DE2235533C3 - Halbleiterbauelement mit einem Ladungsspeicherelement - Google Patents
Halbleiterbauelement mit einem LadungsspeicherelementInfo
- Publication number
- DE2235533C3 DE2235533C3 DE2235533A DE2235533A DE2235533C3 DE 2235533 C3 DE2235533 C3 DE 2235533C3 DE 2235533 A DE2235533 A DE 2235533A DE 2235533 A DE2235533 A DE 2235533A DE 2235533 C3 DE2235533 C3 DE 2235533C3
- Authority
- DE
- Germany
- Prior art keywords
- region
- semiconductor
- layer
- conductivity type
- component according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title claims description 72
- 239000010410 layer Substances 0.000 claims description 134
- 239000002800 charge carrier Substances 0.000 claims description 42
- 238000002347 injection Methods 0.000 claims description 30
- 239000007924 injection Substances 0.000 claims description 30
- 238000007667 floating Methods 0.000 claims description 26
- 230000005669 field effect Effects 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000012535 impurity Substances 0.000 claims description 13
- 230000005684 electric field Effects 0.000 claims description 11
- 239000002344 surface layer Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000969 carrier Substances 0.000 claims description 4
- 239000012141 concentrate Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 42
- 229910052710 silicon Inorganic materials 0.000 description 42
- 239000010703 silicon Substances 0.000 description 42
- 108091006146 Channels Proteins 0.000 description 21
- 239000000758 substrate Substances 0.000 description 21
- 230000015556 catabolic process Effects 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 229910052814 silicon oxide Inorganic materials 0.000 description 13
- 238000011161 development Methods 0.000 description 10
- 230000018109 developmental process Effects 0.000 description 10
- 230000004888 barrier function Effects 0.000 description 9
- 150000004767 nitrides Chemical class 0.000 description 9
- 239000002784 hot electron Substances 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000002513 implantation Methods 0.000 description 6
- 239000000370 acceptor Substances 0.000 description 5
- 230000005641 tunneling Effects 0.000 description 5
- 229910052796 boron Inorganic materials 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- -1 about 100 Å) Chemical compound 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 108010075750 P-Type Calcium Channels Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/68—Floating-gate IGFETs
- H10D30/681—Floating-gate IGFETs having only two programming levels
- H10D30/684—Floating-gate IGFETs having only two programming levels programmed by hot carrier injection
- H10D30/686—Floating-gate IGFETs having only two programming levels programmed by hot carrier injection using hot carriers produced by avalanche breakdown of PN junctions, e.g. floating gate avalanche injection MOS [FAMOS]
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0433—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and one or more separate select transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
- H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
- H10D84/84—Combinations of enhancement-mode IGFETs and depletion-mode IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
- Non-Volatile Memory (AREA)
- Read Only Memory (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB3540071A GB1392599A (en) | 1971-07-28 | 1971-07-28 | Semiconductor memory elements |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2235533A1 DE2235533A1 (de) | 1973-02-08 |
| DE2235533B2 DE2235533B2 (de) | 1977-10-06 |
| DE2235533C3 true DE2235533C3 (de) | 1978-06-22 |
Family
ID=10377308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE2235533A Expired DE2235533C3 (de) | 1971-07-28 | 1972-07-20 | Halbleiterbauelement mit einem Ladungsspeicherelement |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US3952325A (enExample) |
| JP (1) | JPS523279B1 (enExample) |
| AU (1) | AU474357B2 (enExample) |
| CA (1) | CA960365A (enExample) |
| DE (1) | DE2235533C3 (enExample) |
| FR (1) | FR2147308B1 (enExample) |
| GB (1) | GB1392599A (enExample) |
| IT (1) | IT964778B (enExample) |
| NL (1) | NL173105C (enExample) |
Families Citing this family (70)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1374231A (en) * | 1972-05-08 | 1974-11-20 | Signetics Corp | Integrated circuit devices |
| CA1040321A (en) * | 1974-07-23 | 1978-10-10 | Alfred C. Ipri | Polycrystalline silicon resistive device for integrated circuits and method for making same |
| DE2513207C2 (de) * | 1974-09-20 | 1982-07-01 | Siemens AG, 1000 Berlin und 8000 München | n-Kanal-Speicher-FET |
| DE2638730C2 (de) * | 1974-09-20 | 1982-10-28 | Siemens AG, 1000 Berlin und 8000 München | n-Kanal-Speicher-FET, Verfahren zum Entladen des Speichergate des n-Kanal-Speicher-FET und Verwendung des n-Kanal-Speicher-FET |
| US4087795A (en) * | 1974-09-20 | 1978-05-02 | Siemens Aktiengesellschaft | Memory field effect storage device |
| DE2445079C3 (de) * | 1974-09-20 | 1981-06-04 | Siemens AG, 1000 Berlin und 8000 München | Speicher-Feldeffekttransistor |
| DE2812049C2 (de) * | 1974-09-20 | 1982-05-27 | Siemens AG, 1000 Berlin und 8000 München | n-Kanal-Speicher-FET |
| US3987474A (en) * | 1975-01-23 | 1976-10-19 | Massachusetts Institute Of Technology | Non-volatile charge storage elements and an information storage apparatus employing such elements |
| DE2560220C2 (de) * | 1975-03-25 | 1982-11-25 | Siemens AG, 1000 Berlin und 8000 München | n-Kanal-Speicher-FET |
| US4070667A (en) * | 1975-11-03 | 1978-01-24 | General Electric Company | Charge transfer analog-to-digital converter |
| US4070652A (en) * | 1975-11-14 | 1978-01-24 | Westinghouse Electric Corporation | Acousto-electric signal convolver, correlator and memory |
| US4080718A (en) * | 1976-12-14 | 1978-03-28 | Smc Standard Microsystems Corporation | Method of modifying electrical characteristics of MOS devices using ion implantation |
| US4161039A (en) * | 1976-12-15 | 1979-07-10 | Siemens Aktiengesellschaft | N-Channel storage FET |
| US4302764A (en) * | 1976-12-30 | 1981-11-24 | International Business Machines Corporation | Nondestructive read-out dynamic memory cell |
| DE2706155A1 (de) * | 1977-02-14 | 1978-08-17 | Siemens Ag | In integrierter technik hergestellter elektronischer speicher |
| US4197144A (en) * | 1978-09-21 | 1980-04-08 | General Electric Company | Method for improving writing of information in memory targets |
| US4262298A (en) * | 1979-09-04 | 1981-04-14 | Burroughs Corporation | Ram having a stabilized substrate bias and low-threshold narrow-width transfer gates |
| JPS56150871A (en) * | 1980-04-24 | 1981-11-21 | Toshiba Corp | Semiconductor device |
| US5243210A (en) * | 1987-02-21 | 1993-09-07 | Kabushiki Kaisha Toshiba | Semiconductor memory device and manufacturing method thereof |
| EP0646288B1 (en) * | 1992-06-19 | 1998-12-16 | Lattice Semiconductor Corporation | Single polysilicon layer flash e?2 prom cell |
| US5359573A (en) * | 1992-06-19 | 1994-10-25 | Lattice Semiconductor Corporation | Flash E2 PROM array with mingle polysilicon layer memory cell |
| US5418390A (en) * | 1993-03-19 | 1995-05-23 | Lattice Semiconductor Corporation | Single polysilicon layer E2 PROM cell |
| US5539233A (en) * | 1993-07-22 | 1996-07-23 | Texas Instruments Incorporated | Controlled low collector breakdown voltage vertical transistor for ESD protection circuits |
| JP3878681B2 (ja) | 1995-06-15 | 2007-02-07 | 株式会社ルネサステクノロジ | 不揮発性半導体記憶装置 |
| US5777361A (en) * | 1996-06-03 | 1998-07-07 | Motorola, Inc. | Single gate nonvolatile memory cell and method for accessing the same |
| US6768165B1 (en) * | 1997-08-01 | 2004-07-27 | Saifun Semiconductors Ltd. | Two bit non-volatile electrically erasable and programmable semiconductor memory cell utilizing asymmetrical charge trapping |
| US6137722A (en) * | 1998-04-01 | 2000-10-24 | National Semiconductor Corporation | Memory array having Frohmann-Bentchkowsky EPROM cells with a reduced number of access transistors |
| US6137721A (en) * | 1998-04-01 | 2000-10-24 | National Semiconductor Corporation | Memory device having erasable frohmann-bentchkowsky EPROM cells that use a plate-to-floating gate coupled voltage during erasure |
| US6118691A (en) * | 1998-04-01 | 2000-09-12 | National Semiconductor Corporation | Memory cell with a Frohmann-Bentchkowsky EPROM memory transistor that reduces the voltage across an unprogrammed memory transistor during a read |
| US6137723A (en) * | 1998-04-01 | 2000-10-24 | National Semiconductor Corporation | Memory device having erasable Frohmann-Bentchkowsky EPROM cells that use a well-to-floating gate coupled voltage during erasure |
| US6130840A (en) * | 1998-04-01 | 2000-10-10 | National Semiconductor Corporation | Memory cell having an erasable Frohmann-Bentchkowsky memory transistor |
| US6081451A (en) * | 1998-04-01 | 2000-06-27 | National Semiconductor Corporation | Memory device that utilizes single-poly EPROM cells with CMOS compatible programming voltages |
| US6157574A (en) * | 1998-04-01 | 2000-12-05 | National Semiconductor Corporation | Erasable frohmann-bentchkowsky memory transistor that stores multiple bits of data |
| US6141246A (en) * | 1998-04-01 | 2000-10-31 | National Semiconductor Corporation | Memory device with sense amplifier that sets the voltage drop across the cells of the device |
| US6055185A (en) | 1998-04-01 | 2000-04-25 | National Semiconductor Corporation | Single-poly EPROM cell with CMOS compatible programming voltages |
| US6348711B1 (en) * | 1998-05-20 | 2002-02-19 | Saifun Semiconductors Ltd. | NROM cell with self-aligned programming and erasure areas |
| JP2000223590A (ja) * | 1999-02-04 | 2000-08-11 | Sony Corp | ゲート電荷蓄積形メモリセル |
| US6614692B2 (en) * | 2001-01-18 | 2003-09-02 | Saifun Semiconductors Ltd. | EEPROM array and method for operation thereof |
| US6584017B2 (en) | 2001-04-05 | 2003-06-24 | Saifun Semiconductors Ltd. | Method for programming a reference cell |
| US6700818B2 (en) | 2002-01-31 | 2004-03-02 | Saifun Semiconductors Ltd. | Method for operating a memory device |
| US6917544B2 (en) | 2002-07-10 | 2005-07-12 | Saifun Semiconductors Ltd. | Multiple use memory chip |
| US7136304B2 (en) | 2002-10-29 | 2006-11-14 | Saifun Semiconductor Ltd | Method, system and circuit for programming a non-volatile memory array |
| US7178004B2 (en) | 2003-01-31 | 2007-02-13 | Yan Polansky | Memory array programming circuit and a method for using the circuit |
| US7142464B2 (en) | 2003-04-29 | 2006-11-28 | Saifun Semiconductors Ltd. | Apparatus and methods for multi-level sensing in a memory array |
| US7123532B2 (en) | 2003-09-16 | 2006-10-17 | Saifun Semiconductors Ltd. | Operating array cells with matched reference cells |
| US7484329B2 (en) | 2003-11-20 | 2009-02-03 | Seaweed Bio-Technology Inc. | Technology for cultivation of Porphyra and other seaweeds in land-based sea water ponds |
| US7102191B2 (en) * | 2004-03-24 | 2006-09-05 | Micron Technologies, Inc. | Memory device with high dielectric constant gate dielectrics and metal floating gates |
| US7317633B2 (en) | 2004-07-06 | 2008-01-08 | Saifun Semiconductors Ltd | Protection of NROM devices from charge damage |
| US7095655B2 (en) | 2004-08-12 | 2006-08-22 | Saifun Semiconductors Ltd. | Dynamic matching of signal path and reference path for sensing |
| US7638850B2 (en) | 2004-10-14 | 2009-12-29 | Saifun Semiconductors Ltd. | Non-volatile memory structure and method of fabrication |
| US7535765B2 (en) | 2004-12-09 | 2009-05-19 | Saifun Semiconductors Ltd. | Non-volatile memory device and method for reading cells |
| CN1838328A (zh) | 2005-01-19 | 2006-09-27 | 赛芬半导体有限公司 | 擦除存储器阵列上存储单元的方法 |
| US8053812B2 (en) | 2005-03-17 | 2011-11-08 | Spansion Israel Ltd | Contact in planar NROM technology |
| EP1746645A3 (en) | 2005-07-18 | 2009-01-21 | Saifun Semiconductors Ltd. | Memory array with sub-minimum feature size word line spacing and method of fabrication |
| US7668017B2 (en) | 2005-08-17 | 2010-02-23 | Saifun Semiconductors Ltd. | Method of erasing non-volatile memory cells |
| US7221138B2 (en) | 2005-09-27 | 2007-05-22 | Saifun Semiconductors Ltd | Method and apparatus for measuring charge pump output current |
| US20070087503A1 (en) * | 2005-10-17 | 2007-04-19 | Saifun Semiconductors, Ltd. | Improving NROM device characteristics using adjusted gate work function |
| US20070102789A1 (en) * | 2005-11-09 | 2007-05-10 | International Business Machines Corporation | Bipolar transistor and back-gated transistor structure and method |
| US7352627B2 (en) | 2006-01-03 | 2008-04-01 | Saifon Semiconductors Ltd. | Method, system, and circuit for operating a non-volatile memory array |
| US7808818B2 (en) | 2006-01-12 | 2010-10-05 | Saifun Semiconductors Ltd. | Secondary injection for NROM |
| US7760554B2 (en) | 2006-02-21 | 2010-07-20 | Saifun Semiconductors Ltd. | NROM non-volatile memory and mode of operation |
| US8253452B2 (en) | 2006-02-21 | 2012-08-28 | Spansion Israel Ltd | Circuit and method for powering up an integrated circuit and an integrated circuit utilizing same |
| US7692961B2 (en) | 2006-02-21 | 2010-04-06 | Saifun Semiconductors Ltd. | Method, circuit and device for disturb-control of programming nonvolatile memory cells by hot-hole injection (HHI) and by channel hot-electron (CHE) injection |
| US7638835B2 (en) | 2006-02-28 | 2009-12-29 | Saifun Semiconductors Ltd. | Double density NROM with nitride strips (DDNS) |
| US7701779B2 (en) | 2006-04-27 | 2010-04-20 | Sajfun Semiconductors Ltd. | Method for programming a reference cell |
| US7605579B2 (en) | 2006-09-18 | 2009-10-20 | Saifun Semiconductors Ltd. | Measuring and controlling current consumption and output current of charge pumps |
| US8320191B2 (en) | 2007-08-30 | 2012-11-27 | Infineon Technologies Ag | Memory cell arrangement, method for controlling a memory cell, memory array and electronic device |
| JP2013077780A (ja) * | 2011-09-30 | 2013-04-25 | Seiko Instruments Inc | 半導体記憶装置及び半導体記憶素子 |
| US9040929B2 (en) | 2012-07-30 | 2015-05-26 | International Business Machines Corporation | Charge sensors using inverted lateral bipolar junction transistors |
| CN111668126B (zh) * | 2019-03-07 | 2023-04-25 | 西安电子科技大学 | 一种化合物misfet器件热空穴效应的测试结构及表征方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3462657A (en) * | 1968-03-07 | 1969-08-19 | Gen Electric | Protection means for surface semiconductor devices having thin oxide films therein |
| US3728695A (en) * | 1971-10-06 | 1973-04-17 | Intel Corp | Random-access floating gate mos memory array |
-
1971
- 1971-07-28 GB GB3540071A patent/GB1392599A/en not_active Expired
-
1972
- 1972-07-20 DE DE2235533A patent/DE2235533C3/de not_active Expired
- 1972-07-21 AU AU44832/72A patent/AU474357B2/en not_active Expired
- 1972-07-22 NL NLAANVRAGE7210169,A patent/NL173105C/xx not_active IP Right Cessation
- 1972-07-25 IT IT6940972A patent/IT964778B/it active
- 1972-07-25 CA CA147,831A patent/CA960365A/en not_active Expired
- 1972-07-26 US US05/275,321 patent/US3952325A/en not_active Expired - Lifetime
- 1972-07-28 FR FR7227378A patent/FR2147308B1/fr not_active Expired
- 1972-07-28 JP JP7580172A patent/JPS523279B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| NL7210169A (enExample) | 1973-01-30 |
| GB1392599A (en) | 1975-04-30 |
| US3952325A (en) | 1976-04-20 |
| AU4483272A (en) | 1974-01-24 |
| NL173105B (nl) | 1983-07-01 |
| JPS523279B1 (enExample) | 1977-01-27 |
| DE2235533B2 (de) | 1977-10-06 |
| FR2147308B1 (enExample) | 1976-08-13 |
| NL173105C (nl) | 1983-12-01 |
| DE2235533A1 (de) | 1973-02-08 |
| AU474357B2 (en) | 1976-07-22 |
| IT964778B (it) | 1974-01-31 |
| CA960365A (en) | 1974-12-31 |
| FR2147308A1 (enExample) | 1973-03-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C3 | Grant after two publication steps (3rd publication) | ||
| 8339 | Ceased/non-payment of the annual fee |