DE2355471A1 - Aus mehreren ebenen bestehende packung fuer halbleiterschaltungen - Google Patents

Aus mehreren ebenen bestehende packung fuer halbleiterschaltungen

Info

Publication number
DE2355471A1
DE2355471A1 DE19732355471 DE2355471A DE2355471A1 DE 2355471 A1 DE2355471 A1 DE 2355471A1 DE 19732355471 DE19732355471 DE 19732355471 DE 2355471 A DE2355471 A DE 2355471A DE 2355471 A1 DE2355471 A1 DE 2355471A1
Authority
DE
Germany
Prior art keywords
substrate
lines
substrates
pack according
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19732355471
Other languages
German (de)
English (en)
Inventor
Philip A Tatusko
Richard A Williams
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE2355471A1 publication Critical patent/DE2355471A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE19732355471 1972-12-18 1973-11-07 Aus mehreren ebenen bestehende packung fuer halbleiterschaltungen Pending DE2355471A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31632772A 1972-12-18 1972-12-18

Publications (1)

Publication Number Publication Date
DE2355471A1 true DE2355471A1 (de) 1974-06-20

Family

ID=23228576

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19732355471 Pending DE2355471A1 (de) 1972-12-18 1973-11-07 Aus mehreren ebenen bestehende packung fuer halbleiterschaltungen

Country Status (5)

Country Link
US (1) US3777221A (enExample)
JP (1) JPS589597B2 (enExample)
DE (1) DE2355471A1 (enExample)
FR (1) FR2210823B1 (enExample)
GB (1) GB1444814A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3201296A1 (de) * 1982-01-18 1983-07-28 Institut elektrodinamiki Akademii Nauk Ukrainskoj SSR, Kiev Transistoranordnung
DE3409146A1 (de) * 1984-03-13 1985-09-19 Siemens AG, 1000 Berlin und 8000 München Optoelektronisches mudul

Families Citing this family (89)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5085752U (enExample) * 1973-12-10 1975-07-22
US3952231A (en) * 1974-09-06 1976-04-20 International Business Machines Corporation Functional package for complex electronic systems with polymer-metal laminates and thermal transposer
JPS541159B2 (enExample) * 1974-10-21 1979-01-20
JPS5333856U (enExample) * 1976-08-30 1978-03-24
US4348751A (en) * 1977-06-20 1982-09-07 Hitachi, Ltd. Electronic device and method of fabricating the same
JPS594873B2 (ja) * 1978-09-26 1984-02-01 松下電器産業株式会社 印刷配線板
US4254445A (en) * 1979-05-07 1981-03-03 International Business Machines Corporation Discretionary fly wire chip interconnection
US4283755A (en) * 1980-02-05 1981-08-11 The United States Of America As Represented By The Secretary Of The Air Force Modulator multilayer detector
GB2083285B (en) * 1980-02-12 1984-08-15 Mostek Corp Over/under dual in-line chip package
US4467400A (en) * 1981-01-16 1984-08-21 Burroughs Corporation Wafer scale integrated circuit
US4458297A (en) * 1981-01-16 1984-07-03 Mosaic Systems, Inc. Universal interconnection substrate
JPS57188708A (en) * 1981-05-14 1982-11-19 Toshiba Corp Package type power generating equipment
JPS57207356A (en) * 1981-06-15 1982-12-20 Fujitsu Ltd Semiconductor device
FR2511544A1 (fr) * 1981-08-14 1983-02-18 Dassault Electronique Module electronique pour carte de transactions automatiques et carte equipee d'un tel module
US4489364A (en) * 1981-12-31 1984-12-18 International Business Machines Corporation Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface
US4450029A (en) * 1982-01-13 1984-05-22 Elxsi Backplane fabrication method
US4549200A (en) * 1982-07-08 1985-10-22 International Business Machines Corporation Repairable multi-level overlay system for semiconductor device
US4536638A (en) * 1982-09-30 1985-08-20 Witold Krynicki Chip assembly
US4551746A (en) * 1982-10-05 1985-11-05 Mayo Foundation Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation
US4512509A (en) * 1983-02-25 1985-04-23 At&T Technologies, Inc. Technique for bonding a chip carrier to a metallized substrate
US4630172A (en) * 1983-03-09 1986-12-16 Printed Circuits International Semiconductor chip carrier package with a heat sink
US4538867A (en) * 1984-02-17 1985-09-03 Thomas & Betts Corporation Socket assembly connector for an electrical component
US4722914A (en) * 1984-05-30 1988-02-02 Motorola Inc. Method of making a high density IC module assembly
US4630096A (en) * 1984-05-30 1986-12-16 Motorola, Inc. High density IC module assembly
US4598337A (en) * 1984-09-17 1986-07-01 Timex Corporation Electronic circuit board for a timepiece
GB8507523D0 (en) * 1985-03-22 1985-05-01 Luc Technologies Ltd Bonding machine
CA1246755A (en) * 1985-03-30 1988-12-13 Akira Miyauchi Semiconductor device
US4585157A (en) * 1985-04-04 1986-04-29 General Motors Corporation Tape bonding of two integrated circuits into one tape frame
US4659931A (en) * 1985-05-08 1987-04-21 Grumman Aerospace Corporation High density multi-layered integrated circuit package
JPS61296800A (ja) * 1985-06-25 1986-12-27 日本電気株式会社 設計変更用電極
US4667404A (en) * 1985-09-30 1987-05-26 Microelectronics Center Of North Carolina Method of interconnecting wiring planes
US4764644A (en) * 1985-09-30 1988-08-16 Microelectronics Center Of North Carolina Microelectronics apparatus
JPS62136098A (ja) * 1985-12-09 1987-06-19 富士通株式会社 高密度配線基板
US4717988A (en) * 1986-05-05 1988-01-05 Itt Defense Communications Division Of Itt Corporation Universal wafer scale assembly
JPH0427183Y2 (enExample) * 1986-07-24 1992-06-30
EP0257119B1 (en) * 1986-08-22 1991-02-20 Ibm Deutschland Gmbh Integrated wiring system for vlsi
JPS63249394A (ja) * 1987-04-06 1988-10-17 日本電気株式会社 多層回路基板
US5136123A (en) * 1987-07-17 1992-08-04 Junkosha Co., Ltd. Multilayer circuit board
US5165166A (en) * 1987-09-29 1992-11-24 Microelectronics And Computer Technology Corporation Method of making a customizable circuitry
AU610249B2 (en) * 1987-09-29 1991-05-16 Microelectronics And Computer Technology Corporation Customizable circuitry
JPH01199497A (ja) * 1987-11-10 1989-08-10 Ibiden Co Ltd 電子部品塔載用基板
US4859808A (en) * 1988-06-28 1989-08-22 Delco Electronics Corporation Electrical conductor having unique solder dam configuration
US5063432A (en) * 1989-05-22 1991-11-05 Advanced Micro Devices, Inc. Integrated circuit lead assembly structure with first and second lead patterns spaced apart in parallel planes with a part of each lead in one lead pattern perpendicular to a part of each lead in the other lead pattern
JPH038352A (ja) * 1989-06-06 1991-01-16 Shinko Electric Ind Co Ltd 半導体装置
JPH0371661A (ja) * 1989-08-11 1991-03-27 Fujitsu Ltd 電子回路パッケージ及びその製造方法
US5041943A (en) * 1989-11-06 1991-08-20 Allied-Signal Inc. Hermetically sealed printed circuit board
US5861897A (en) * 1991-01-19 1999-01-19 Canon Kabushiki Kaisha Inkjet recording apparatus with a memory device disposed substantially within boundaries if a recording head unit
US5322812A (en) * 1991-03-20 1994-06-21 Crosspoint Solutions, Inc. Improved method of fabricating antifuses in an integrated circuit device and resulting structure
US5152451A (en) * 1991-04-01 1992-10-06 Motorola, Inc. Controlled solder oxidation process
KR940704114A (ko) * 1991-12-18 1994-12-12 마이클 레비스 필드 프로그래머블 게이트 어레이용 확장 구조(extended architecture for field programmable gate array)
US5483100A (en) * 1992-06-02 1996-01-09 Amkor Electronics, Inc. Integrated circuit package with via interconnections formed in a substrate
US5420759A (en) * 1992-08-10 1995-05-30 Motorola, Inc. Support assembly for card member having a memory element disposed thereupon
US5371404A (en) * 1993-02-04 1994-12-06 Motorola, Inc. Thermally conductive integrated circuit package with radio frequency shielding
KR950012290B1 (ko) * 1993-05-14 1995-10-16 삼성전자주식회사 메모리 모듈
EP0637070B1 (en) * 1993-07-28 1997-09-24 The Whitaker Corporation Perimeter independent precision locating member for a semiconductor chip and method of making said member
US5617131A (en) * 1993-10-28 1997-04-01 Kyocera Corporation Image device having a spacer with image arrays disposed in holes thereof
US5544018A (en) * 1994-04-13 1996-08-06 Microelectronics And Computer Technology Corporation Electrical interconnect device with customizeable surface layer and interwoven signal lines
US5492482A (en) * 1994-06-07 1996-02-20 Fluke Corporation Compact thermocouple connector
US5616886A (en) * 1995-06-05 1997-04-01 Motorola Wirebondless module package
US5669775A (en) * 1995-09-05 1997-09-23 International Business Machines Corporation Assembly for mounting components to flexible cables
US5898128A (en) * 1996-09-11 1999-04-27 Motorola, Inc. Electronic component
US5789807A (en) * 1996-10-15 1998-08-04 International Business Machines Corporation On-chip power distribution for improved decoupling
KR100283744B1 (ko) * 1997-08-01 2001-04-02 윤종용 집적회로실장방법
JPH1154884A (ja) * 1997-08-06 1999-02-26 Nec Corp 半導体装置の実装構造
US6184463B1 (en) 1998-04-13 2001-02-06 Harris Corporation Integrated circuit package for flip chip
US6600659B1 (en) * 2000-03-09 2003-07-29 Avaya Technology Corp. Electronic stacked assembly
US6713854B1 (en) 2000-10-16 2004-03-30 Legacy Electronics, Inc Electronic circuit module with a carrier having a mounting pad array
US7102892B2 (en) 2000-03-13 2006-09-05 Legacy Electronics, Inc. Modular integrated circuit chip carrier
JP2001267463A (ja) * 2000-03-17 2001-09-28 Nec Yamaguchi Ltd 半導体装置基板及び半導体装置の製造方法
US6529027B1 (en) 2000-03-23 2003-03-04 Micron Technology, Inc. Interposer and methods for fabricating same
US6611053B2 (en) * 2000-06-08 2003-08-26 Micron Technology, Inc. Protective structure for bond wires
US6525413B1 (en) * 2000-07-12 2003-02-25 Micron Technology, Inc. Die to die connection method and assemblies and packages including dice so connected
US7337522B2 (en) 2000-10-16 2008-03-04 Legacy Electronics, Inc. Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
CN100369536C (zh) * 2001-03-14 2008-02-13 莱格西电子股份有限公司 制造具有三维半导体芯片阵列安装面的电路板的方法和装置
US6787895B1 (en) * 2001-12-07 2004-09-07 Skyworks Solutions, Inc. Leadless chip carrier for reduced thermal resistance
US20030213619A1 (en) * 2002-05-14 2003-11-20 Denzene Quentin S. Ground discontinuity improvement in RF device matching
WO2005050708A2 (en) * 2003-11-13 2005-06-02 Silicon Pipe, Inc. Stair step printed circuit board structures for high speed signal transmissions
WO2006076381A2 (en) 2005-01-12 2006-07-20 Legacy Electronics, Inc. Radial circuit board, system, and methods
US7629694B2 (en) * 2006-08-16 2009-12-08 Blaise Laurent Mouttet Interconnections for crosswire arrays
KR20090074382A (ko) * 2008-01-02 2009-07-07 삼성전자주식회사 반도체 모듈 및 그의 제조 방법
USD730849S1 (en) * 2012-10-05 2015-06-02 Tower Mfg Corp Universal ground fault circuit interrupter (GFCI) printed circuit board package
USD725054S1 (en) * 2013-07-31 2015-03-24 Tower Manufacturing Corporation Ground fault circuit interrupter (GFCI) printed circuit board package
US9651585B2 (en) * 2013-12-18 2017-05-16 National Instruments Corporation Via layout techniques for improved low current measurements
USD785575S1 (en) 2014-05-28 2017-05-02 Sumitomo Electric Industries, Ltd. Flexible printed wiring board
USD784936S1 (en) 2014-05-28 2017-04-25 Sumitomo Electric Industries, Ltd. Flexible printed wiring board with device
JP1529446S (enExample) * 2014-10-16 2015-07-21
US10393893B2 (en) * 2014-12-12 2019-08-27 Lingacom Ltd. Method and apparatus for high atomic number substance detection
US11125904B2 (en) 2014-12-12 2021-09-21 Lingacom Ltd. Large scale gas electron multiplier with sealable opening
CN107770956A (zh) * 2016-08-16 2018-03-06 光宝电子(广州)有限公司 电路板结构

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3372310A (en) * 1965-04-30 1968-03-05 Radiation Inc Universal modular packages for integrated circuits
US3365620A (en) * 1966-06-13 1968-01-23 Ibm Circuit package with improved modular assembly and cooling apparatus
US3683105A (en) * 1970-10-13 1972-08-08 Westinghouse Electric Corp Microcircuit modular package
US3704455A (en) * 1971-02-01 1972-11-28 Alfred D Scarbrough 3d-coaxial memory construction and method of making
JPS5151000Y2 (enExample) * 1971-03-27 1976-12-07

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3201296A1 (de) * 1982-01-18 1983-07-28 Institut elektrodinamiki Akademii Nauk Ukrainskoj SSR, Kiev Transistoranordnung
DE3409146A1 (de) * 1984-03-13 1985-09-19 Siemens AG, 1000 Berlin und 8000 München Optoelektronisches mudul

Also Published As

Publication number Publication date
JPS4989162A (enExample) 1974-08-26
US3777221A (en) 1973-12-04
GB1444814A (en) 1976-08-04
JPS589597B2 (ja) 1983-02-22
FR2210823B1 (enExample) 1978-01-06
FR2210823A1 (enExample) 1974-07-12

Similar Documents

Publication Publication Date Title
DE2355471A1 (de) Aus mehreren ebenen bestehende packung fuer halbleiterschaltungen
DE69434160T2 (de) Mit Lötkugeln Verbindensverfahren damit versehen
DE2810054C2 (de) Elektronische Schaltungsanordnung und Verfahren zu deren Herstellung
DE69104750T2 (de) Verfahren zur Herstellung von Mehrschichtplatinen.
DE3787366T2 (de) Keramische/organische mehrschichtenanschlussplatte.
DE3177304T2 (de) Metallschichten zur Verwendung in einem Verbindungssystem für elektronische Schaltung.
DE69007452T2 (de) Mehrlagenschaltungsstruktur.
DE68928633T2 (de) Verfahren zur Herstellung elektrischer Verbindungsteile
DE112006002516B4 (de) Chip-Widertand und Befestigungsstruktur für einen Chip-Widerstand
EP0920055B1 (de) Kühlvorrichtung für ein auf einer Leiterplatte angeordnetes, wärmeerzeugendes Bauelement
DE68913806T2 (de) Elektronische Packungsanordnung mit biegsamem Träger und Verfahren zu ihrer Herstellung.
DE69708879T2 (de) Z-achsenzwischenverbindungsverfahren und schaltung
DE69200500T2 (de) Gestufte Mehrlagenverbindungsplatte und Herstellungsmethoden.
DE2459532C2 (de) Anordnung mit mehreren, parallel angeordneten mikroelektronischen Bauelementen scheibenförmiger Gestalt und Verfahren zur Herstellung der Kontaktbereiche einer solchen Anordnung
DE3020196C2 (de) Mehrebenen-Leiterplatte und Verfahren zu deren Herstellung
DE2247902A1 (de) Gedruckte schaltungsplatte und verfahren zu deren herstellung
DE2330732A1 (de) Schaltungskarte fuer integrierte schaltungen
EP0016925B1 (de) Verfahren zum Aufbringen von Metall auf Metallmuster auf dielektrischen Substraten
DE4020498C2 (de) Verfahren zum Herstellen von Multiwire-Leiterplatten mit isolierten Metalleitern und/oder optischen Leitern
DE69936189T2 (de) Elektrischer leiter mit als flanschen und geätzte rillen geformter oberflächenstruktur
DE69704678T2 (de) Verfahren zum herstellen einer leiterplatteranordnung mit zinn/bleischicht
DE69723801T2 (de) Herstellungsverfahren einer Kontaktgitter-Halbleiterpackung
DE68906160T2 (de) Gedruckte Schaltungsplatte.
DE69426410T2 (de) Halbleitervorrichtung mit Lötstellen und Verfahren zur Herstellung
DE69105070T2 (de) Verfahren zum Herstellen eines isolierenden Substrats für Halbleiterbauelemente und eine dazu verwendete, mit einem Muster versehene, Metallplatte.

Legal Events

Date Code Title Description
OHJ Non-payment of the annual fee