|
US4293587A
(en)
*
|
1978-11-09 |
1981-10-06 |
Zilog, Inc. |
Low resistance backside preparation for semiconductor integrated circuit chips
|
|
WO1980001967A1
(en)
*
|
1979-03-08 |
1980-09-18 |
Gen Electric |
Thermo-compression bonding a semiconductor to strain buffer
|
|
EP0067993A1
(en)
*
|
1980-12-30 |
1983-01-05 |
Mostek Corporation |
Die attachment exhibiting enhanced quality and reliability
|
|
US4546409A
(en)
*
|
1982-04-02 |
1985-10-08 |
Mitsubishi Denki Kabushiki Kaisha |
Device for cooling semiconductor elements
|
|
US4513905A
(en)
*
|
1983-07-29 |
1985-04-30 |
The Perkin-Elmer Corporation |
Integrated circuit metallization technique
|
|
IT1213144B
(it)
*
|
1984-02-23 |
1989-12-14 |
Ates Componenti Elettron |
Processo per la saldatura di piastrine di materiale semiconduttore ad un supporto metallico nell'assemblaggio automatico di dispositivi a semiconduttore.
|
|
GB2156153B
(en)
*
|
1984-03-21 |
1988-02-24 |
Pitney Bowes Inc |
Alignment process for semiconductor chips
|
|
FR2610765B1
(fr)
*
|
1987-02-11 |
1989-02-17 |
Alcatel Thomson Faisceaux |
Filtre hyperfrequence accordable
|
|
NL8801439A
(nl)
*
|
1988-06-06 |
1990-01-02 |
Philips Nv |
Werkwijze voor het verbinden van een metaaloxide met een metaal.
|
|
US5048744A
(en)
*
|
1988-12-23 |
1991-09-17 |
International Business Machines Corporation |
Palladium enhanced fluxless soldering and bonding of semiconductor device contacts
|
|
US5225711A
(en)
*
|
1988-12-23 |
1993-07-06 |
International Business Machines Corporation |
Palladium enhanced soldering and bonding of semiconductor device contacts
|
|
US4996116A
(en)
*
|
1989-12-21 |
1991-02-26 |
General Electric Company |
Enhanced direct bond structure
|
|
JPH03208355A
(ja)
*
|
1990-01-10 |
1991-09-11 |
Mitsubishi Electric Corp |
半導体装置及びその製造方法
|
|
US5023697A
(en)
*
|
1990-01-10 |
1991-06-11 |
Mitsubishi Denki Kabushiki Kaisha |
Semiconductor device with copper wire ball bonding
|
|
US5027997A
(en)
*
|
1990-04-05 |
1991-07-02 |
Hughes Aircraft Company |
Silicon chip metallization system
|
|
US5198695A
(en)
*
|
1990-12-10 |
1993-03-30 |
Westinghouse Electric Corp. |
Semiconductor wafer with circuits bonded to a substrate
|
|
DE4107660C2
(de)
*
|
1991-03-09 |
1995-05-04 |
Bosch Gmbh Robert |
Verfahren zur Montage von Silizium-Plättchen auf metallischen Montageflächen
|
|
ATE393319T1
(de)
|
1998-09-03 |
2008-05-15 |
Ge Novasensor Inc |
Proportionale, mikromechanische vorrichtung
|
|
US6523560B1
(en)
|
1998-09-03 |
2003-02-25 |
General Electric Corporation |
Microvalve with pressure equalization
|
|
US7011378B2
(en)
|
1998-09-03 |
2006-03-14 |
Ge Novasensor, Inc. |
Proportional micromechanical valve
|
|
US6845962B1
(en)
*
|
2000-03-22 |
2005-01-25 |
Kelsey-Hayes Company |
Thermally actuated microvalve device
|
|
US6505811B1
(en)
|
2000-06-27 |
2003-01-14 |
Kelsey-Hayes Company |
High-pressure fluid control valve assembly having a microvalve device attached to fluid distributing substrate
|
|
JP2003209144A
(ja)
*
|
2002-01-16 |
2003-07-25 |
Seiko Epson Corp |
半導体装置及びその製造方法、半導体装置の製造装置並びに電子機器
|
|
US8011388B2
(en)
*
|
2003-11-24 |
2011-09-06 |
Microstaq, INC |
Thermally actuated microvalve with multiple fluid ports
|
|
US20070251586A1
(en)
*
|
2003-11-24 |
2007-11-01 |
Fuller Edward N |
Electro-pneumatic control valve with microvalve pilot
|
|
CA2546585A1
(en)
*
|
2003-11-24 |
2005-06-09 |
Alumina Micro Llc |
Microvalve device suitable for controlling a variable displacement compressor
|
|
US20080042084A1
(en)
*
|
2004-02-27 |
2008-02-21 |
Edward Nelson Fuller |
Hybrid Micro/Macro Plate Valve
|
|
CN1942222B
(zh)
*
|
2004-03-05 |
2011-08-31 |
麦克罗斯塔克公司 |
用于形成微阀的选择性接合
|
|
US7156365B2
(en)
*
|
2004-07-27 |
2007-01-02 |
Kelsey-Hayes Company |
Method of controlling microvalve actuator
|
|
US20060038302A1
(en)
*
|
2004-08-19 |
2006-02-23 |
Kejun Zeng |
Thermal fatigue resistant tin-lead-silver solder
|
|
US20090123300A1
(en)
*
|
2005-01-14 |
2009-05-14 |
Alumina Micro Llc |
System and method for controlling a variable displacement compressor
|
|
CN101617155B
(zh)
|
2006-12-15 |
2012-03-21 |
麦克罗斯塔克公司 |
微阀装置
|
|
DE112008000862T5
(de)
|
2007-03-30 |
2010-03-11 |
Microstaq, Inc., Austin |
Vorgesteuertes Mikroschieberventil
|
|
US8387659B2
(en)
|
2007-03-31 |
2013-03-05 |
Dunan Microstaq, Inc. |
Pilot operated spool valve
|
|
JP2011530683A
(ja)
*
|
2008-08-09 |
2011-12-22 |
マイクラスタック、インク |
改良型のマイクロバルブ・デバイス
|
|
US8113482B2
(en)
*
|
2008-08-12 |
2012-02-14 |
DunAn Microstaq |
Microvalve device with improved fluid routing
|
|
WO2010065804A2
(en)
|
2008-12-06 |
2010-06-10 |
Microstaq, Inc. |
Fluid flow control assembly
|
|
WO2010117874A2
(en)
|
2009-04-05 |
2010-10-14 |
Microstaq, Inc. |
Method and structure for optimizing heat exchanger performance
|
|
US20120145252A1
(en)
|
2009-08-17 |
2012-06-14 |
Dunan Microstaq, Inc. |
Micromachined Device and Control Method
|
|
CN102812538B
(zh)
|
2010-01-28 |
2015-05-13 |
盾安美斯泰克股份有限公司 |
用以促进接合的重调节半导体表面的方法
|
|
WO2011094300A2
(en)
|
2010-01-28 |
2011-08-04 |
Microstaq, Inc. |
Process and structure for high temperature selective fusion bonding
|
|
US8996141B1
(en)
|
2010-08-26 |
2015-03-31 |
Dunan Microstaq, Inc. |
Adaptive predictive functional controller
|
|
US8925793B2
(en)
|
2012-01-05 |
2015-01-06 |
Dunan Microstaq, Inc. |
Method for making a solder joint
|
|
US9140613B2
(en)
|
2012-03-16 |
2015-09-22 |
Zhejiang Dunan Hetian Metal Co., Ltd. |
Superheat sensor
|
|
US9188375B2
(en)
|
2013-12-04 |
2015-11-17 |
Zhejiang Dunan Hetian Metal Co., Ltd. |
Control element and check valve assembly
|
|
EP3499553A1
(de)
*
|
2017-12-13 |
2019-06-19 |
Heraeus Deutschland GmbH & Co. KG |
Verfahren zur herstellung eines mit einer lotvorform verbundenen bauelements mittels heisspressens unterhalb der schmelztemperatur des lotmaterials
|