DE2535375A1 - Loetflussmittel - Google Patents
LoetflussmittelInfo
- Publication number
- DE2535375A1 DE2535375A1 DE19752535375 DE2535375A DE2535375A1 DE 2535375 A1 DE2535375 A1 DE 2535375A1 DE 19752535375 DE19752535375 DE 19752535375 DE 2535375 A DE2535375 A DE 2535375A DE 2535375 A1 DE2535375 A1 DE 2535375A1
- Authority
- DE
- Germany
- Prior art keywords
- soldering flux
- flux according
- acid
- flux
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000004907 flux Effects 0.000 title claims description 43
- 238000005476 soldering Methods 0.000 title claims description 29
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 20
- 239000013522 chelant Substances 0.000 claims description 14
- 150000003839 salts Chemical class 0.000 claims description 14
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 10
- 235000011187 glycerol Nutrition 0.000 claims description 9
- 150000007522 mineralic acids Chemical class 0.000 claims description 9
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 4
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 claims description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- 229910017604 nitric acid Inorganic materials 0.000 claims description 3
- LQPLDXQVILYOOL-UHFFFAOYSA-I pentasodium;2-[bis[2-[bis(carboxylatomethyl)amino]ethyl]amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC(=O)[O-])CCN(CC([O-])=O)CC([O-])=O LQPLDXQVILYOOL-UHFFFAOYSA-I 0.000 claims description 3
- 229940071106 ethylenediaminetetraacetate Drugs 0.000 claims description 2
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 claims description 2
- 150000007524 organic acids Chemical class 0.000 claims 3
- 235000015250 liver sausages Nutrition 0.000 claims 1
- SOBHUZYZLFQYFK-UHFFFAOYSA-K trisodium;hydroxy-[[phosphonatomethyl(phosphonomethyl)amino]methyl]phosphinate Chemical compound [Na+].[Na+].[Na+].OP(O)(=O)CN(CP(O)([O-])=O)CP([O-])([O-])=O SOBHUZYZLFQYFK-UHFFFAOYSA-K 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 17
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000009972 noncorrosive effect Effects 0.000 description 3
- MJOQJPYNENPSSS-XQHKEYJVSA-N [(3r,4s,5r,6s)-4,5,6-triacetyloxyoxan-3-yl] acetate Chemical compound CC(=O)O[C@@H]1CO[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O MJOQJPYNENPSSS-XQHKEYJVSA-N 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000003517 fume Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- QZKRHPLGUJDVAR-UHFFFAOYSA-K EDTA trisodium salt Chemical compound [Na+].[Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O QZKRHPLGUJDVAR-UHFFFAOYSA-K 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- WBGNVADHURSIJJ-UHFFFAOYSA-N [In].[Pb].[Sn] Chemical compound [In].[Pb].[Sn] WBGNVADHURSIJJ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/527,972 US4000016A (en) | 1974-11-29 | 1974-11-29 | Water soluble fluxes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2535375A1 true DE2535375A1 (de) | 1976-08-12 |
Family
ID=24103732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19752535375 Withdrawn DE2535375A1 (de) | 1974-11-29 | 1975-08-08 | Loetflussmittel |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4000016A (enExample) |
| JP (1) | JPS5165055A (enExample) |
| DE (1) | DE2535375A1 (enExample) |
| FR (1) | FR2292757A1 (enExample) |
| GB (1) | GB1476264A (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4568395A (en) * | 1985-05-10 | 1986-02-04 | Nabhani Abdol R | Precleaner system and soldering flux |
| US4632295A (en) * | 1985-08-12 | 1986-12-30 | International Business Machines Corporation | Reduction atmosphere workpiece joining |
| US5127968A (en) * | 1989-08-16 | 1992-07-07 | Yuho Chemicals Inc. | Additive for fluxes and soldering pastes |
| US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
| US5853622A (en) * | 1990-02-09 | 1998-12-29 | Ormet Corporation | Transient liquid phase sintering conductive adhesives |
| US5297721A (en) * | 1992-11-19 | 1994-03-29 | Fry's Metals, Inc. | No-clean soldering flux and method using the same |
| US5571340A (en) * | 1994-09-09 | 1996-11-05 | Fry's Metals, Inc. | Rosin-free, low VOC, no-clean soldering flux and method using the same |
| US7740713B2 (en) | 2004-04-28 | 2010-06-22 | International Business Machines Corporation | Flux composition and techniques for use thereof |
| TW200920877A (en) * | 2007-11-05 | 2009-05-16 | Magtech Technology Co Ltd | Method for soldering magnesium alloy workpieces |
| US7956114B2 (en) * | 2009-03-09 | 2011-06-07 | Raytheon Company | Water immiscible rosin mildly activated flux |
| US8887981B2 (en) | 2013-03-15 | 2014-11-18 | Raytheon Company | Temporary adhesive for component bonding |
| CN114932335B (zh) * | 2022-05-13 | 2024-03-26 | 深圳市荣昌科技有限公司 | 一种大功率led封装用水溶性固晶锡膏及其制备方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2493372A (en) * | 1946-11-08 | 1950-01-03 | Harold R Williams | Brazing flux composition |
| US3832242A (en) * | 1970-07-23 | 1974-08-27 | Scm Corp | Brazing and solder compositions comprising a chelating agent |
| BE786932A (fr) * | 1971-07-28 | 1973-01-29 | Int Nickel Ltd | Fondants de soudage |
| US3796610A (en) * | 1972-09-28 | 1974-03-12 | Ibm | Glycerol soldering fluxes |
-
1974
- 1974-11-29 US US05/527,972 patent/US4000016A/en not_active Expired - Lifetime
-
1975
- 1975-07-03 GB GB2797475A patent/GB1476264A/en not_active Expired
- 1975-08-08 DE DE19752535375 patent/DE2535375A1/de not_active Withdrawn
- 1975-09-26 JP JP50115718A patent/JPS5165055A/ja active Pending
- 1975-10-06 FR FR7531450A patent/FR2292757A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| GB1476264A (en) | 1977-06-10 |
| JPS5165055A (enExample) | 1976-06-05 |
| FR2292757B1 (enExample) | 1978-04-07 |
| US4000016A (en) | 1976-12-28 |
| FR2292757A1 (fr) | 1976-06-25 |
| USB527972I5 (enExample) | 1976-03-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE3390209C2 (enExample) | ||
| DE1558886C3 (de) | Lotmittel | |
| DE2536404C2 (de) | Verfahren zur Entplattierung von Zinn oder Zinn-Blei-Legierungen von Kupfersubstraten und wässerige saure Lösung zur Durchführung des Verfahrens | |
| DE69213840T2 (de) | Bad zur stromlosen Beschichtung mit einer Zinn-Blei-Legierung | |
| DE2535375A1 (de) | Loetflussmittel | |
| DE2152143A1 (de) | Loetflussmittel | |
| DE10039684A1 (de) | Ätzlösung für Nickel oder Nickellegierungen | |
| DE69114930T2 (de) | Weichlotflussmittel und Verfahren zu ihrer Verwendung beim Herstellen und Aufsetzen von gedruckten Schaltungsplatten. | |
| DE2236925A1 (de) | Flussmittel zum loeten | |
| DE69925107T2 (de) | Bleifreies lötpulver und herstellungsverfahren dafür | |
| DE2137329C3 (de) | Lotflußmittel | |
| DE1943519A1 (de) | Halbleiterbauelement | |
| DE2344493A1 (de) | Loetflussmittel | |
| DE1752137C3 (de) | Verfahren zum Löten von mikrominiaturisierten Schaltkreisen und Flußmittel zur Durchführung des Verfahrens | |
| DE69118548T2 (de) | Verfahren zur leiterplattenreinigung mittels wasser | |
| EP1082471A1 (de) | Verfahren zum überziehen von oberflächen auf kupfer oder einer kupferlegierung mit einer zinn- oder zinnlegierungsschicht | |
| DE2239581C3 (de) | Lösung und Verfahren zum Aufbringen von Überzügen auf Zink oder Zinklegierungen | |
| DE102008033348A1 (de) | Oberflächenbehandlungsmittel | |
| DE69125841T2 (de) | Lötflussmittel, enthaltend durch licht erzeugte oxidentferner | |
| DE2116012A1 (de) | Verfahren zur Oberflachenbehand lung von Metallen, die zu loten sind | |
| DE102005041533B3 (de) | Lösung und Verfahren zum Entfernen von ionischen Verunreinigungen von einem Werkstück | |
| DE2048738A1 (de) | Verzinnungsverfahren fur Lotstellen elektrischer Bauelemente | |
| DE102004014680B3 (de) | Entmetallisierungslösung und deren Verwendung | |
| DD148193A1 (de) | Verfahren zur herstellung korrosionsverhindernder ueberzuege mit flussmitteleigenschaften | |
| DE2042386A1 (de) | Verfahren zum Reinigen von Metallflächen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8139 | Disposal/non-payment of the annual fee |