DE2543651A1 - Halbleitersubstrat - Google Patents

Halbleitersubstrat

Info

Publication number
DE2543651A1
DE2543651A1 DE19752543651 DE2543651A DE2543651A1 DE 2543651 A1 DE2543651 A1 DE 2543651A1 DE 19752543651 DE19752543651 DE 19752543651 DE 2543651 A DE2543651 A DE 2543651A DE 2543651 A1 DE2543651 A1 DE 2543651A1
Authority
DE
Germany
Prior art keywords
marking
semiconductor substrate
bonding
wire
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19752543651
Other languages
German (de)
English (en)
Inventor
Tsutomu Mimata
Masakazu Ozawa
Ryozo Yuzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE2543651A1 publication Critical patent/DE2543651A1/de
Pending legal-status Critical Current

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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
DE19752543651 1974-09-30 1975-09-30 Halbleitersubstrat Pending DE2543651A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP49111469A JPS5138969A (enrdf_load_stackoverflow) 1974-09-30 1974-09-30

Publications (1)

Publication Number Publication Date
DE2543651A1 true DE2543651A1 (de) 1976-04-15

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JP (1) JPS5138969A (enrdf_load_stackoverflow)
DE (1) DE2543651A1 (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4477826A (en) * 1979-07-04 1984-10-16 Westinghouse Brake & Signal Co. Ltd. Arrangement for aligning and attaching a shim to a semiconductor element
US4642672A (en) * 1982-09-14 1987-02-10 Nec Corporation Semiconductor device having registration mark for electron beam exposure
DE19632116A1 (de) * 1996-08-08 1998-02-12 Siemens Ag Chiperkennungsvorrichtung

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5499226U (enrdf_load_stackoverflow) * 1977-12-23 1979-07-13
JPS5715435A (en) * 1980-06-30 1982-01-26 Nec Home Electronics Ltd Substrate for semiconductor device
JPS60134616A (ja) * 1983-12-23 1985-07-17 Toshiba Corp ダイヤフラム型圧電共振子

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123078A (en) * 1974-08-20 1976-02-24 Matsushita Electronics Corp Handotaisoshino denkyokukozo

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4477826A (en) * 1979-07-04 1984-10-16 Westinghouse Brake & Signal Co. Ltd. Arrangement for aligning and attaching a shim to a semiconductor element
US4642672A (en) * 1982-09-14 1987-02-10 Nec Corporation Semiconductor device having registration mark for electron beam exposure
DE19632116A1 (de) * 1996-08-08 1998-02-12 Siemens Ag Chiperkennungsvorrichtung

Also Published As

Publication number Publication date
JPS5138969A (enrdf_load_stackoverflow) 1976-03-31

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