ES394780A1 - Un metodo de fabricar bastidores de conductores en forma deuna tira continua. - Google Patents

Un metodo de fabricar bastidores de conductores en forma deuna tira continua.

Info

Publication number
ES394780A1
ES394780A1 ES394780A ES394780A ES394780A1 ES 394780 A1 ES394780 A1 ES 394780A1 ES 394780 A ES394780 A ES 394780A ES 394780 A ES394780 A ES 394780A ES 394780 A1 ES394780 A1 ES 394780A1
Authority
ES
Spain
Prior art keywords
leads
heat sink
lead frames
integral
manufacturing lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES394780A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of ES394780A1 publication Critical patent/ES394780A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
ES394780A 1970-09-08 1971-09-03 Un metodo de fabricar bastidores de conductores en forma deuna tira continua. Expired ES394780A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7003470A 1970-09-08 1970-09-08

Publications (1)

Publication Number Publication Date
ES394780A1 true ES394780A1 (es) 1974-03-01

Family

ID=22092718

Family Applications (1)

Application Number Title Priority Date Filing Date
ES394780A Expired ES394780A1 (es) 1970-09-08 1971-09-03 Un metodo de fabricar bastidores de conductores en forma deuna tira continua.

Country Status (11)

Country Link
US (1) US3650232A (es)
AT (1) AT318042B (es)
AU (1) AU450494B2 (es)
BE (1) BE772314A (es)
CA (1) CA966986A (es)
DE (1) DE2143809A1 (es)
ES (1) ES394780A1 (es)
FR (1) FR2106369B1 (es)
GB (1) GB1305337A (es)
NL (1) NL7112352A (es)
SE (1) SE360216B (es)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3815205A (en) * 1973-03-02 1974-06-11 Nasa Device for configuring multiple leads
US4158745A (en) * 1977-10-27 1979-06-19 Amp Incorporated Lead frame having integral terminal tabs
US4214120A (en) * 1978-10-27 1980-07-22 Western Electric Company, Inc. Electronic device package having solder leads and methods of assembling the package
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4252864A (en) * 1979-11-05 1981-02-24 Amp Incorporated Lead frame having integral terminal tabs
FR2538961B1 (fr) * 1982-12-30 1985-07-12 Europ Composants Electron Embase pour circuit integre
KR910001118B1 (ko) * 1985-11-13 1991-02-23 후지쓰 가부시끼가이샤 Ic 시이트 절단 프레스 및 이를 이용한 ic 시이트 가공장치
US4819476A (en) * 1987-07-17 1989-04-11 Amp Incorporated Tooling for forming machines having improved guidance, tool mounting, and pilot pin systems
NL9100470A (nl) * 1991-03-15 1992-10-01 Asm Fico Tooling Werkwijze en inrichting voor het uit op een leadframe opgenomen geintegreerde schakelingen vervaardigen van een enkelvoudig produkt.
US5557504A (en) * 1993-08-31 1996-09-17 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
US5570273A (en) * 1993-08-31 1996-10-29 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with low-profile detachable module
DE69712999T2 (de) * 1996-07-26 2003-01-23 Nec Corp., Tokio/Tokyo Festelektrolytkondensator mit vorplattierten Leiteranschlüssen und dessen Herstellungsverfahren
JP2000243889A (ja) * 1999-02-22 2000-09-08 Sony Corp 半導体装置用リードフレームの形状加工装置及び形状加工方法並びに半導体装置用リードフレーム
JP6748303B2 (ja) * 2016-11-11 2020-08-26 ルミレッズ ホールディング ベーフェー リードフレーム製造方法
CN117644134B (zh) * 2024-01-23 2024-05-14 佛山市阿玛达机械科技有限公司 一种金属板材加工用冷弯成型装置及其操作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3571920A (en) * 1965-12-16 1971-03-23 Berg Electronics Inc Method for transistor manufacture
US3440027A (en) * 1966-06-22 1969-04-22 Frances Hugle Automated packaging of semiconductors
US3524249A (en) * 1966-10-08 1970-08-18 Nippon Electric Co Method of manufacturing a semiconductor container
US3559285A (en) * 1968-01-08 1971-02-02 Jade Corp Method of forming leads for attachment to semi-conductor devices

Also Published As

Publication number Publication date
AT318042B (de) 1974-09-25
GB1305337A (es) 1973-01-31
AU450494B2 (en) 1974-07-11
FR2106369B1 (es) 1977-04-22
US3650232A (en) 1972-03-21
DE2143809A1 (de) 1972-03-09
NL7112352A (es) 1972-03-10
SE360216B (es) 1973-09-17
AU3235571A (en) 1973-02-15
FR2106369A1 (es) 1972-05-05
BE772314A (fr) 1972-03-07
CA966986A (en) 1975-05-06

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