DE2553019C3 - lichtempfindliches thermoplastisches Material und Verfahren zum Aufbringen einer Photoresist-bildenden .Schicht auf eine Unterlage - Google Patents
lichtempfindliches thermoplastisches Material und Verfahren zum Aufbringen einer Photoresist-bildenden .Schicht auf eine UnterlageInfo
- Publication number
- DE2553019C3 DE2553019C3 DE2553019A DE2553019A DE2553019C3 DE 2553019 C3 DE2553019 C3 DE 2553019C3 DE 2553019 A DE2553019 A DE 2553019A DE 2553019 A DE2553019 A DE 2553019A DE 2553019 C3 DE2553019 C3 DE 2553019C3
- Authority
- DE
- Germany
- Prior art keywords
- layer
- photosensitive
- grooves
- areas
- roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims description 28
- 239000012815 thermoplastic material Substances 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 title description 2
- 239000000463 material Substances 0.000 claims description 60
- 229920002120 photoresistant polymer Polymers 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 6
- 239000010408 film Substances 0.000 description 39
- 229910000679 solder Inorganic materials 0.000 description 18
- 238000003475 lamination Methods 0.000 description 14
- -1 polyethylene terephthalate Polymers 0.000 description 12
- 238000010030 laminating Methods 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 230000005855 radiation Effects 0.000 description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
- 239000010931 gold Substances 0.000 description 9
- 229910052737 gold Inorganic materials 0.000 description 9
- 239000011888 foil Substances 0.000 description 8
- 229920001169 thermoplastic Polymers 0.000 description 8
- 239000004416 thermosoftening plastic Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000013039 cover film Substances 0.000 description 4
- 239000000975 dye Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 239000008207 working material Substances 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000006249 magnetic particle Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/527,840 US3984244A (en) | 1974-11-27 | 1974-11-27 | Process for laminating a channeled photosensitive layer on an irregular surface |
Publications (3)
Publication Number | Publication Date |
---|---|
DE2553019A1 DE2553019A1 (de) | 1976-08-12 |
DE2553019B2 DE2553019B2 (de) | 1978-04-20 |
DE2553019C3 true DE2553019C3 (de) | 1978-12-14 |
Family
ID=24103153
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2553019A Expired DE2553019C3 (de) | 1974-11-27 | 1975-11-26 | lichtempfindliches thermoplastisches Material und Verfahren zum Aufbringen einer Photoresist-bildenden .Schicht auf eine Unterlage |
Country Status (5)
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3984244A (en) * | 1974-11-27 | 1976-10-05 | E. I. Du Pont De Nemours And Company | Process for laminating a channeled photosensitive layer on an irregular surface |
JPS54121802A (en) * | 1978-03-13 | 1979-09-21 | Tokyo Ouka Kougiyou Kk | Photosensitive printing plate |
US4264708A (en) * | 1978-03-31 | 1981-04-28 | E. I. Du Pont De Nemours And Company | Radiation sensitive element having a thin photopolymerizable layer |
JPS566498A (en) * | 1979-06-26 | 1981-01-23 | Hitachi Chemical Co Ltd | Method of manufacturing flexible printed circuit board |
US4308338A (en) * | 1980-03-26 | 1981-12-29 | E. I. Du Pont De Nemours And Company | Methods of imaging photopolymerizable materials containing diester polyether |
US4506004A (en) * | 1982-04-01 | 1985-03-19 | Sullivan Donald F | Printed wiring board |
IT1210033B (it) * | 1982-02-10 | 1989-09-06 | Bc Chem Srl | Macchina per applicare una porzione di film fotosensibile su almeno unafaccia di una lastra piana avente una estensione superficiale maggiore di detta porzione |
USRE32430E (en) * | 1982-04-01 | 1987-06-02 | Printed wiring board | |
US4631246A (en) * | 1982-04-14 | 1986-12-23 | E. I. Du Pont De Nemours And Company | Uniform cover sheet with rough surface in a photosensitive element |
US4567128A (en) * | 1982-04-14 | 1986-01-28 | E. I. Du Pont De Nemours And Company | Cover sheet in a photosensitive element |
US4587199A (en) * | 1983-07-11 | 1986-05-06 | E. I. Du Pont De Nemours And Company | Controlled roughening of a photosensitive composition |
US4555285A (en) * | 1983-12-14 | 1985-11-26 | International Business Machines Corporation | Forming patterns in metallic or ceramic substrates |
US4546029A (en) * | 1984-06-18 | 1985-10-08 | Clopay Corporation | Random embossed matte plastic film |
US5395269A (en) * | 1985-07-01 | 1995-03-07 | The Whitaker Corporation | Method of sealing electrical connectors using a broad spectrum light and heat curable composition |
US4717643A (en) * | 1985-08-06 | 1988-01-05 | Hercules Incorporated | No thermal cure dry film solder mask |
US4727013A (en) * | 1985-09-18 | 1988-02-23 | Vacuum Applied Coatings Corp. | Method for creating a design in relief in a hard smooth substrate and apparatus for use in the method |
US4652513A (en) * | 1985-09-18 | 1987-03-24 | Vacuum Applied Coatings Corp. | Method for creating a design in relief in a hard smooth substrate and apparatus for use in the method |
EP0254901A3 (en) * | 1986-07-18 | 1990-05-23 | Tektronix, Inc. | Lamination method and apparatus |
IT1216415B (it) * | 1986-08-01 | 1990-02-28 | 3B Spa | Procedimento per realizzare pannelli a superficie incisa,rivestiti con foglio di materiale termodeformabile,e macchina per effettuare il procedimento |
US5129142A (en) * | 1990-10-30 | 1992-07-14 | International Business Machines Corporation | Encapsulated circuitized power core alignment and lamination |
US5298685A (en) * | 1990-10-30 | 1994-03-29 | International Business Machines Corporation | Interconnection method and structure for organic circuit boards |
DE69221072T2 (de) * | 1991-11-01 | 1997-11-13 | Macdermid Imaging Technology | Erhöhung der Haftung von photopolymerisierbaren Trockenfilmzusammensetzungen auf Trägern |
KR100267229B1 (ko) * | 1997-09-03 | 2000-10-16 | 윤종용 | 인쇄회로기판의금도금단자부오염방지방법 |
US6001532A (en) * | 1997-09-25 | 1999-12-14 | E.I. Dupont De Nemours And Company | Peel-apart photosensitive elements and their process of use |
US5965321A (en) * | 1997-09-25 | 1999-10-12 | E. U. Du Pont De Nemours And Company | Peel-apart photosensitive elements and their process of use |
US6601768B2 (en) | 2001-03-08 | 2003-08-05 | Welch Allyn Data Collection, Inc. | Imaging module for optical reader comprising refractive diffuser |
US6528218B1 (en) * | 1998-12-15 | 2003-03-04 | International Business Machines Corporation | Method of fabricating circuitized structures |
US6100006A (en) * | 1999-08-19 | 2000-08-08 | E. I. Du Pont De Nemours And Company | Peel-apart photosensitive elements and their process of use |
US6832725B2 (en) | 1999-10-04 | 2004-12-21 | Hand Held Products, Inc. | Optical reader comprising multiple color illumination |
US6653056B2 (en) | 2000-07-12 | 2003-11-25 | E. I. Du Pont Nemours And Company | Process for patterning non-photoimagable ceramic tape |
CN2478312Y (zh) * | 2001-04-10 | 2002-02-20 | 伊博电源(杭州)有限公司 | 表面贴封装的电气联接件 |
US20040231831A1 (en) * | 2001-05-31 | 2004-11-25 | Houck Glenn M. | Apparatus which eliminates the need for idling by trucks |
TWI347499B (en) * | 2005-05-12 | 2011-08-21 | Tokyo Ohka Kogyo Co Ltd | A method for increasing optical stability of three-dimensional micro moldings |
US9224999B2 (en) * | 2008-10-30 | 2015-12-29 | Infineon Technologies Americas Corp. | Vehicle battery module |
GB201613051D0 (en) | 2016-07-28 | 2016-09-14 | Landa Labs (2012) Ltd | Applying an electrical conductor to a substrate |
US11454010B2 (en) | 2017-03-09 | 2022-09-27 | Charles James SPOFFORD | Appliance with shim compatible geometry |
JP7009225B2 (ja) * | 2018-01-16 | 2022-01-25 | キヤノン株式会社 | 構造体の製造方法、液体吐出ヘッドの製造方法、保護部材、保護基板及び保護基板の製造方法 |
GB2591723B (en) * | 2019-10-22 | 2022-09-14 | Lumet Tech Ltd | Method and apparatus for introducing a substrate into a nip |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL53196C (nl) * | 1939-01-19 | 1940-11-15 | Chemische Fabriek | werkwijze en inrichting voor het ontwikkelen en/of fixeeren van lichtdrukken, in het bijzonder diazotypieen en blauwdrukken, volgens de zoogenaamde half-natte methode |
US3011383A (en) * | 1957-04-30 | 1961-12-05 | Carpenter L E Co | Decorative optical material |
NL271863A (US07534539-20090519-C00280.png) * | 1960-11-28 | |||
NL6504265A (US07534539-20090519-C00280.png) * | 1965-04-03 | 1966-10-04 | ||
US3535157A (en) * | 1967-12-18 | 1970-10-20 | Shipley Co | Method of coating printed circuit board having through-holes |
US3629036A (en) * | 1969-02-14 | 1971-12-21 | Shipley Co | The method coating of photoresist on circuit boards |
US3728176A (en) * | 1971-04-30 | 1973-04-17 | Motorola Inc | Method of causing adherence of glass to gold |
US3773537A (en) * | 1971-10-01 | 1973-11-20 | D Colwell | Method of making a picture with surface irregularities from a flat print |
JPS5031488B2 (US07534539-20090519-C00280.png) * | 1971-10-11 | 1975-10-11 | ||
US3742229A (en) * | 1972-06-29 | 1973-06-26 | Massachusetts Inst Technology | Soft x-ray mask alignment system |
US3891443A (en) * | 1973-02-01 | 1975-06-24 | Polychrome Corp | Mat finish photosensitive relief plates |
US3984244A (en) * | 1974-11-27 | 1976-10-05 | E. I. Du Pont De Nemours And Company | Process for laminating a channeled photosensitive layer on an irregular surface |
-
1974
- 1974-11-27 US US05/527,840 patent/US3984244A/en not_active Expired - Lifetime
-
1975
- 1975-11-26 DE DE2553019A patent/DE2553019C3/de not_active Expired
- 1975-11-26 FR FR7536151A patent/FR2293001A1/fr active Granted
- 1975-11-26 NL NL7513784.A patent/NL160400C/xx not_active IP Right Cessation
- 1975-11-27 JP JP14214775A patent/JPS5421736B2/ja not_active Expired
-
1978
- 1978-12-22 JP JP53158403A patent/JPS5932780B2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5179341A (US07534539-20090519-C00280.png) | 1976-07-10 |
US3984244A (en) | 1976-10-05 |
DE2553019A1 (de) | 1976-08-12 |
NL7513784A (nl) | 1976-05-31 |
JPS5421736B2 (US07534539-20090519-C00280.png) | 1979-08-01 |
DE2553019B2 (de) | 1978-04-20 |
NL160400B (nl) | 1979-05-15 |
JPS54109425A (en) | 1979-08-28 |
FR2293001B1 (US07534539-20090519-C00280.png) | 1982-03-05 |
NL160400C (nl) | 1979-10-15 |
JPS5932780B2 (ja) | 1984-08-10 |
FR2293001A1 (fr) | 1976-06-25 |
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