IT973431B - Composizione e procedimento di mascheramento in particolare per processi di saldatura - Google Patents

Composizione e procedimento di mascheramento in particolare per processi di saldatura

Info

Publication number
IT973431B
IT973431B IT53869/72A IT5386972A IT973431B IT 973431 B IT973431 B IT 973431B IT 53869/72 A IT53869/72 A IT 53869/72A IT 5386972 A IT5386972 A IT 5386972A IT 973431 B IT973431 B IT 973431B
Authority
IT
Italy
Prior art keywords
composition
welding processes
masking process
masking
welding
Prior art date
Application number
IT53869/72A
Other languages
English (en)
Original Assignee
Tektronix Inc And Indusco
Indusco Chemical Prod
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tektronix Inc And Indusco, Indusco Chemical Prod filed Critical Tektronix Inc And Indusco
Application granted granted Critical
Publication of IT973431B publication Critical patent/IT973431B/it

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/224—Anti-weld compositions; Braze stop-off compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/008—Temporary coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Detergent Compositions (AREA)
IT53869/72A 1971-11-08 1972-11-08 Composizione e procedimento di mascheramento in particolare per processi di saldatura IT973431B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19679871A 1971-11-08 1971-11-08

Publications (1)

Publication Number Publication Date
IT973431B true IT973431B (it) 1974-06-10

Family

ID=22726836

Family Applications (1)

Application Number Title Priority Date Filing Date
IT53869/72A IT973431B (it) 1971-11-08 1972-11-08 Composizione e procedimento di mascheramento in particolare per processi di saldatura

Country Status (9)

Country Link
US (1) US3773704A (it)
JP (1) JPS511451B2 (it)
CA (1) CA999094A (it)
DE (1) DE2254436C3 (it)
FR (1) FR2160217A5 (it)
GB (1) GB1380092A (it)
IT (1) IT973431B (it)
NL (1) NL159022B (it)
SE (1) SE390735B (it)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3957432A (en) * 1974-02-26 1976-05-18 Union Carbide Corporation Aqueous pituitous color compositions based on poly(ethylene oxide)
JPS52117853A (en) * 1976-03-29 1977-10-03 Ibm Detachable solder mask
US4216035A (en) * 1977-12-23 1980-08-05 International Business Machines Corporation Removable protective coating and process of using same
US4301194A (en) * 1979-05-04 1981-11-17 Purex Corporation Chemical milling maskant application process
US6207265B1 (en) 1999-09-24 2001-03-27 Illinois Tool Works Inc. Non-ionic circuit board masking agent
FR2873887B1 (fr) * 2004-08-02 2015-07-24 Tpc Procede de fabrication de composants electroniques realises en ceramique et recouverts d'une couche de verre et composition de masquage pour la mise en oeuvre dudit procede
US8677929B2 (en) * 2010-12-29 2014-03-25 Intevac, Inc. Method and apparatus for masking solar cell substrates for deposition
CA2871957C (en) 2013-11-25 2019-05-07 Crayola Llc Marking system
US10676809B2 (en) 2018-06-20 2020-06-09 Lockheed Martin Corporation Methods and systems for generating patterns on flexible substrates

Also Published As

Publication number Publication date
JPS511451B2 (it) 1976-01-17
SE390735B (sv) 1977-01-17
GB1380092A (en) 1975-01-08
NL159022B (nl) 1979-01-15
US3773704A (en) 1973-11-20
CA999094A (en) 1976-10-26
DE2254436B2 (de) 1979-03-15
DE2254436A1 (de) 1974-01-03
FR2160217A5 (it) 1973-06-22
DE2254436C3 (de) 1979-10-25
NL7215025A (it) 1973-05-10
JPS4858027A (it) 1973-08-15

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