DE2509100A1 - Verfahren zum herstellen einer halbleiteranordnung - Google Patents
Verfahren zum herstellen einer halbleiteranordnungInfo
- Publication number
- DE2509100A1 DE2509100A1 DE19752509100 DE2509100A DE2509100A1 DE 2509100 A1 DE2509100 A1 DE 2509100A1 DE 19752509100 DE19752509100 DE 19752509100 DE 2509100 A DE2509100 A DE 2509100A DE 2509100 A1 DE2509100 A1 DE 2509100A1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor body
- carrier element
- layer
- semiconductor
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10P95/00—
-
- H10W72/073—
-
- H10W72/07336—
-
- H10W72/07533—
-
- H10W72/352—
-
- H10W72/952—
-
- H10W90/736—
Landscapes
- Die Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB968974A GB1457806A (en) | 1974-03-04 | 1974-03-04 | Semiconductor device manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2509100A1 true DE2509100A1 (de) | 1975-09-11 |
Family
ID=9876868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19752509100 Pending DE2509100A1 (de) | 1974-03-04 | 1975-03-03 | Verfahren zum herstellen einer halbleiteranordnung |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4023725A (enExample) |
| JP (1) | JPS50126173A (enExample) |
| DE (1) | DE2509100A1 (enExample) |
| FR (1) | FR2263604B1 (enExample) |
| GB (1) | GB1457806A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3499553A1 (de) * | 2017-12-13 | 2019-06-19 | Heraeus Deutschland GmbH & Co. KG | Verfahren zur herstellung eines mit einer lotvorform verbundenen bauelements mittels heisspressens unterhalb der schmelztemperatur des lotmaterials |
Families Citing this family (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4293587A (en) * | 1978-11-09 | 1981-10-06 | Zilog, Inc. | Low resistance backside preparation for semiconductor integrated circuit chips |
| WO1980001967A1 (en) * | 1979-03-08 | 1980-09-18 | Gen Electric | Thermo-compression bonding a semiconductor to strain buffer |
| EP0067993A1 (en) * | 1980-12-30 | 1983-01-05 | Mostek Corporation | Die attachment exhibiting enhanced quality and reliability |
| US4546409A (en) * | 1982-04-02 | 1985-10-08 | Mitsubishi Denki Kabushiki Kaisha | Device for cooling semiconductor elements |
| US4513905A (en) * | 1983-07-29 | 1985-04-30 | The Perkin-Elmer Corporation | Integrated circuit metallization technique |
| IT1213144B (it) * | 1984-02-23 | 1989-12-14 | Ates Componenti Elettron | Processo per la saldatura di piastrine di materiale semiconduttore ad un supporto metallico nell'assemblaggio automatico di dispositivi a semiconduttore. |
| GB2156153B (en) * | 1984-03-21 | 1988-02-24 | Pitney Bowes Inc | Alignment process for semiconductor chips |
| FR2610765B1 (fr) * | 1987-02-11 | 1989-02-17 | Alcatel Thomson Faisceaux | Filtre hyperfrequence accordable |
| NL8801439A (nl) * | 1988-06-06 | 1990-01-02 | Philips Nv | Werkwijze voor het verbinden van een metaaloxide met een metaal. |
| US5048744A (en) * | 1988-12-23 | 1991-09-17 | International Business Machines Corporation | Palladium enhanced fluxless soldering and bonding of semiconductor device contacts |
| US5225711A (en) * | 1988-12-23 | 1993-07-06 | International Business Machines Corporation | Palladium enhanced soldering and bonding of semiconductor device contacts |
| US4996116A (en) * | 1989-12-21 | 1991-02-26 | General Electric Company | Enhanced direct bond structure |
| JPH03208355A (ja) * | 1990-01-10 | 1991-09-11 | Mitsubishi Electric Corp | 半導体装置及びその製造方法 |
| US5023697A (en) * | 1990-01-10 | 1991-06-11 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device with copper wire ball bonding |
| US5027997A (en) * | 1990-04-05 | 1991-07-02 | Hughes Aircraft Company | Silicon chip metallization system |
| US5198695A (en) * | 1990-12-10 | 1993-03-30 | Westinghouse Electric Corp. | Semiconductor wafer with circuits bonded to a substrate |
| DE4107660C2 (de) * | 1991-03-09 | 1995-05-04 | Bosch Gmbh Robert | Verfahren zur Montage von Silizium-Plättchen auf metallischen Montageflächen |
| ATE393319T1 (de) | 1998-09-03 | 2008-05-15 | Ge Novasensor Inc | Proportionale, mikromechanische vorrichtung |
| US6523560B1 (en) | 1998-09-03 | 2003-02-25 | General Electric Corporation | Microvalve with pressure equalization |
| US7011378B2 (en) | 1998-09-03 | 2006-03-14 | Ge Novasensor, Inc. | Proportional micromechanical valve |
| US6845962B1 (en) * | 2000-03-22 | 2005-01-25 | Kelsey-Hayes Company | Thermally actuated microvalve device |
| US6505811B1 (en) | 2000-06-27 | 2003-01-14 | Kelsey-Hayes Company | High-pressure fluid control valve assembly having a microvalve device attached to fluid distributing substrate |
| JP2003209144A (ja) * | 2002-01-16 | 2003-07-25 | Seiko Epson Corp | 半導体装置及びその製造方法、半導体装置の製造装置並びに電子機器 |
| US8011388B2 (en) * | 2003-11-24 | 2011-09-06 | Microstaq, INC | Thermally actuated microvalve with multiple fluid ports |
| US20070251586A1 (en) * | 2003-11-24 | 2007-11-01 | Fuller Edward N | Electro-pneumatic control valve with microvalve pilot |
| CA2546585A1 (en) * | 2003-11-24 | 2005-06-09 | Alumina Micro Llc | Microvalve device suitable for controlling a variable displacement compressor |
| US20080042084A1 (en) * | 2004-02-27 | 2008-02-21 | Edward Nelson Fuller | Hybrid Micro/Macro Plate Valve |
| CN1942222B (zh) * | 2004-03-05 | 2011-08-31 | 麦克罗斯塔克公司 | 用于形成微阀的选择性接合 |
| US7156365B2 (en) * | 2004-07-27 | 2007-01-02 | Kelsey-Hayes Company | Method of controlling microvalve actuator |
| US20060038302A1 (en) * | 2004-08-19 | 2006-02-23 | Kejun Zeng | Thermal fatigue resistant tin-lead-silver solder |
| US20090123300A1 (en) * | 2005-01-14 | 2009-05-14 | Alumina Micro Llc | System and method for controlling a variable displacement compressor |
| CN101617155B (zh) | 2006-12-15 | 2012-03-21 | 麦克罗斯塔克公司 | 微阀装置 |
| DE112008000862T5 (de) | 2007-03-30 | 2010-03-11 | Microstaq, Inc., Austin | Vorgesteuertes Mikroschieberventil |
| US8387659B2 (en) | 2007-03-31 | 2013-03-05 | Dunan Microstaq, Inc. | Pilot operated spool valve |
| JP2011530683A (ja) * | 2008-08-09 | 2011-12-22 | マイクラスタック、インク | 改良型のマイクロバルブ・デバイス |
| US8113482B2 (en) * | 2008-08-12 | 2012-02-14 | DunAn Microstaq | Microvalve device with improved fluid routing |
| WO2010065804A2 (en) | 2008-12-06 | 2010-06-10 | Microstaq, Inc. | Fluid flow control assembly |
| WO2010117874A2 (en) | 2009-04-05 | 2010-10-14 | Microstaq, Inc. | Method and structure for optimizing heat exchanger performance |
| US20120145252A1 (en) | 2009-08-17 | 2012-06-14 | Dunan Microstaq, Inc. | Micromachined Device and Control Method |
| CN102812538B (zh) | 2010-01-28 | 2015-05-13 | 盾安美斯泰克股份有限公司 | 用以促进接合的重调节半导体表面的方法 |
| WO2011094300A2 (en) | 2010-01-28 | 2011-08-04 | Microstaq, Inc. | Process and structure for high temperature selective fusion bonding |
| US8996141B1 (en) | 2010-08-26 | 2015-03-31 | Dunan Microstaq, Inc. | Adaptive predictive functional controller |
| US8925793B2 (en) | 2012-01-05 | 2015-01-06 | Dunan Microstaq, Inc. | Method for making a solder joint |
| US9140613B2 (en) | 2012-03-16 | 2015-09-22 | Zhejiang Dunan Hetian Metal Co., Ltd. | Superheat sensor |
| US9188375B2 (en) | 2013-12-04 | 2015-11-17 | Zhejiang Dunan Hetian Metal Co., Ltd. | Control element and check valve assembly |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3339267A (en) * | 1962-12-26 | 1967-09-05 | Philips Corp | Metallizing non-metals |
-
1974
- 1974-03-04 GB GB968974A patent/GB1457806A/en not_active Expired
-
1975
- 1975-03-03 DE DE19752509100 patent/DE2509100A1/de active Pending
- 1975-03-03 US US05/554,969 patent/US4023725A/en not_active Expired - Lifetime
- 1975-03-04 FR FR7506822A patent/FR2263604B1/fr not_active Expired
- 1975-03-04 JP JP50026434A patent/JPS50126173A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3499553A1 (de) * | 2017-12-13 | 2019-06-19 | Heraeus Deutschland GmbH & Co. KG | Verfahren zur herstellung eines mit einer lotvorform verbundenen bauelements mittels heisspressens unterhalb der schmelztemperatur des lotmaterials |
| WO2019115077A1 (de) * | 2017-12-13 | 2019-06-20 | Heraeus Deutschland GmbH & Co. KG | Verfahren zur herstellung eines mit einer lotvorform verbundenen bauelements |
Also Published As
| Publication number | Publication date |
|---|---|
| US4023725A (en) | 1977-05-17 |
| JPS50126173A (enExample) | 1975-10-03 |
| GB1457806A (en) | 1976-12-08 |
| FR2263604B1 (enExample) | 1978-08-18 |
| FR2263604A1 (enExample) | 1975-10-03 |
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