DE2532670C2 - - Google Patents

Info

Publication number
DE2532670C2
DE2532670C2 DE2532670A DE2532670A DE2532670C2 DE 2532670 C2 DE2532670 C2 DE 2532670C2 DE 2532670 A DE2532670 A DE 2532670A DE 2532670 A DE2532670 A DE 2532670A DE 2532670 C2 DE2532670 C2 DE 2532670C2
Authority
DE
Germany
Prior art keywords
conductor
carrier
power amplifier
amplifier according
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2532670A
Other languages
German (de)
English (en)
Other versions
DE2532670A1 (de
Inventor
William James Tamarac Fla. Us Knutson
Daniel Martin Coral Springs Fla. Us Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of DE2532670A1 publication Critical patent/DE2532670A1/de
Application granted granted Critical
Publication of DE2532670C2 publication Critical patent/DE2532670C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
    • H03F3/24—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
    • H03F3/245—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages with semiconductor devices only
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/171—Tuning, e.g. by trimming of printed components or high frequency circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Amplifiers (AREA)
  • Microwave Amplifiers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
DE19752532670 1974-08-05 1975-07-22 Leistungsverstaerker, aufgebaut als hybride mikroelektronik-einheit Granted DE2532670A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/492,306 US4001711A (en) 1974-08-05 1974-08-05 Radio frequency power amplifier constructed as hybrid microelectronic unit

Publications (2)

Publication Number Publication Date
DE2532670A1 DE2532670A1 (de) 1976-02-19
DE2532670C2 true DE2532670C2 (US20020095090A1-20020718-M00002.png) 1987-12-17

Family

ID=23955766

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19752532670 Granted DE2532670A1 (de) 1974-08-05 1975-07-22 Leistungsverstaerker, aufgebaut als hybride mikroelektronik-einheit

Country Status (9)

Country Link
US (1) US4001711A (US20020095090A1-20020718-M00002.png)
JP (1) JPS5136060A (US20020095090A1-20020718-M00002.png)
CA (1) CA1032657A (US20020095090A1-20020718-M00002.png)
DE (1) DE2532670A1 (US20020095090A1-20020718-M00002.png)
DK (1) DK352475A (US20020095090A1-20020718-M00002.png)
FR (1) FR2281672A1 (US20020095090A1-20020718-M00002.png)
GB (1) GB1463925A (US20020095090A1-20020718-M00002.png)
NL (1) NL7508266A (US20020095090A1-20020718-M00002.png)
SE (1) SE400015B (US20020095090A1-20020718-M00002.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4234022A1 (de) * 1992-10-09 1994-04-14 Telefunken Microelectron Schichtschaltung mit mindestens einem Leistungswiderstand

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5233453A (en) * 1975-09-10 1977-03-14 Nec Corp High frequency high output transistor amplifier
JPS52141621A (en) * 1977-06-06 1977-11-26 Nippon Gakki Seizo Kk Automatic rhythm playing device
JPS54163361A (en) * 1978-06-15 1979-12-25 Nippon Electric Co High frequency integrated circuit apparatus
JPS5546791A (en) * 1978-09-28 1980-04-02 Roland Kk Automatic rhythum generation system for electronic musical instrument
US4318054A (en) * 1979-02-07 1982-03-02 Nippon Gakki Seizo Kabushiki Kaisha Input circuit of audio amplifier
US4389080A (en) * 1981-07-15 1983-06-21 General Electric Plug-in ceramic hybrid module
DE3316314A1 (de) * 1982-05-15 1983-11-17 AMP Inc., 17105 Harrisburg, Pa. Elektrischer verbinder
US4523155A (en) * 1983-05-04 1985-06-11 Motorola, Inc. Temperature compensated automatic output control circuitry for RF signal power amplifiers with wide dynamic range
US4716391A (en) * 1986-07-25 1987-12-29 Motorola, Inc. Multiple resonator component-mountable filter
US4954796A (en) * 1986-07-25 1990-09-04 Motorola, Inc. Multiple resonator dielectric filter
JPH02130008A (ja) * 1988-11-09 1990-05-18 Toshiba Corp 高周波電力増幅回路
US4965526A (en) * 1989-07-14 1990-10-23 Motorola Inc. Hybrid amplifier
US5170321A (en) * 1990-12-24 1992-12-08 Motorola, Inc. Enclosure system for environmental isolation of RF circuitry
EP0499116A1 (de) * 1991-02-11 1992-08-19 Industrielabor für Hochenergie-Elektronik Winfried P. Rütt-Hübner KG Kompaktes RF-Leistungsgenerator-System
US5367434A (en) * 1993-05-06 1994-11-22 Motorola, Inc. Electrical module assembly
JPH07211856A (ja) * 1994-01-12 1995-08-11 Fujitsu Ltd 集積回路モジュール
US5535438A (en) * 1994-05-10 1996-07-09 Panasonic Technologies, Inc. Phase linear class E amplifier for a satellite communication terminal which communicates with a low earth orbiting satellite
FI971850A (fi) 1997-04-30 1998-10-31 Nokia Telecommunications Oy Järjestely radiotaajuisten signaalien keskeishäiriöiden vähentämiseksi
RU2133523C1 (ru) * 1997-11-03 1999-07-20 Закрытое акционерное общество "Техно-ТМ" Трехмерный электронный модуль
JP2001292028A (ja) * 2000-04-05 2001-10-19 Murata Mfg Co Ltd 電圧制御発振器の調整方法
TW483233B (en) * 2000-05-30 2002-04-11 Alps Electric Co Ltd Electronic circuit unit
TW535352B (en) * 2000-05-30 2003-06-01 Alps Electric Co Ltd Surface-mounting type electronic circuit unit
DE60321045D1 (de) * 2002-12-20 2008-06-26 California Inst Of Techn Rauscharmer verstärker mit gemeinsamem gate mit resistiver durchspeisung
US6933443B2 (en) * 2004-01-28 2005-08-23 Infineon Technologies North America Corp. Method for bonding ceramic to copper, without creating a bow in the copper
US8884714B2 (en) * 2005-12-22 2014-11-11 Pine Valley Investments, Inc. Apparatus, system, and method for digital base modulation of power amplifier in polar transmitter
CN201956484U (zh) * 2010-11-22 2011-08-31 中兴通讯股份有限公司 一种射频传输的导电装置
US10212804B2 (en) 2017-01-16 2019-02-19 Harris Global Communications, Inc. Electronic device with laterally extending thermally conductive body and related methods
RU2701486C1 (ru) * 2018-12-25 2019-09-26 Открытое акционерное общество "Научно-производственное объединение Ангстрем" Устройство усилителя мощности со встроенным в корпус блоком питания
RU2694141C1 (ru) * 2018-12-29 2019-07-09 Открытое акционерное общество "Научно-производственное объединение Ангстрем" Устройство линейного усилителя мощности дкмв диапазона
DE102019117473A1 (de) * 2019-06-28 2020-12-31 Tesat-Spacecom Gmbh & Co. Kg Schaltungsanordnung bestehend aus zwei miteinander verbundenen Hochfrequenzkomponenten
CN114980633B (zh) * 2022-08-02 2022-10-21 成都汉芯国科集成技术有限公司 一种前侧热提取结构的功率放大器装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3258606A (en) * 1962-10-16 1966-06-28 Integrated circuits using thermal effects
US3502997A (en) * 1965-10-24 1970-03-24 Motorola Inc Integrated semiconductor cascode amplifier
DE6608942U (de) * 1967-08-19 1971-12-23 Sanyo Electric Co Integrierte hybridschaltung.
SE328352B (US20020095090A1-20020718-M00002.png) * 1967-09-11 1970-09-14 Ericsson Telefon Ab L M
AT280348B (de) * 1968-07-30 1970-04-10 H C Hans Dipl Ing Dr Dr List Integrierter Feld-Effekt-Kettenverstärker
US3506877A (en) * 1968-09-25 1970-04-14 Us Navy Hermetically sealed and shielded circuit module
BE760031A (fr) * 1969-12-11 1971-05-17 Rca Corp Boitier pour module de puissance hybride a semiconducteurs
US3694699A (en) * 1970-03-30 1972-09-26 Nat Beryllia Corp Ceramic based substrates for electronic circuits with improved heat dissipating properties and circuits including the same
DE2258557C3 (de) * 1972-11-30 1975-06-05 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Lösbare elektrische Verbindung zwischen dem Massebelag eines Mikrowellenbausteins und dem diesen umschließenden metallischen Gehäuse
US3845403A (en) * 1972-12-27 1974-10-29 Rca Corp Amplifier for amplitude modulated waves with means for improving sideband response

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4234022A1 (de) * 1992-10-09 1994-04-14 Telefunken Microelectron Schichtschaltung mit mindestens einem Leistungswiderstand

Also Published As

Publication number Publication date
US4001711A (en) 1977-01-04
CA1032657A (en) 1978-06-06
DK352475A (da) 1976-02-06
FR2281672A1 (fr) 1976-03-05
FR2281672B1 (US20020095090A1-20020718-M00002.png) 1981-08-07
SE400015B (sv) 1978-03-06
GB1463925A (en) 1977-02-09
SE7507701L (sv) 1976-02-06
NL7508266A (nl) 1976-02-09
DE2532670A1 (de) 1976-02-19
JPS5136060A (US20020095090A1-20020718-M00002.png) 1976-03-26

Similar Documents

Publication Publication Date Title
DE2532670C2 (US20020095090A1-20020718-M00002.png)
DE69211821T2 (de) Innere Leiterstruktur einer Halbleiteranordnung
DE2603575C2 (de) Einsteckmodul für eine elektronische Einrichtung
DE3724703A1 (de) Entkopplungskondensator fuer schaltkreisbausteine mit rasterfoermigen kontaktstiftanordnungen und daraus bestehende entkopplungsanordnungen
DE102008050452B4 (de) Kontaktierungsanordnung für einen Kondensator, Leistungsmodul und Verfahren zum Herstellen eines Leistungsmoduls
DE19944980A1 (de) Ummantelte elektrische Verbindung für eine Anschlußstruktur
DE2352357A1 (de) Halbleitergehaeuse
DE3783217T2 (de) Uebertragungskabelverbinder mit einer profilierten huelse.
DE2800304A1 (de) Halbleiter-baugruppe
DE2915240A1 (de) Gedruckte schaltung
DE1956679A1 (de) Vorrichtung zum Einbau eines Transistors in eine Mikrowellen-Stripline-Schaltung
DE2932369A1 (de) Montage- und verbindungseinheit mit zuleitungen fuer elektronische schaltkreise
DE3323472A1 (de) Entkopplungsanordnung fuer eine auf einer leiterplatte angeordnete integrierte schaltung
DE2943861C2 (de) Hochfrequenzgerät
DE3687208T2 (de) Montage eines hybriden schaltkreises auf einer leiterplatte.
DE1914442C3 (de) Halbleiteranordnung
DE1564867C3 (de) Verfahren zum Kontaktieren von Dioden, Planartransistoren und integrierten Schaltungen
EP0376100A2 (de) Verfahren und Leiterplatte zum Montieren eines Halbleiter-Bauelements
DE3525012A1 (de) Busleiste fuer die oberflaechenmontage
DE2758826A1 (de) Logikkarte zur verbindung integrierter schaltkreisbausteine
DE19857062A1 (de) Dielektrisches Filter und Herstellungsverfahren
EP0124712A1 (de) Plattenhalterung, insbesondere für RF-Leiterplatten, sowie ein Verfahren zu deren Herstellung
EP2520019B1 (de) Verstärkerbaustein mit einem kompensationselement
DE4021872C2 (de) Hochintegriertes elektronisches Bauteil
EP0915515A2 (de) Anordnung zum Übertragen von elektrischen Signalen zwischen einem auf einer Trägerplatte thermisch isoliertem Modul und angrenzenden Nachbarmodulen

Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee