JPS5690834A - Coating resin - Google Patents

Coating resin

Info

Publication number
JPS5690834A
JPS5690834A JP16812479A JP16812479A JPS5690834A JP S5690834 A JPS5690834 A JP S5690834A JP 16812479 A JP16812479 A JP 16812479A JP 16812479 A JP16812479 A JP 16812479A JP S5690834 A JPS5690834 A JP S5690834A
Authority
JP
Japan
Prior art keywords
resin
flattening
coating
film
soluble
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16812479A
Other languages
Japanese (ja)
Other versions
JPS6320853B2 (en
Inventor
Minoru Nakajima
Shiro Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16812479A priority Critical patent/JPS5690834A/en
Priority to DE8080301413T priority patent/DE3060913D1/en
Priority to EP80301413A priority patent/EP0019391B1/en
Priority to US06/148,722 priority patent/US4347306A/en
Publication of JPS5690834A publication Critical patent/JPS5690834A/en
Publication of JPS6320853B2 publication Critical patent/JPS6320853B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Paints Or Removers (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Organic Insulating Materials (AREA)

Abstract

PURPOSE:To provide the titled insulating resin which has excelleent film-forming properties, flattening ability and coating properties and produces cured articles having excellent heat resistance, consisting of an addition polymn. type polyimide which has a specified MW range and is soluble in ketone solvents. CONSTITUTION:There is provided a coating resin consisting of an addition polymn. type polyimide of formula I (wherein R is a bivalent arom. group contg. no active hydrogen; Y is a radical of formula II or III; n is a positive integer) which has a MW of 1,000-10,000 and is soluble in ketone solvents (e.g. acetophenone, isophorone and the like). Since low-molecular compd. such as water are not produced by curing reaction a defect such as blistering in coating film is difficultly caused and shrinkage on curing is reduced. Thus, the resin excels in flattening uneven surfaces. When the MW of the resin is in the above MW range, the resin exhibits excellent film-forming properties so that fine wrinkles are not formed and the insufficient flattening of the surfaces is not conducted.
JP16812479A 1979-05-12 1979-12-26 Coating resin Granted JPS5690834A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP16812479A JPS5690834A (en) 1979-12-26 1979-12-26 Coating resin
DE8080301413T DE3060913D1 (en) 1979-05-12 1980-04-30 Improvement in method of manufacturing electronic device having multilayer wiring structure
EP80301413A EP0019391B1 (en) 1979-05-12 1980-04-30 Improvement in method of manufacturing electronic device having multilayer wiring structure
US06/148,722 US4347306A (en) 1979-05-12 1980-05-12 Method of manufacturing electronic device having multilayer wiring structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16812479A JPS5690834A (en) 1979-12-26 1979-12-26 Coating resin

Publications (2)

Publication Number Publication Date
JPS5690834A true JPS5690834A (en) 1981-07-23
JPS6320853B2 JPS6320853B2 (en) 1988-04-30

Family

ID=15862286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16812479A Granted JPS5690834A (en) 1979-05-12 1979-12-26 Coating resin

Country Status (1)

Country Link
JP (1) JPS5690834A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121064A (en) * 1981-01-02 1982-07-28 Ibm Formation of surface-even thin film
JPS59186204A (en) * 1983-04-05 1984-10-23 株式会社日立製作所 Method of forming wiring structure
JP2001160508A (en) * 1999-09-24 2001-06-12 Sumitomo Special Metals Co Ltd R-Fe-B PERMANENT MAGNET AND ITS MANUFACTURING METHOD

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121064A (en) * 1981-01-02 1982-07-28 Ibm Formation of surface-even thin film
JPS6248555B2 (en) * 1981-01-02 1987-10-14 Intaanashonaru Bijinesu Mashiinzu Corp
JPS59186204A (en) * 1983-04-05 1984-10-23 株式会社日立製作所 Method of forming wiring structure
JPH0125162B2 (en) * 1983-04-05 1989-05-16 Hitachi Ltd
JP2001160508A (en) * 1999-09-24 2001-06-12 Sumitomo Special Metals Co Ltd R-Fe-B PERMANENT MAGNET AND ITS MANUFACTURING METHOD

Also Published As

Publication number Publication date
JPS6320853B2 (en) 1988-04-30

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