DE2254436C3 - Abdeckstoff - Google Patents

Abdeckstoff

Info

Publication number
DE2254436C3
DE2254436C3 DE2254436A DE2254436A DE2254436C3 DE 2254436 C3 DE2254436 C3 DE 2254436C3 DE 2254436 A DE2254436 A DE 2254436A DE 2254436 A DE2254436 A DE 2254436A DE 2254436 C3 DE2254436 C3 DE 2254436C3
Authority
DE
Germany
Prior art keywords
weight
covering material
dye
solvent
material according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2254436A
Other languages
German (de)
English (en)
Other versions
DE2254436B2 (de
DE2254436A1 (de
Inventor
Robert Mcdowell Hall
Jimmie Joe Mumm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Indusco Chemical Products
Tektronix Inc
Original Assignee
Indusco Chemical Products
Tektronix Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Indusco Chemical Products, Tektronix Inc filed Critical Indusco Chemical Products
Publication of DE2254436A1 publication Critical patent/DE2254436A1/de
Publication of DE2254436B2 publication Critical patent/DE2254436B2/de
Application granted granted Critical
Publication of DE2254436C3 publication Critical patent/DE2254436C3/de
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/224—Anti-weld compositions; Braze stop-off compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/008—Temporary coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Detergent Compositions (AREA)
DE2254436A 1971-11-08 1972-11-07 Abdeckstoff Expired DE2254436C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19679871A 1971-11-08 1971-11-08

Publications (3)

Publication Number Publication Date
DE2254436A1 DE2254436A1 (de) 1974-01-03
DE2254436B2 DE2254436B2 (de) 1979-03-15
DE2254436C3 true DE2254436C3 (de) 1979-10-25

Family

ID=22726836

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2254436A Expired DE2254436C3 (de) 1971-11-08 1972-11-07 Abdeckstoff

Country Status (9)

Country Link
US (1) US3773704A (enExample)
JP (1) JPS511451B2 (enExample)
CA (1) CA999094A (enExample)
DE (1) DE2254436C3 (enExample)
FR (1) FR2160217A5 (enExample)
GB (1) GB1380092A (enExample)
IT (1) IT973431B (enExample)
NL (1) NL159022B (enExample)
SE (1) SE390735B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3957432A (en) * 1974-02-26 1976-05-18 Union Carbide Corporation Aqueous pituitous color compositions based on poly(ethylene oxide)
JPS52117853A (en) * 1976-03-29 1977-10-03 Ibm Detachable solder mask
US4216035A (en) * 1977-12-23 1980-08-05 International Business Machines Corporation Removable protective coating and process of using same
US4301194A (en) * 1979-05-04 1981-11-17 Purex Corporation Chemical milling maskant application process
US6207265B1 (en) 1999-09-24 2001-03-27 Illinois Tool Works Inc. Non-ionic circuit board masking agent
FR2873887B1 (fr) * 2004-08-02 2015-07-24 Tpc Procede de fabrication de composants electroniques realises en ceramique et recouverts d'une couche de verre et composition de masquage pour la mise en oeuvre dudit procede
US8677929B2 (en) * 2010-12-29 2014-03-25 Intevac, Inc. Method and apparatus for masking solar cell substrates for deposition
US9464185B2 (en) 2013-11-25 2016-10-11 Crayola Llc Marking system
US10676809B2 (en) 2018-06-20 2020-06-09 Lockheed Martin Corporation Methods and systems for generating patterns on flexible substrates

Also Published As

Publication number Publication date
GB1380092A (en) 1975-01-08
DE2254436B2 (de) 1979-03-15
NL7215025A (enExample) 1973-05-10
DE2254436A1 (de) 1974-01-03
CA999094A (en) 1976-10-26
NL159022B (nl) 1979-01-15
US3773704A (en) 1973-11-20
JPS4858027A (enExample) 1973-08-15
JPS511451B2 (enExample) 1976-01-17
FR2160217A5 (enExample) 1973-06-22
SE390735B (sv) 1977-01-17
IT973431B (it) 1974-06-10

Similar Documents

Publication Publication Date Title
DE69131990T2 (de) Verfahren zum entfernen von verunreinigungen mittels einem einbasischen ester
DE2530502C2 (de) Verfahren zum gleichzeitigen Entwickeln und Konservieren von Druckplatten sowie dafür geeignete Behandlungslösung
DE3855381T2 (de) Zusammensetzung auf Wasserbasis zur Entfernung von Überzügen
DE2254436C3 (de) Abdeckstoff
DE69114930T2 (de) Weichlotflussmittel und Verfahren zu ihrer Verwendung beim Herstellen und Aufsetzen von gedruckten Schaltungsplatten.
DE1303172B (de) Reinigungsmittel
DE69328372T2 (de) Reinigungsverfahren von zusammensetzung auf öl-basis und zusammensetzung zur verwendung dafür
EP0024298A2 (de) Schlussbehandlungslösung für Flachdruckplatten und Verfahren zum Behandeln einer entwickelten Flachdruckplatte
EP0595881B1 (de) Verwendung von halogenkohlenwasserstoff-freien reinigungsmitteln zur fluxentfernung von elektronischen und elektrischen baugruppen
DE557352C (de) Verfahren zur Reinigung von Gegenstaenden aus Eisen und Eisenlegierungen
DE69025594T2 (de) Nichttoxische, nichtentflammbare reiniger zum reinigen von gedruckten schaltungen
DE3534278A1 (de) Abbeizpaste zum entfernen von lack- und farbschichten
DE2403428C2 (de) Lösungsmittelzusammensetzung
DE69432702T2 (de) Verfahren zur herstellung von sauberen gegenstaenden
DE2326447C2 (de) Verfahren zum Entfernen von Schichten aus organischem Material und seine Verwendung
DE2919666C2 (enExample)
DE2415976B2 (de) Verfahren zur Entfernung einer wasserunlöslichen haftfähigen Schutzschicht von einer Unterlage und zur erneuten Ausbildung einer Schutzschicht
DE1621597A1 (de) Verfahren zur Entkonservierung von lackierten und metallischen Gegenstaenden
EP1657594B1 (de) Verfahren zur Hydrophilierung von Siebruckschablonenträgern sowie Verfahren zur Entfernung von Schablonenmaterial von einem Siebdruckschablonenträger und Entschichtungsflüssigkeit hierfür
DE4121304C2 (enExample)
DE4228461C1 (de) Reinigungsmediumzusammensetzung
EP0104321B1 (de) Korrekturmittel zur trockenen Entfernung von Faserschreibertinten auf nichtsaugendem Untergrund
EP0616016A1 (de) Abbeizmittel
DE4129857C2 (de) Verwendung eines Butyldiglykol enthaltenen Gemisches als Abbeizmittel
DE4206363A1 (de) Mittel zur entfernung von unerwuenschten beschriftungen

Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee