DE2436600A1 - Verfahren zur erzielung einer oberflaechenstabilisierenden schutzschicht bei halbleiterbauelementen - Google Patents

Verfahren zur erzielung einer oberflaechenstabilisierenden schutzschicht bei halbleiterbauelementen

Info

Publication number
DE2436600A1
DE2436600A1 DE2436600A DE2436600A DE2436600A1 DE 2436600 A1 DE2436600 A1 DE 2436600A1 DE 2436600 A DE2436600 A DE 2436600A DE 2436600 A DE2436600 A DE 2436600A DE 2436600 A1 DE2436600 A1 DE 2436600A1
Authority
DE
Germany
Prior art keywords
semiconductor
tablets
base
base plate
protective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE2436600A
Other languages
German (de)
English (en)
Inventor
Horst Schaefer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG filed Critical Semikron GmbH and Co KG
Priority to DE2436600A priority Critical patent/DE2436600A1/de
Priority to CH135075A priority patent/CH590557A5/xx
Priority to SE7501979A priority patent/SE397902B/xx
Priority to AR257737A priority patent/AR202062A1/es
Priority to ES435343A priority patent/ES435343A1/es
Priority to US05/556,867 priority patent/US3947303A/en
Priority to FR7508680A priority patent/FR2280977A1/fr
Priority to JP4347575A priority patent/JPS5429345B2/ja
Priority to IT22297/75A priority patent/IT1037271B/it
Priority to GB20500/75A priority patent/GB1509227A/en
Priority to BR5500/75D priority patent/BR7504290A/pt
Publication of DE2436600A1 publication Critical patent/DE2436600A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/976—Temporary protective layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE2436600A 1974-07-30 1974-07-30 Verfahren zur erzielung einer oberflaechenstabilisierenden schutzschicht bei halbleiterbauelementen Pending DE2436600A1 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
DE2436600A DE2436600A1 (de) 1974-07-30 1974-07-30 Verfahren zur erzielung einer oberflaechenstabilisierenden schutzschicht bei halbleiterbauelementen
CH135075A CH590557A5 (enExample) 1974-07-30 1975-02-04
SE7501979A SE397902B (sv) 1974-07-30 1975-02-21 Forfarande for att astadkomma ett skyddsskikt pa ytan pa halvledarkomponenter
AR257737A AR202062A1 (es) 1974-07-30 1975-02-24 Procedimiento de preparacion de una capa protectora de laca protectora estabilizadora y mejoradora de propiedades de bloqueo sobre la superficie de componentes semiconductores
ES435343A ES435343A1 (es) 1974-07-30 1975-03-06 Procedimiento para obtener una capa protectora de laca parasemiconductores.
US05/556,867 US3947303A (en) 1974-07-30 1975-03-10 Method for producing a surface stabilizing protective layer in semiconductor devices
FR7508680A FR2280977A1 (fr) 1974-07-30 1975-03-20 Procede d'obtention d'une couche de protection stabilisatrice de surface dans des composants a semi-conducteur
JP4347575A JPS5429345B2 (enExample) 1974-07-30 1975-04-11
IT22297/75A IT1037271B (it) 1974-07-30 1975-04-14 Procedimento per la formazione di uno strato protettivo stabi lizzante la superficie in componenti semiconduttori
GB20500/75A GB1509227A (en) 1974-07-30 1975-05-15 Method for the production of semiconductor devices
BR5500/75D BR7504290A (pt) 1974-07-30 1975-07-08 Processo para producao de uma camada protetora estabilizadora na superficie de elementos semicondutores

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2436600A DE2436600A1 (de) 1974-07-30 1974-07-30 Verfahren zur erzielung einer oberflaechenstabilisierenden schutzschicht bei halbleiterbauelementen

Publications (1)

Publication Number Publication Date
DE2436600A1 true DE2436600A1 (de) 1976-02-19

Family

ID=5921905

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2436600A Pending DE2436600A1 (de) 1974-07-30 1974-07-30 Verfahren zur erzielung einer oberflaechenstabilisierenden schutzschicht bei halbleiterbauelementen

Country Status (11)

Country Link
US (1) US3947303A (enExample)
JP (1) JPS5429345B2 (enExample)
AR (1) AR202062A1 (enExample)
BR (1) BR7504290A (enExample)
CH (1) CH590557A5 (enExample)
DE (1) DE2436600A1 (enExample)
ES (1) ES435343A1 (enExample)
FR (1) FR2280977A1 (enExample)
GB (1) GB1509227A (enExample)
IT (1) IT1037271B (enExample)
SE (1) SE397902B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4624724A (en) * 1985-01-17 1986-11-25 General Electric Company Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base
US4680072A (en) * 1985-04-30 1987-07-14 Wedco Inc. Method and apparatus for producing multilayered plastic containing sheets
DE10029035C1 (de) * 2000-06-13 2002-02-28 Infineon Technologies Ag Verfahren zur Bearbeitung eines Wafers
US8026565B2 (en) * 2003-01-30 2011-09-27 University Of Cape Town Thin film semiconductor device comprising nanocrystalline silicon powder
US7400037B2 (en) 2004-12-30 2008-07-15 Advanced Chip Engineering Tachnology Inc. Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3690984A (en) * 1967-10-09 1972-09-12 Western Electric Co Releasable mounting method of placing an oriented array of semiconductor devices on the mounting
US3706409A (en) * 1970-02-26 1972-12-19 Gen Electric Semiconductor lead attachment system including a semiconductor pellet orientation plate
US3766638A (en) * 1970-08-31 1973-10-23 Hugle Ind Inc Wafer spreader
US3739463A (en) * 1971-10-18 1973-06-19 Gen Electric Method for lead attachment to pellets mounted in wafer alignment
US3888053A (en) * 1973-05-29 1975-06-10 Rca Corp Method of shaping semiconductor workpiece

Also Published As

Publication number Publication date
FR2280977B1 (enExample) 1979-03-02
SE397902B (sv) 1977-11-21
JPS5117670A (enExample) 1976-02-12
GB1509227A (en) 1978-05-04
BR7504290A (pt) 1976-07-13
ES435343A1 (es) 1976-12-16
CH590557A5 (enExample) 1977-08-15
JPS5429345B2 (enExample) 1979-09-22
US3947303A (en) 1976-03-30
AR202062A1 (es) 1975-05-09
SE7501979L (sv) 1976-02-02
IT1037271B (it) 1979-11-10
FR2280977A1 (fr) 1976-02-27

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