FR2328294A2 - Microplaquettes individuelles a croisements pour differents croisements de voies conductrices dans des circuits hybrides, et procede pour leur fabrication. - Google Patents

Microplaquettes individuelles a croisements pour differents croisements de voies conductrices dans des circuits hybrides, et procede pour leur fabrication.

Info

Publication number
FR2328294A2
FR2328294A2 FR7630915A FR7630915A FR2328294A2 FR 2328294 A2 FR2328294 A2 FR 2328294A2 FR 7630915 A FR7630915 A FR 7630915A FR 7630915 A FR7630915 A FR 7630915A FR 2328294 A2 FR2328294 A2 FR 2328294A2
Authority
FR
France
Prior art keywords
chips
metallising
plastics
hybrid circuit
plastics lacquer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7630915A
Other languages
English (en)
Other versions
FR2328294B2 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2526554A external-priority patent/DE2526554C3/de
Priority claimed from DE2546736A external-priority patent/DE2546736C3/de
Application filed by Siemens AG filed Critical Siemens AG
Publication of FR2328294A2 publication Critical patent/FR2328294A2/fr
Application granted granted Critical
Publication of FR2328294B2 publication Critical patent/FR2328294B2/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
FR7630915A 1975-06-13 1976-10-14 Microplaquettes individuelles a croisements pour differents croisements de voies conductrices dans des circuits hybrides, et procede pour leur fabrication. Granted FR2328294A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2526554A DE2526554C3 (de) 1975-06-13 1975-06-13 Diskretes Überkreuzungschip für einzelne Leiterbahnfiberkreuzungen bei Hybridschaltungen und Verfahren zu seiner Herstellung
DE2546736A DE2546736C3 (de) 1975-10-17 1975-10-17 Diskretes Überkreuzungschip für einzelne Leiterbahnüberkreuzungen bei Hybridschaltungen und Verfahren zu seiner Herstellung

Publications (2)

Publication Number Publication Date
FR2328294A2 true FR2328294A2 (fr) 1977-05-13
FR2328294B2 FR2328294B2 (fr) 1979-01-19

Family

ID=34314864

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7630915A Granted FR2328294A2 (fr) 1975-06-13 1976-10-14 Microplaquettes individuelles a croisements pour differents croisements de voies conductrices dans des circuits hybrides, et procede pour leur fabrication.

Country Status (1)

Country Link
FR (1) FR2328294A2 (fr)

Also Published As

Publication number Publication date
FR2328294B2 (fr) 1979-01-19

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