IT1037271B - Procedimento per la formazione di uno strato protettivo stabi lizzante la superficie in componenti semiconduttori - Google Patents

Procedimento per la formazione di uno strato protettivo stabi lizzante la superficie in componenti semiconduttori

Info

Publication number
IT1037271B
IT1037271B IT22297/75A IT2229775A IT1037271B IT 1037271 B IT1037271 B IT 1037271B IT 22297/75 A IT22297/75 A IT 22297/75A IT 2229775 A IT2229775 A IT 2229775A IT 1037271 B IT1037271 B IT 1037271B
Authority
IT
Italy
Prior art keywords
procedure
formation
protective layer
semiconductor components
layer stabilizing
Prior art date
Application number
IT22297/75A
Other languages
English (en)
Original Assignee
Semikron Gleichrichterbau
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Gleichrichterbau filed Critical Semikron Gleichrichterbau
Application granted granted Critical
Publication of IT1037271B publication Critical patent/IT1037271B/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/976Temporary protective layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1089Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
IT22297/75A 1974-07-30 1975-04-14 Procedimento per la formazione di uno strato protettivo stabi lizzante la superficie in componenti semiconduttori IT1037271B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2436600A DE2436600A1 (de) 1974-07-30 1974-07-30 Verfahren zur erzielung einer oberflaechenstabilisierenden schutzschicht bei halbleiterbauelementen

Publications (1)

Publication Number Publication Date
IT1037271B true IT1037271B (it) 1979-11-10

Family

ID=5921905

Family Applications (1)

Application Number Title Priority Date Filing Date
IT22297/75A IT1037271B (it) 1974-07-30 1975-04-14 Procedimento per la formazione di uno strato protettivo stabi lizzante la superficie in componenti semiconduttori

Country Status (11)

Country Link
US (1) US3947303A (it)
JP (1) JPS5429345B2 (it)
AR (1) AR202062A1 (it)
BR (1) BR7504290A (it)
CH (1) CH590557A5 (it)
DE (1) DE2436600A1 (it)
ES (1) ES435343A1 (it)
FR (1) FR2280977A1 (it)
GB (1) GB1509227A (it)
IT (1) IT1037271B (it)
SE (1) SE397902B (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56138914A (en) * 1980-03-31 1981-10-29 Nichicon Capacitor Ltd Electrolytic condenser
US4624724A (en) * 1985-01-17 1986-11-25 General Electric Company Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base
US4680072A (en) * 1985-04-30 1987-07-14 Wedco Inc. Method and apparatus for producing multilayered plastic containing sheets
DE10029035C1 (de) * 2000-06-13 2002-02-28 Infineon Technologies Ag Verfahren zur Bearbeitung eines Wafers
WO2004068536A2 (en) * 2003-01-30 2004-08-12 University Of Cape Town A thin film semiconductor device and method of manufacturing a thin film semiconductor device
US7400037B2 (en) 2004-12-30 2008-07-15 Advanced Chip Engineering Tachnology Inc. Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3690984A (en) * 1967-10-09 1972-09-12 Western Electric Co Releasable mounting method of placing an oriented array of semiconductor devices on the mounting
US3706409A (en) * 1970-02-26 1972-12-19 Gen Electric Semiconductor lead attachment system including a semiconductor pellet orientation plate
US3766638A (en) * 1970-08-31 1973-10-23 Hugle Ind Inc Wafer spreader
US3739463A (en) * 1971-10-18 1973-06-19 Gen Electric Method for lead attachment to pellets mounted in wafer alignment
US3888053A (en) * 1973-05-29 1975-06-10 Rca Corp Method of shaping semiconductor workpiece

Also Published As

Publication number Publication date
AR202062A1 (es) 1975-05-09
SE397902B (sv) 1977-11-21
CH590557A5 (it) 1977-08-15
FR2280977A1 (fr) 1976-02-27
FR2280977B1 (it) 1979-03-02
US3947303A (en) 1976-03-30
JPS5429345B2 (it) 1979-09-22
ES435343A1 (es) 1976-12-16
BR7504290A (pt) 1976-07-13
DE2436600A1 (de) 1976-02-19
JPS5117670A (it) 1976-02-12
GB1509227A (en) 1978-05-04
SE7501979L (sv) 1976-02-02

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