DE3060913D1 - Improvement in method of manufacturing electronic device having multilayer wiring structure - Google Patents
Improvement in method of manufacturing electronic device having multilayer wiring structureInfo
- Publication number
- DE3060913D1 DE3060913D1 DE8080301413T DE3060913T DE3060913D1 DE 3060913 D1 DE3060913 D1 DE 3060913D1 DE 8080301413 T DE8080301413 T DE 8080301413T DE 3060913 T DE3060913 T DE 3060913T DE 3060913 D1 DE3060913 D1 DE 3060913D1
- Authority
- DE
- Germany
- Prior art keywords
- improvement
- electronic device
- multilayer wiring
- wiring structure
- manufacturing electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/5329—Insulating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5761179A JPS55150254A (en) | 1979-05-12 | 1979-05-12 | Semiconductor device |
JP16812479A JPS5690834A (en) | 1979-12-26 | 1979-12-26 | Coating resin |
JP16811379A JPS5693169A (en) | 1979-12-26 | 1979-12-26 | Bubble memory device |
JP16915679A JPS5693113A (en) | 1979-12-27 | 1979-12-27 | Thin-film magnetic head |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3060913D1 true DE3060913D1 (en) | 1982-11-11 |
Family
ID=27463534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8080301413T Expired DE3060913D1 (en) | 1979-05-12 | 1980-04-30 | Improvement in method of manufacturing electronic device having multilayer wiring structure |
Country Status (3)
Country | Link |
---|---|
US (1) | US4347306A (de) |
EP (1) | EP0019391B1 (de) |
DE (1) | DE3060913D1 (de) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3234907A1 (de) * | 1982-09-21 | 1984-03-22 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen einer monolithisch integrierten schaltung |
JPS5982746A (ja) * | 1982-11-04 | 1984-05-12 | Toshiba Corp | 半導体装置の電極配線方法 |
JPS5998316A (ja) * | 1982-11-26 | 1984-06-06 | Sharp Corp | 薄膜磁気ヘツドの製造方法 |
JPS6012744A (ja) * | 1983-07-01 | 1985-01-23 | Hitachi Ltd | 半導体装置 |
US4451326A (en) * | 1983-09-07 | 1984-05-29 | Advanced Micro Devices, Inc. | Method for interconnecting metallic layers |
JPS60113993A (ja) * | 1983-11-25 | 1985-06-20 | 三菱電機株式会社 | 多層回路基板の製造方法 |
US4871619A (en) * | 1983-11-30 | 1989-10-03 | International Business Machines Corporation | Electronic components comprising polymide dielectric layers |
JPS60119730A (ja) * | 1983-11-30 | 1985-06-27 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | ポリイミド誘導体薄膜の形成方法 |
JPS60120723A (ja) * | 1983-11-30 | 1985-06-28 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 電子装置 |
US4656050A (en) * | 1983-11-30 | 1987-04-07 | International Business Machines Corporation | Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers |
US4699803A (en) * | 1983-11-30 | 1987-10-13 | International Business Machines Corporation | Method for forming electrical components comprising cured vinyl and/or acetylene terminated copolymers |
US4654223A (en) * | 1983-11-30 | 1987-03-31 | International Business Machines Corporation | Method for forming a film of dielectric material on an electric component |
US4568601A (en) * | 1984-10-19 | 1986-02-04 | International Business Machines Corporation | Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures |
JPH0616506B2 (ja) * | 1984-12-26 | 1994-03-02 | 株式会社半導体エネルギー研究所 | 積層体の側周辺に選択的に被膜を形成する方法 |
JPH069222B2 (ja) * | 1986-01-07 | 1994-02-02 | 日立化成工業株式会社 | 多層配線構造の製造法 |
US5314788A (en) * | 1986-01-24 | 1994-05-24 | Canon Kabushiki Kaisha | Matrix printed board and process of forming the same |
JPS6318697A (ja) * | 1986-07-11 | 1988-01-26 | 日本電気株式会社 | 多層配線基板 |
DE3627417A1 (de) * | 1986-08-13 | 1988-02-18 | Siemens Ag | Verfahren zum herstellen von niederohmigen verbindungen in der isolationsschicht zwischen zwei metallisierungsebenen |
US4886573A (en) * | 1986-08-27 | 1989-12-12 | Hitachi, Ltd. | Process for forming wiring on substrate |
US4866508A (en) * | 1986-09-26 | 1989-09-12 | General Electric Company | Integrated circuit packaging configuration for rapid customized design and unique test capability |
US5094709A (en) * | 1986-09-26 | 1992-03-10 | General Electric Company | Apparatus for packaging integrated circuit chips employing a polymer film overlay layer |
US4933042A (en) * | 1986-09-26 | 1990-06-12 | General Electric Company | Method for packaging integrated circuit chips employing a polymer film overlay layer |
US4783695A (en) * | 1986-09-26 | 1988-11-08 | General Electric Company | Multichip integrated circuit packaging configuration and method |
US4937203A (en) * | 1986-09-26 | 1990-06-26 | General Electric Company | Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer |
US4816422A (en) * | 1986-12-29 | 1989-03-28 | General Electric Company | Fabrication of large power semiconductor composite by wafer interconnection of individual devices |
US4835704A (en) * | 1986-12-29 | 1989-05-30 | General Electric Company | Adaptive lithography system to provide high density interconnect |
US4764485A (en) * | 1987-01-05 | 1988-08-16 | General Electric Company | Method for producing via holes in polymer dielectrics |
JPS63221629A (ja) * | 1987-03-11 | 1988-09-14 | Hitachi Ltd | 電子装置 |
EP0291778B1 (de) * | 1987-05-18 | 1994-03-16 | Siemens Aktiengesellschaft | Verfahren zur Herstellung hochwärmebeständiger Dielektrika |
US5120573A (en) * | 1988-09-28 | 1992-06-09 | Hitachi, Ltd. | Process for producing metal/polyimide composite article |
JPH07102646B2 (ja) * | 1988-09-30 | 1995-11-08 | 株式会社日立製作所 | 金属とポリイミドの複合成形体 |
US5208066A (en) * | 1989-03-18 | 1993-05-04 | Hitachi, Ltd. | Process of forming a patterned polyimide film and articles including such a film |
US5254361A (en) * | 1989-07-24 | 1993-10-19 | Chisso Corporation | Method for producing printed circuit boards |
US5229257A (en) * | 1990-04-30 | 1993-07-20 | International Business Machines Corporation | Process for forming multi-level coplanar conductor/insulator films employing photosensitive polymide polymer compositions |
US5091289A (en) * | 1990-04-30 | 1992-02-25 | International Business Machines Corporation | Process for forming multi-level coplanar conductor/insulator films employing photosensitive polyimide polymer compositions |
US5241040A (en) * | 1990-07-11 | 1993-08-31 | International Business Machines Corporation | Microwave processing |
US5102718A (en) * | 1990-07-27 | 1992-04-07 | Minnesota Mining And Manufacturing Company | Multi-chip substrate |
US5284801A (en) * | 1992-07-22 | 1994-02-08 | Vlsi Technology, Inc. | Methods of moisture protection in semiconductor devices utilizing polyimides for inter-metal dielectric |
US5397741A (en) * | 1993-03-29 | 1995-03-14 | International Business Machines Corporation | Process for metallized vias in polyimide |
US6099939A (en) * | 1995-04-13 | 2000-08-08 | International Business Machines Corporation | Enhanced adhesion between a vapor deposited metal and an organic polymer surface exhibiting tailored morphology |
DE69734947T2 (de) | 1996-02-29 | 2006-08-24 | Tokyo Ohka Kogyo Co., Ltd., Kawasaki | Verfahren zur Herstellung von mehrschichtigen Leiterplatten |
US6141870A (en) | 1997-08-04 | 2000-11-07 | Peter K. Trzyna | Method for making electrical device |
JP2003282698A (ja) * | 2002-03-22 | 2003-10-03 | Sony Corp | 半導体装置の製造方法および半導体装置 |
US20060019102A1 (en) * | 2004-07-26 | 2006-01-26 | Kuppsuamy Kanakarajan | Flame-retardant halogen-free polyimide films useful as thermal insulation in aircraft applications and methods relating thereto |
JP4930143B2 (ja) * | 2006-06-29 | 2012-05-16 | Jnc株式会社 | 保護膜用組成物、カラーフィルター基板および液晶表示素子 |
DE102017119280A1 (de) | 2017-08-23 | 2019-02-28 | Heraeus Noblelight Gmbh | Verfahren und Vorrichtung zur Herstellung einer Polyimidschicht auf einem Substrat |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3152225A (en) * | 1958-06-11 | 1964-10-06 | Sylvania Electric Prod | Magnetic tape transducer |
US3573193A (en) * | 1968-12-04 | 1971-03-30 | Ibm | Method for controlling properties of magnetic film |
IL34531A (en) * | 1969-06-09 | 1972-12-29 | Honeywell Inc | Construction of plated-wire memory planes |
JPS5144871B2 (de) * | 1971-09-25 | 1976-12-01 | ||
US4023999A (en) * | 1972-06-14 | 1977-05-17 | Westinghouse Electric Corporation | Formation of openings in dielectric sheet |
US3838407A (en) * | 1973-12-28 | 1974-09-24 | Texas Instruments Inc | Bubble memory organization with two port major/minor loop transfer |
FR2263577B1 (de) * | 1974-03-08 | 1978-07-07 | Tecsi Tech Systemes Inf | |
US4218283A (en) * | 1974-08-23 | 1980-08-19 | Hitachi, Ltd. | Method for fabricating semiconductor device and etchant for polymer resin |
JPS52135713A (en) * | 1976-05-10 | 1977-11-14 | Hitachi Ltd | Formation of magnetic head |
US4110838A (en) * | 1976-07-30 | 1978-08-29 | Texas Instruments Incorporated | Magnetic bubble memory package |
US4092442A (en) * | 1976-12-30 | 1978-05-30 | International Business Machines Corporation | Method of depositing thin films utilizing a polyimide mask |
JPS5933244B2 (ja) * | 1977-03-02 | 1984-08-14 | 株式会社日立製作所 | 磁気バブル記憶素子 |
US4112503A (en) * | 1977-04-08 | 1978-09-05 | Sperry Rand Corporation | Stripe domain propagation using contiguous bicore disk file structure |
-
1980
- 1980-04-30 DE DE8080301413T patent/DE3060913D1/de not_active Expired
- 1980-04-30 EP EP80301413A patent/EP0019391B1/de not_active Expired
- 1980-05-12 US US06/148,722 patent/US4347306A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0019391A1 (de) | 1980-11-26 |
EP0019391B1 (de) | 1982-10-06 |
US4347306A (en) | 1982-08-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3060913D1 (en) | Improvement in method of manufacturing electronic device having multilayer wiring structure | |
JPS54144969A (en) | Multilayer circuit board and method of producing same | |
DE3065150D1 (en) | Improved electronic device having multilayer wiring structure | |
JPS5731199A (en) | Multilayer circuit board and method of producing same | |
JPS5673490A (en) | Circuit board device and method of manufacturing same | |
GB8400678D0 (en) | Electronic multilayer component | |
JPS5694719A (en) | Method of manufacturing laminated electronic component | |
DE3269431D1 (en) | Thin layered electronic circuit and manufacturing method thereof | |
JPS5626498A (en) | Method of wiring circuit component | |
JPS52101473A (en) | Wiring circuit board and method of producing same | |
JPS5453267A (en) | Method of manufacturing thick film multilayer wiring board | |
JPS5612797A (en) | Multilayer printed circuit board and method of manufacturing same | |
JPS523161A (en) | Method of mounting electronic parts in highhspeed simultaneous multilayered wiring | |
JPS5676590A (en) | Method of wiring electronic part | |
JPS5365969A (en) | Multilayer circuit board and method of producing same | |
JPS5434061A (en) | Multiilayer printed wiring board and method of manufacturing same | |
JPS56147500A (en) | Board circuit device and method of manufacturing same | |
DE3275452D1 (en) | Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same | |
JPS5651899A (en) | Method of manufacturing high density multilayer circuit board | |
JPS5593286A (en) | Electronic circuit and method of fabricating same | |
JPS561598A (en) | Method of fabricating multilayer wiring circuit board | |
JPS5678196A (en) | Method of fabricating wiring structure for electronic circuit | |
JPS5412457A (en) | Multiilayer printed wiring board and method of manufacturing same | |
GB8409924D0 (en) | Manufacturing small electronic device | |
JPS55157296A (en) | Method of fabricating high density multilayer wiring substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8339 | Ceased/non-payment of the annual fee |