DE2546736C3 - Diskretes Überkreuzungschip für einzelne Leiterbahnüberkreuzungen bei Hybridschaltungen und Verfahren zu seiner Herstellung - Google Patents
Diskretes Überkreuzungschip für einzelne Leiterbahnüberkreuzungen bei Hybridschaltungen und Verfahren zu seiner HerstellungInfo
- Publication number
- DE2546736C3 DE2546736C3 DE2546736A DE2546736A DE2546736C3 DE 2546736 C3 DE2546736 C3 DE 2546736C3 DE 2546736 A DE2546736 A DE 2546736A DE 2546736 A DE2546736 A DE 2546736A DE 2546736 C3 DE2546736 C3 DE 2546736C3
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- chip
- metal
- crossover
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5385—Assembly of a plurality of insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Electric Cables (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2546736A DE2546736C3 (de) | 1975-10-17 | 1975-10-17 | Diskretes Überkreuzungschip für einzelne Leiterbahnüberkreuzungen bei Hybridschaltungen und Verfahren zu seiner Herstellung |
| CH1131376A CH604376A5 (OSRAM) | 1975-10-17 | 1976-09-07 | |
| GB37801/76A GB1548980A (en) | 1975-10-17 | 1976-09-13 | Hybrid circuits crossover paths |
| US05/730,285 US4097685A (en) | 1975-10-17 | 1976-10-06 | Discrete crossover chips for individual conductor track crossovers in hybrid circuits and method for constructing same |
| IT28250/76A IT1077067B (it) | 1975-10-17 | 1976-10-13 | Chip discreti per sinoli incroci fra piste conduttrici di circuiti ibridi e procedimento per la loro fabbricazione |
| FR7630915A FR2328294A2 (fr) | 1975-06-13 | 1976-10-14 | Microplaquettes individuelles a croisements pour differents croisements de voies conductrices dans des circuits hybrides, et procede pour leur fabrication. |
| SE7611484A SE7611484L (sv) | 1975-10-17 | 1976-10-15 | Diskreta overkorsningschips for enskilda ledningsbankorsningar |
| JP51124796A JPS5279264A (en) | 1975-10-17 | 1976-10-18 | Discrete crossover chip for respective wiring and crossover hybrid circuit and method of producing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2546736A DE2546736C3 (de) | 1975-10-17 | 1975-10-17 | Diskretes Überkreuzungschip für einzelne Leiterbahnüberkreuzungen bei Hybridschaltungen und Verfahren zu seiner Herstellung |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2546736A1 DE2546736A1 (de) | 1977-04-21 |
| DE2546736B2 DE2546736B2 (de) | 1979-11-08 |
| DE2546736C3 true DE2546736C3 (de) | 1980-07-31 |
Family
ID=5959463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2546736A Expired DE2546736C3 (de) | 1975-06-13 | 1975-10-17 | Diskretes Überkreuzungschip für einzelne Leiterbahnüberkreuzungen bei Hybridschaltungen und Verfahren zu seiner Herstellung |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4097685A (OSRAM) |
| JP (1) | JPS5279264A (OSRAM) |
| CH (1) | CH604376A5 (OSRAM) |
| DE (1) | DE2546736C3 (OSRAM) |
| GB (1) | GB1548980A (OSRAM) |
| IT (1) | IT1077067B (OSRAM) |
| SE (1) | SE7611484L (OSRAM) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS594873B2 (ja) * | 1978-09-26 | 1984-02-01 | 松下電器産業株式会社 | 印刷配線板 |
| JPH0547619U (ja) * | 1991-12-03 | 1993-06-25 | 株式会社荒井製作所 | 密封装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3447038A (en) * | 1966-08-01 | 1969-05-27 | Us Navy | Method and apparatus for interconnecting microelectronic circuit wafers |
| GB1245972A (en) * | 1968-02-08 | 1971-09-15 | Marconi Co Ltd | Improvements in or relating to circuit arrangements |
| US4000054A (en) | 1970-11-06 | 1976-12-28 | Microsystems International Limited | Method of making thin film crossover structure |
| AT337292B (de) * | 1971-09-02 | 1977-06-27 | Siemens Ag | Verfahren zur herstellung einer leiterplatte |
| JPS5146904B2 (OSRAM) * | 1971-09-30 | 1976-12-11 | ||
| US3806629A (en) * | 1972-07-03 | 1974-04-23 | Spacetac Inc | Crossover junction |
-
1975
- 1975-10-17 DE DE2546736A patent/DE2546736C3/de not_active Expired
-
1976
- 1976-09-07 CH CH1131376A patent/CH604376A5/xx not_active IP Right Cessation
- 1976-09-13 GB GB37801/76A patent/GB1548980A/en not_active Expired
- 1976-10-06 US US05/730,285 patent/US4097685A/en not_active Expired - Lifetime
- 1976-10-13 IT IT28250/76A patent/IT1077067B/it active
- 1976-10-15 SE SE7611484A patent/SE7611484L/xx not_active Application Discontinuation
- 1976-10-18 JP JP51124796A patent/JPS5279264A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| IT1077067B (it) | 1985-04-27 |
| DE2546736A1 (de) | 1977-04-21 |
| CH604376A5 (OSRAM) | 1978-09-15 |
| DE2546736B2 (de) | 1979-11-08 |
| US4097685A (en) | 1978-06-27 |
| GB1548980A (en) | 1979-07-18 |
| JPS5279264A (en) | 1977-07-04 |
| SE7611484L (sv) | 1977-04-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C3 | Grant after two publication steps (3rd publication) | ||
| 8340 | Patent of addition ceased/non-payment of fee of main patent |