DE298529C - - Google Patents
Info
- Publication number
- DE298529C DE298529C DENDAT298529D DE298529DA DE298529C DE 298529 C DE298529 C DE 298529C DE NDAT298529 D DENDAT298529 D DE NDAT298529D DE 298529D A DE298529D A DE 298529DA DE 298529 C DE298529 C DE 298529C
- Authority
- DE
- Germany
- Prior art keywords
- profile bar
- fabric
- profile
- aircraft
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004744 fabric Substances 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 7
- 239000000969 carrier Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 239000002023 wood Substances 0.000 description 7
- 238000009958 sewing Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 239000010985 leather Substances 0.000 description 2
- 240000008159 Ceiba pentandra Species 0.000 description 1
- 235000003301 Ceiba pentandra Nutrition 0.000 description 1
- 210000002421 Cell Wall Anatomy 0.000 description 1
- 230000037250 Clearance Effects 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 240000006962 Gossypium hirsutum Species 0.000 description 1
- 210000002356 Skeleton Anatomy 0.000 description 1
- 210000003491 Skin Anatomy 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 210000004027 cells Anatomy 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000035512 clearance Effects 0.000 description 1
- 230000000875 corresponding Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002349 favourable Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 210000000689 upper leg Anatomy 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64C—AEROPLANES; HELICOPTERS
- B64C1/00—Fuselages; Constructional features common to fuselages, wings, stabilising surfaces or the like
- B64C1/06—Frames; Stringers; Longerons ; Fuselage sections
- B64C1/12—Construction or attachment of skin panels
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Aviation & Aerospace Engineering (AREA)
- Building Environments (AREA)
Publications (1)
Publication Number | Publication Date |
---|---|
DE298529C true DE298529C (ja) |
Family
ID=552725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DENDAT298529D Active DE298529C (ja) |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE298529C (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5845662A (en) * | 1995-05-02 | 1998-12-08 | Sumnitsch; Franz | Device for treatment of wafer-shaped articles, especially silicon wafers |
-
0
- DE DENDAT298529D patent/DE298529C/de active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5845662A (en) * | 1995-05-02 | 1998-12-08 | Sumnitsch; Franz | Device for treatment of wafer-shaped articles, especially silicon wafers |
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