ES401656A1 - Perfeccionamientos introducidos en armazones de conductoresde transistor. - Google Patents

Perfeccionamientos introducidos en armazones de conductoresde transistor.

Info

Publication number
ES401656A1
ES401656A1 ES401656A ES401656A ES401656A1 ES 401656 A1 ES401656 A1 ES 401656A1 ES 401656 A ES401656 A ES 401656A ES 401656 A ES401656 A ES 401656A ES 401656 A1 ES401656 A1 ES 401656A1
Authority
ES
Spain
Prior art keywords
leads
heat sink
lead frames
making same
integral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES401656A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of ES401656A1 publication Critical patent/ES401656A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
ES401656A 1971-04-12 1972-04-11 Perfeccionamientos introducidos en armazones de conductoresde transistor. Expired ES401656A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13306571A 1971-04-12 1971-04-12

Publications (1)

Publication Number Publication Date
ES401656A1 true ES401656A1 (es) 1975-11-01

Family

ID=22456847

Family Applications (1)

Application Number Title Priority Date Filing Date
ES401656A Expired ES401656A1 (es) 1971-04-12 1972-04-11 Perfeccionamientos introducidos en armazones de conductoresde transistor.

Country Status (10)

Country Link
US (1) US3735017A (es)
BE (1) BE781898A (es)
CA (1) CA943268A (es)
DE (1) DE2215417A1 (es)
ES (1) ES401656A1 (es)
FR (1) FR2132846B1 (es)
GB (1) GB1337692A (es)
IT (1) IT950743B (es)
NL (1) NL7204755A (es)
SE (1) SE368478B (es)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3882807A (en) * 1974-04-08 1975-05-13 Texas Instruments Inc Method of separating dual inline packages from a strip
DE2444892C3 (de) * 1974-09-19 1982-03-18 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von streifenförmigen Anschlußelementen
DE2511209C3 (de) * 1975-03-14 1980-10-02 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum Kontaktieren der Elektroden von scheibenförmigen Halbleiterkörpern und Metallstreifen zur Durchführung des Verfahrens
DE2714145C2 (de) * 1976-03-31 1985-01-10 Mitsubishi Denki K.K., Tokio/Tokyo Gestanzte Metallträgerplatte für die Herstellung von kunststoffummantelten Halbleiterbauelementen
US4158745A (en) * 1977-10-27 1979-06-19 Amp Incorporated Lead frame having integral terminal tabs
US4478588A (en) * 1978-03-06 1984-10-23 Amp Incorporated Light emitting diode assembly
US4214120A (en) * 1978-10-27 1980-07-22 Western Electric Company, Inc. Electronic device package having solder leads and methods of assembling the package
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4346396A (en) * 1979-03-12 1982-08-24 Western Electric Co., Inc. Electronic device assembly and methods of making same
US4252864A (en) * 1979-11-05 1981-02-24 Amp Incorporated Lead frame having integral terminal tabs
US4323293A (en) * 1980-06-30 1982-04-06 Bourns, Inc. Terminal lead with labyrinthine clip
US4446375A (en) * 1981-10-14 1984-05-01 General Electric Company Optocoupler having folded lead frame construction
DE3148382A1 (de) * 1981-12-07 1983-06-09 Black & Decker, Inc., 19711 Newark, Del. Elektrogeraet, insbesondere elektrowerkzeug, mit steckbaren bauteilen
US4567545A (en) * 1983-05-18 1986-01-28 Mettler Rollin W Jun Integrated circuit module and method of making same
EP0400177A1 (de) * 1989-05-31 1990-12-05 Siemens Aktiengesellschaft Verbindung eines Halbleiterbauelements mit einem Metallträger
WO2003082003A2 (en) * 2002-03-26 2003-10-09 Georgia-Pacific Resins, Inc. Slow release nitrogen coating
US20070057368A1 (en) * 2005-09-13 2007-03-15 Yueh-Se Ho Semiconductor package having plate interconnections
US7622796B2 (en) * 2005-09-13 2009-11-24 Alpha And Omega Semiconductor Limited Semiconductor package having a bridged plate interconnection
US7683464B2 (en) * 2005-09-13 2010-03-23 Alpha And Omega Semiconductor Incorporated Semiconductor package having dimpled plate interconnections
US8680658B2 (en) * 2008-05-30 2014-03-25 Alpha And Omega Semiconductor Incorporated Conductive clip for semiconductor device package

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2476429A (en) * 1946-08-30 1949-07-19 Aircraft Marine Prod Inc Connector for electrical conductors
US3569797A (en) * 1969-03-12 1971-03-09 Bendix Corp Semiconductor device with preassembled mounting
US3597666A (en) * 1969-11-26 1971-08-03 Fairchild Camera Instr Co Lead frame design
US3628483A (en) * 1970-03-20 1971-12-21 Amp Inc Method of making power frame for integrated circuit

Also Published As

Publication number Publication date
DE2215417A1 (de) 1972-10-26
FR2132846A1 (es) 1972-11-24
FR2132846B1 (es) 1977-12-23
CA943268A (en) 1974-03-05
US3735017A (en) 1973-05-22
GB1337692A (en) 1973-11-21
SE368478B (es) 1974-07-01
BE781898A (fr) 1972-10-10
IT950743B (it) 1973-06-20
NL7204755A (es) 1972-10-16

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