DE2457377C2 - - Google Patents
Info
- Publication number
- DE2457377C2 DE2457377C2 DE2457377A DE2457377A DE2457377C2 DE 2457377 C2 DE2457377 C2 DE 2457377C2 DE 2457377 A DE2457377 A DE 2457377A DE 2457377 A DE2457377 A DE 2457377A DE 2457377 C2 DE2457377 C2 DE 2457377C2
- Authority
- DE
- Germany
- Prior art keywords
- etching
- hydroxide
- solution
- film
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 20
- 229920001721 polyimide Polymers 0.000 claims description 20
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 claims description 11
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000004642 Polyimide Substances 0.000 claims description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 6
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 6
- 239000003125 aqueous solvent Substances 0.000 claims description 6
- 125000001453 quaternary ammonium group Chemical group 0.000 claims description 6
- 150000007530 organic bases Chemical class 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229920006254 polymer film Polymers 0.000 claims description 4
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 2
- SUAKHGWARZSWIH-UHFFFAOYSA-N N,N‐diethylformamide Chemical compound CCN(CC)C=O SUAKHGWARZSWIH-UHFFFAOYSA-N 0.000 claims description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 2
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 claims description 2
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 claims description 2
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 claims description 2
- 239000000908 ammonium hydroxide Substances 0.000 claims 3
- 239000000243 solution Substances 0.000 description 20
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 10
- 239000002585 base Substances 0.000 description 8
- 125000004432 carbon atom Chemical group C* 0.000 description 7
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 150000007514 bases Chemical class 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 235000011114 ammonium hydroxide Nutrition 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 239000003637 basic solution Substances 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000004922 lacquer Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- NTZFSQUDPLWXEM-UHFFFAOYSA-M (4-dodecylphenyl)methyl-trimethylazanium;hydroxide Chemical compound [OH-].CCCCCCCCCCCCC1=CC=C(C[N+](C)(C)C)C=C1 NTZFSQUDPLWXEM-UHFFFAOYSA-M 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- CCEPFPXUJPGUDT-UHFFFAOYSA-M benzyl-dimethyl-octadecylazanium;hydroxide Chemical compound [OH-].CCCCCCCCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 CCEPFPXUJPGUDT-UHFFFAOYSA-M 0.000 description 1
- LAUPTJWHHKNSCT-UHFFFAOYSA-M benzyl-hexadecyl-dimethylazanium;hydroxide Chemical compound [OH-].CCCCCCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 LAUPTJWHHKNSCT-UHFFFAOYSA-M 0.000 description 1
- NDKBVBUGCNGSJJ-UHFFFAOYSA-M benzyltrimethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)CC1=CC=CC=C1 NDKBVBUGCNGSJJ-UHFFFAOYSA-M 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- OJQAVLJZQFBRLC-UHFFFAOYSA-M dodecyl(triethyl)azanium;hydroxide Chemical compound [OH-].CCCCCCCCCCCC[N+](CC)(CC)CC OJQAVLJZQFBRLC-UHFFFAOYSA-M 0.000 description 1
- JVQOASIPRRGMOS-UHFFFAOYSA-M dodecyl(trimethyl)azanium;hydroxide Chemical compound [OH-].CCCCCCCCCCCC[N+](C)(C)C JVQOASIPRRGMOS-UHFFFAOYSA-M 0.000 description 1
- GGKXMVFBXVKSQJ-UHFFFAOYSA-M dodecyl(tripropyl)azanium;hydroxide Chemical compound [OH-].CCCCCCCCCCCC[N+](CCC)(CCC)CCC GGKXMVFBXVKSQJ-UHFFFAOYSA-M 0.000 description 1
- HCVLRHRURLPKPT-UHFFFAOYSA-M dodecyl-tri(propan-2-yl)azanium;hydroxide Chemical compound [OH-].CCCCCCCCCCCC[N+](C(C)C)(C(C)C)C(C)C HCVLRHRURLPKPT-UHFFFAOYSA-M 0.000 description 1
- CPTTVPWCBIGIGO-UHFFFAOYSA-M ethyl-hexadecyl-dimethylazanium;hydroxide Chemical compound [OH-].CCCCCCCCCCCCCCCC[N+](C)(C)CC CPTTVPWCBIGIGO-UHFFFAOYSA-M 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- WJLUBOLDZCQZEV-UHFFFAOYSA-M hexadecyl(trimethyl)azanium;hydroxide Chemical compound [OH-].CCCCCCCCCCCCCCCC[N+](C)(C)C WJLUBOLDZCQZEV-UHFFFAOYSA-M 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012457 nonaqueous media Substances 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- SVTZLZDZGVBQHX-UHFFFAOYSA-M triethyl(hexadecyl)azanium;hydroxide Chemical compound [OH-].CCCCCCCCCCCCCCCC[N+](CC)(CC)CC SVTZLZDZGVBQHX-UHFFFAOYSA-M 0.000 description 1
- JDACELMGHQGLSB-UHFFFAOYSA-M triethyl(octadecyl)azanium;hydroxide Chemical compound [OH-].CCCCCCCCCCCCCCCCCC[N+](CC)(CC)CC JDACELMGHQGLSB-UHFFFAOYSA-M 0.000 description 1
- FLXZVVQJJIGXRS-UHFFFAOYSA-M trimethyl(octadecyl)azanium;hydroxide Chemical compound [OH-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C FLXZVVQJJIGXRS-UHFFFAOYSA-M 0.000 description 1
- HADKRTWCOYPCPH-UHFFFAOYSA-M trimethylphenylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C1=CC=CC=C1 HADKRTWCOYPCPH-UHFFFAOYSA-M 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/02—Chemical treatment or coating of shaped articles made of macromolecular substances with solvents, e.g. swelling agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US426275A US3871930A (en) | 1973-12-19 | 1973-12-19 | Method of etching films made of polyimide based polymers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE2457377A1 DE2457377A1 (de) | 1975-07-03 |
| DE2457377C2 true DE2457377C2 (en, 2012) | 1988-01-28 |
Family
ID=23690105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19742457377 Granted DE2457377A1 (de) | 1973-12-19 | 1974-12-04 | Verfahren zum aetzen eines polymerfilms auf der basis eines polyimids |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3871930A (en, 2012) |
| JP (1) | JPS5911355B2 (en, 2012) |
| DE (1) | DE2457377A1 (en, 2012) |
| FR (1) | FR2255366B1 (en, 2012) |
| GB (1) | GB1491238A (en, 2012) |
| NL (1) | NL185017C (en, 2012) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3971661A (en) * | 1972-06-14 | 1976-07-27 | Westinghouse Electric Corporation | Formation of openings in dielectric sheet |
| US4093461A (en) * | 1975-07-18 | 1978-06-06 | Gaf Corporation | Positive working thermally stable photoresist composition, article and method of using |
| DE2541624C2 (de) * | 1975-09-18 | 1982-09-16 | Ibm Deutschland Gmbh, 7000 Stuttgart | Wässrige Ätzlösung und Verfahren zum Ätzen von Polymerfilmen oder Folien auf Polyimidbasis |
| GB1497312A (en) * | 1975-10-22 | 1978-01-05 | Int Computers Ltd | Production of printed circuit arrangements |
| US4327171A (en) * | 1976-05-28 | 1982-04-27 | Stanley Poler | Method of making an intra-ocular lens-mount element |
| US4159222A (en) * | 1977-01-11 | 1979-06-26 | Pactel Corporation | Method of manufacturing high density fine line printed circuitry |
| US4306925A (en) * | 1977-01-11 | 1981-12-22 | Pactel Corporation | Method of manufacturing high density printed circuit |
| DE2919841A1 (de) * | 1979-05-16 | 1980-11-20 | Siemens Ag | Verfahren zur phototechnischen herstellung von reliefstrukturen |
| US4276186A (en) * | 1979-06-26 | 1981-06-30 | International Business Machines Corporation | Cleaning composition and use thereof |
| JPS5896632A (ja) * | 1981-12-02 | 1983-06-08 | Sumitomo Bakelite Co Ltd | ポリイミド系樹脂のエツチング方法 |
| DE3215410A1 (de) * | 1982-04-24 | 1983-10-27 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum herstellen von oeffnungen mit hilfe einer maske in einer auf einer unterlage befindlichen schicht |
| DE3215411A1 (de) * | 1982-04-24 | 1983-10-27 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum herstellen von oeffnungen mit hilfe einer maske in einer auf einer unterlage befindlichen schicht |
| US4411735A (en) * | 1982-05-06 | 1983-10-25 | National Semiconductor Corporation | Polymeric insulation layer etching process and composition |
| DE3740369A1 (de) * | 1987-11-25 | 1989-06-08 | Schering Ag | Verfahren zur vorbehandlung von kunststoffen |
| JPH02144987A (ja) * | 1988-11-26 | 1990-06-04 | Sumitomo Metal Mining Co Ltd | プリント配線板の製造方法 |
| DE3902991A1 (de) * | 1989-01-30 | 1990-08-02 | Schering Ag | Verfahren zur haftfesten metallisierung von hochtemperaturstabilen kunststoffen |
| US5350489A (en) * | 1990-10-19 | 1994-09-27 | Purex Co., Ltd. | Treatment method of cleaning surface of plastic molded item |
| DE69128451T2 (de) * | 1990-10-19 | 1998-06-18 | Purex Co | Behandlungsmethode zur Reinigung der Oberfläche von geformten Kunststoffgegenständen |
| CH681758A5 (en) * | 1991-02-28 | 1993-05-14 | Dyconex Patente Ag C O Heinze | Plastics foil micro-sieve |
| US5227008A (en) * | 1992-01-23 | 1993-07-13 | Minnesota Mining And Manufacturing Company | Method for making flexible circuits |
| US5391397A (en) * | 1994-04-05 | 1995-02-21 | Motorola, Inc. | Method of adhesion to a polyimide surface by formation of covalent bonds |
| US5925260A (en) * | 1997-01-02 | 1999-07-20 | Micron Technology, Inc. | Removal of polyimide from dies and wafers |
| US6177357B1 (en) | 1999-04-30 | 2001-01-23 | 3M Innovative Properties Company | Method for making flexible circuits |
| US20040038451A1 (en) * | 1999-10-06 | 2004-02-26 | Hawks Douglas A. | Method suitable for forming a microelectronic device package |
| US20070120089A1 (en) * | 2005-11-28 | 2007-05-31 | 3M Innovative Properties Company | Polymer etchant and method of using same |
| CN109467700B (zh) * | 2018-10-31 | 2021-05-04 | 江苏亚宝绝缘材料股份有限公司 | 一种严格等摩尔单体结合补偿加料的树脂合成方法及聚酰胺酸树脂 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3361589A (en) * | 1964-10-05 | 1968-01-02 | Du Pont | Process for treating polyimide surface with basic compounds, and polyimide surface having thin layer of polyamide acid |
| US3736170A (en) * | 1971-06-28 | 1973-05-29 | Ibm | Process for improved adhesion of electroless copper to a polyimide surface |
| US3767490A (en) * | 1971-06-29 | 1973-10-23 | Ibm | Process for etching organic coating layers |
| US3770528A (en) * | 1971-09-29 | 1973-11-06 | Martin Processing Co Inc | Method for the surface treatment of polyimide materials |
| US3791848A (en) * | 1972-05-19 | 1974-02-12 | Western Electric Co | A method of improving the adherence of a metal deposit to a polyimide surface |
-
1973
- 1973-12-19 US US426275A patent/US3871930A/en not_active Expired - Lifetime
-
1974
- 1974-08-15 NL NLAANVRAGE7410943,A patent/NL185017C/xx not_active IP Right Cessation
- 1974-09-26 JP JP49110975A patent/JPS5911355B2/ja not_active Expired
- 1974-12-04 DE DE19742457377 patent/DE2457377A1/de active Granted
- 1974-12-04 FR FR7439708A patent/FR2255366B1/fr not_active Expired
- 1974-12-10 GB GB53345/74A patent/GB1491238A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5911355B2 (ja) | 1984-03-14 |
| GB1491238A (en) | 1977-11-09 |
| FR2255366A1 (en, 2012) | 1975-07-18 |
| FR2255366B1 (en, 2012) | 1979-07-06 |
| NL7410943A (nl) | 1975-06-23 |
| NL185017B (nl) | 1989-08-01 |
| JPS5092973A (en, 2012) | 1975-07-24 |
| NL185017C (nl) | 1990-01-02 |
| DE2457377A1 (de) | 1975-07-03 |
| US3871930A (en) | 1975-03-18 |
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