DE2143809A1 - Verfahren zum Herstellen von Zu leitung sr ahmen - Google Patents

Verfahren zum Herstellen von Zu leitung sr ahmen

Info

Publication number
DE2143809A1
DE2143809A1 DE19712143809 DE2143809A DE2143809A1 DE 2143809 A1 DE2143809 A1 DE 2143809A1 DE 19712143809 DE19712143809 DE 19712143809 DE 2143809 A DE2143809 A DE 2143809A DE 2143809 A1 DE2143809 A1 DE 2143809A1
Authority
DE
Germany
Prior art keywords
heat sink
arms
metal strip
plane
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19712143809
Other languages
German (de)
English (en)
Inventor
Frederick Jay Etters Pa Heinlen (V St A )
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of DE2143809A1 publication Critical patent/DE2143809A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for individual devices of subclass H10D
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE19712143809 1970-09-08 1971-09-01 Verfahren zum Herstellen von Zu leitung sr ahmen Pending DE2143809A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7003470A 1970-09-08 1970-09-08

Publications (1)

Publication Number Publication Date
DE2143809A1 true DE2143809A1 (de) 1972-03-09

Family

ID=22092718

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19712143809 Pending DE2143809A1 (de) 1970-09-08 1971-09-01 Verfahren zum Herstellen von Zu leitung sr ahmen

Country Status (11)

Country Link
US (1) US3650232A (cg-RX-API-DMAC7.html)
AT (1) AT318042B (cg-RX-API-DMAC7.html)
AU (1) AU450494B2 (cg-RX-API-DMAC7.html)
BE (1) BE772314A (cg-RX-API-DMAC7.html)
CA (1) CA966986A (cg-RX-API-DMAC7.html)
DE (1) DE2143809A1 (cg-RX-API-DMAC7.html)
ES (1) ES394780A1 (cg-RX-API-DMAC7.html)
FR (1) FR2106369B1 (cg-RX-API-DMAC7.html)
GB (1) GB1305337A (cg-RX-API-DMAC7.html)
NL (1) NL7112352A (cg-RX-API-DMAC7.html)
SE (1) SE360216B (cg-RX-API-DMAC7.html)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3815205A (en) * 1973-03-02 1974-06-11 Nasa Device for configuring multiple leads
US4158745A (en) * 1977-10-27 1979-06-19 Amp Incorporated Lead frame having integral terminal tabs
US4214120A (en) * 1978-10-27 1980-07-22 Western Electric Company, Inc. Electronic device package having solder leads and methods of assembling the package
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4252864A (en) * 1979-11-05 1981-02-24 Amp Incorporated Lead frame having integral terminal tabs
FR2538961B1 (fr) * 1982-12-30 1985-07-12 Europ Composants Electron Embase pour circuit integre
EP0222401B1 (en) * 1985-11-13 1994-02-16 Fujitsu Limited IC sheet cutting press
US4819476A (en) * 1987-07-17 1989-04-11 Amp Incorporated Tooling for forming machines having improved guidance, tool mounting, and pilot pin systems
NL9100470A (nl) * 1991-03-15 1992-10-01 Asm Fico Tooling Werkwijze en inrichting voor het uit op een leadframe opgenomen geintegreerde schakelingen vervaardigen van een enkelvoudig produkt.
US5557504A (en) * 1993-08-31 1996-09-17 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
US5570273A (en) * 1993-08-31 1996-10-29 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with low-profile detachable module
USD358804S (en) 1993-09-02 1995-05-30 Sgs-Thomson Microelectronics, Inc. Detachable integrated circuit module
USD358805S (en) 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Detachable integrated circuit module
EP0823719B1 (en) * 1996-07-26 2002-06-05 Nec Corporation Solid electrolytic capacitor having pre-plated lead terminals and manufacturing process thereof
JP2000243889A (ja) * 1999-02-22 2000-09-08 Sony Corp 半導体装置用リードフレームの形状加工装置及び形状加工方法並びに半導体装置用リードフレーム
EP3526821B1 (en) * 2016-11-11 2020-09-30 Lumileds Holding B.V. Method of manufacturing an led lighting device comprising a lead frame
CN117644134B (zh) * 2024-01-23 2024-05-14 佛山市阿玛达机械科技有限公司 一种金属板材加工用冷弯成型装置及其操作方法
CN119747739B (zh) * 2025-03-07 2025-07-18 厦门特克精密工业有限公司 一种引线框架的切断装置及切断工艺

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3571920A (en) * 1965-12-16 1971-03-23 Berg Electronics Inc Method for transistor manufacture
US3440027A (en) * 1966-06-22 1969-04-22 Frances Hugle Automated packaging of semiconductors
US3524249A (en) * 1966-10-08 1970-08-18 Nippon Electric Co Method of manufacturing a semiconductor container
US3559285A (en) * 1968-01-08 1971-02-02 Jade Corp Method of forming leads for attachment to semi-conductor devices

Also Published As

Publication number Publication date
AU450494B2 (en) 1974-07-11
CA966986A (en) 1975-05-06
BE772314A (fr) 1972-03-07
AU3235571A (en) 1973-02-15
US3650232A (en) 1972-03-21
FR2106369B1 (cg-RX-API-DMAC7.html) 1977-04-22
GB1305337A (cg-RX-API-DMAC7.html) 1973-01-31
SE360216B (cg-RX-API-DMAC7.html) 1973-09-17
AT318042B (de) 1974-09-25
FR2106369A1 (cg-RX-API-DMAC7.html) 1972-05-05
NL7112352A (cg-RX-API-DMAC7.html) 1972-03-10
ES394780A1 (es) 1974-03-01

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