 3, pins 5 for positioning the substrate Son the table 3, and a mounting head 7.
By way of a side wall 9j the mounting head 7 is secured 20 on the table 3 so as to be adjustable in the X-Y direc-tion.
The moun-ting head 7 comprises mainly a slide 11 which is slidable in a channel 13 of a horizontal beam 15, said channel serving as a guide for the slide 11. The profile of the channel 13 is shown in the Figures 3 and ~.
25 The slide 11 is displaceable between two e~treme positions 7 that is to say a loading posi-tion as shown in Figure 1 ancl an unloading position as shown in Figure 2. The slide 11 comprises a recess 23 which forms a seat for a componen-t A
to be accommodated and transpor-ted and which comprises 30 a horizontal supporting surface 22 and a vertical abutment face 2L~. At the areaof the unloading position of the slide 1'l, the beam 15 comprises a passage which communicates with the channel 13. The transverse dimensions of the passage 25 are slightly larger than and dependent of those of the 35 component A. At the area of -the shaft 25, the mounting head7 comprises a suction pipe 27 which is displaceable in -the vertical direction. The slide 11 and tlle sucl,ion pipe 27 PHNo9699 5 2l~8~80 are displaced by means of pneurnatic cylinders 29 and 31 respectively. The extreme positions of the slide 11 and the suction pipe 27 are de-termined by the extreme posi-tions of the pistons in the cyJinders 29 ancl 31.
The operation of the device shown in the Figures 1 to 4 is as follows: A substrate S is positioned on the table 3 by means of the pins 5~ The slide 11 is in the loading positon shown in the ~igure I. A component A is suitably arrangecl in the recess 23 of the slide 11.
lO Subsequently, the slide 11 is slid -to the unloading position, shown in Figure 2~ in which the slide 11 closes the passage 25~ The suction pipe 27 is then in the initial position shown in Figure 1, its tip being situated in an aperture 28 in the beam 15 in the vicinity of the component 15 A which is picked up and slightly lifted. The slide 11 is subsequently returned to the loading position; as soon as the slide 11 has been withdrawn from the passage 25~ the pipe 27 is displaced, together with the component A, -through -the passage 25 in the direction of the substrate S, 20 until the component A contacts a layer of glue or tracks of solcler paste, previously depositioned on the substrate, on which the component is slightly pressed by the suction pipe. Subsequently, the vacuum is removed and the suction pipe is returned upwards to i-ts starting position.
As is shown in the Figures 1 and 2~ the suction pipe 27 is connected to a rod 33~ This rod comprises a groove 25 which extends through an angle of 9O and which can cooperate wi-th a pin 37 provided on a lever 39.
Using the lever 39~ the pin 37 can be made to engage or dis-30 engage the groove 35~ When the pin 37 engages the groove 35 the suction pipe 27 also performs a rotary movement around its centre line H through an angle of 9O during its vertical displacement, so that, if desired, the component A
can be rotated through an angle of 9O during i-ts dis-35 placement by means of the suction pipe. When the pin 37does not engage -the groove 35~ the pipe is not rotated.
The mounting head 51 Of the dev-ice shown in -the Figures 5 and 6 not only comprises tlle elements shown in ..

PHN.9699 6 2~.8.80 the Figures 1 through 4, but also a punch 53 which is displaceable in the ver-tical direction and which is arranged above the beam 15 a-t the area of -the recess 23 in the slide l1 when the la-tter is in -the loading position.
The punch 53 is connected to a -transport block 55 which comprises a slot 57 for guiding the slide 11 and also guide ribs 59 for guiding and supporting a component A to be transported. The components A are accommodated in cavities C in a tape-shaped carrier B. The carrier B is step-wise moved in the direction of the arrow D by means of a trans-port roller 53 which comprises transport pins 65 co-operating with transport holes P. The -transpor-t of the carrier B is synchronized so that, when -the carrier B
is stationary, a component A in the carrier B is situated in front of the punch 53. The punch 53 is then displaced downwards, so that the component A is transferred from the cavity C to the recess 23 in the slide 11. Subsequently, the slide 11, accommodating the component A taken over from the carrier B, is slid to the unloading position;
20 the further mounting of the component A is as previously described. After the raising of the punch 53, the carrier B
is transported one step further, after which a next cycle can -take place.
Figures 7 and 8 show a further embodiment of the device, the components A being dispensed from a magazine 73 in which they are stacked. To this end, the mounting head 71 of this device comprises a chamber 77 which is provided in the beam 15 and which serves as a holder for the magazine 73. The magazine is arranged in the chamber 77 so that the stacked components are situated over the recess 23 in the slide 11 when the la-tter is in the loading position, The supporting surface 22 of the slide is then si-tuated in a recess 79 of the magazine 73, so that the lowermost component in -the magazine bears on the supporting surface 23. This situation is shown in the Figures 7 and 8.
For -the removal O:r a component A ~rom -the maga-zine 73, -the slide 11 is displaced frorn the loacling 1 ~ 3 ~
PHN.9699 7 2~.8.80 position shown in ~`igure 7 to the unloading position, so that the lowermost cornponent A is taken along to the unloacling position by the vertical abu-tmen-t face 24 Of the slide 11. The further mounting of the componen-t A is realiæed in the described manner. The slide 11 has a leng-th such that the next componen-t A of the stack is locked against displacement by the slide during -the reciprocating movemen-ts of the slide, because -this component is supported by the upper side of the slide.
The reference numeral L~l clenotes a spring which enables a relative displacement ofthe suction pipe 27 with respect to the piston in -the cylinder 31 when the force with which a componen-t A is pressed against the substrate S by the pipe 27 becomes too high; damaging 15 and/or fracturing of components is thus prevented.
It will be clear from the description of the embodiments tha-t the device in accordance wi-th the in-vention is intended for -the successive mounting of identical components on successive substrates. After 20 arrangement of a component A on the substrate S in the described manner by means of the described device, this substrate is posit-ioned with respect to a next mounting head, whilst a next substrate is positioned in -the device shown.

Claims

PHN.9699 8 THE EMBODIMENTS OF THE INVENTION IN WHICH AN EXCLUSIVE
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:

1. An apparatus for mounting a chip-type electronic component on a substrate, comprising a table, a mounting head, and means for positioning a substrate on the table, wherein the mounting head comprises a slide which is dis-placeable in a guide between a loading position and an unloading position and which comprises a recess for receiv-ing a component to carry the component from the loading position to the unloading position, said mounting head also comprising a suction device which is displaceable in the vertical direction and which is operable to pick up a com-ponent from the slide when the latter is in the unloading position, and the guide comprising a passage through which a component picked-up by the suction device can be moved downwards by this device onto the substrate positioned beneath the guide.

2. An apparatus as claimed in Claim 1, wherein the mounting head comprises a punch which is situated at the area of the recess in the slide when the slide is in the loading position, the apparatus further comprising means for transporting and guiding between the punch and the guide a strip-shaped or tape-shaped carrier carrying a succession of said components.

3. An apparatus as claimed in Claim 1, wherein the mounting head comprises a holder for a magazine containing a stack of said components, the holder being arranged to support the magazine in the area of the recess in the slide when the slide is in the loading position so that the com-ponents can be transferred one at a time from the stack to the recess in the slide.

4. An apparatus as claimed in Claim 1, 2 or 3, wherein the suction device comprises a suction tube which is displaceable axially in the vertical direction to pick up a component from the slide and move this component down onto the substrate, and which is also rotatable about its longitudinal axis.