IT1077067B - Chip discreti per sinoli incroci fra piste conduttrici di circuiti ibridi e procedimento per la loro fabbricazione - Google Patents

Chip discreti per sinoli incroci fra piste conduttrici di circuiti ibridi e procedimento per la loro fabbricazione

Info

Publication number
IT1077067B
IT1077067B IT28250/76A IT2825076A IT1077067B IT 1077067 B IT1077067 B IT 1077067B IT 28250/76 A IT28250/76 A IT 28250/76A IT 2825076 A IT2825076 A IT 2825076A IT 1077067 B IT1077067 B IT 1077067B
Authority
IT
Italy
Prior art keywords
sinoli
crossings
procedure
manufacture
hybrid circuit
Prior art date
Application number
IT28250/76A
Other languages
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of IT1077067B publication Critical patent/IT1077067B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
IT28250/76A 1975-10-17 1976-10-13 Chip discreti per sinoli incroci fra piste conduttrici di circuiti ibridi e procedimento per la loro fabbricazione IT1077067B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2546736A DE2546736C3 (de) 1975-10-17 1975-10-17 Diskretes Überkreuzungschip für einzelne Leiterbahnüberkreuzungen bei Hybridschaltungen und Verfahren zu seiner Herstellung

Publications (1)

Publication Number Publication Date
IT1077067B true IT1077067B (it) 1985-04-27

Family

ID=5959463

Family Applications (1)

Application Number Title Priority Date Filing Date
IT28250/76A IT1077067B (it) 1975-10-17 1976-10-13 Chip discreti per sinoli incroci fra piste conduttrici di circuiti ibridi e procedimento per la loro fabbricazione

Country Status (7)

Country Link
US (1) US4097685A (it)
JP (1) JPS5279264A (it)
CH (1) CH604376A5 (it)
DE (1) DE2546736C3 (it)
GB (1) GB1548980A (it)
IT (1) IT1077067B (it)
SE (1) SE7611484L (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594873B2 (ja) * 1978-09-26 1984-02-01 松下電器産業株式会社 印刷配線板
JPH0547619U (ja) * 1991-12-03 1993-06-25 株式会社荒井製作所 密封装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3447038A (en) * 1966-08-01 1969-05-27 Us Navy Method and apparatus for interconnecting microelectronic circuit wafers
GB1245972A (en) * 1968-02-08 1971-09-15 Marconi Co Ltd Improvements in or relating to circuit arrangements
AT337292B (de) * 1971-09-02 1977-06-27 Siemens Ag Verfahren zur herstellung einer leiterplatte
JPS5146904B2 (it) * 1971-09-30 1976-12-11
US3806629A (en) * 1972-07-03 1974-04-23 Spacetac Inc Crossover junction

Also Published As

Publication number Publication date
DE2546736A1 (de) 1977-04-21
CH604376A5 (it) 1978-09-15
GB1548980A (en) 1979-07-18
DE2546736B2 (de) 1979-11-08
SE7611484L (sv) 1977-04-18
US4097685A (en) 1978-06-27
DE2546736C3 (de) 1980-07-31
JPS5279264A (en) 1977-07-04

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