DE2102421C3 - Verfahren zur Herstellung einer strukturierten metallischen Schicht auf einem keramischen Grundkörper - Google Patents

Verfahren zur Herstellung einer strukturierten metallischen Schicht auf einem keramischen Grundkörper

Info

Publication number
DE2102421C3
DE2102421C3 DE2102421A DE2102421A DE2102421C3 DE 2102421 C3 DE2102421 C3 DE 2102421C3 DE 2102421 A DE2102421 A DE 2102421A DE 2102421 A DE2102421 A DE 2102421A DE 2102421 C3 DE2102421 C3 DE 2102421C3
Authority
DE
Germany
Prior art keywords
layer
metallic layer
base body
metallic
ceramic base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2102421A
Other languages
German (de)
English (en)
Other versions
DE2102421B2 (de
DE2102421A1 (de
Inventor
Peter Dipl.-Phys. 8000 Muenchen Guglhoer
Heinz 8014 Neubiberg Hagen
Walther Dipl.-Ing. 8000 Muenchen Huber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE2102421A priority Critical patent/DE2102421C3/de
Priority to CH1291471A priority patent/CH576003A5/xx
Priority to AT852171A priority patent/AT317337B/de
Priority to GB5150371A priority patent/GB1327670A/en
Priority to US00213427A priority patent/US3829316A/en
Priority to IT19320/72A priority patent/IT946536B/it
Priority to FR7201383A priority patent/FR2122450B1/fr
Priority to CA132,663A priority patent/CA985606A/en
Priority to NL7200742A priority patent/NL7200742A/xx
Priority to JP754272A priority patent/JPS5535468B1/ja
Publication of DE2102421A1 publication Critical patent/DE2102421A1/de
Publication of DE2102421B2 publication Critical patent/DE2102421B2/de
Application granted granted Critical
Publication of DE2102421C3 publication Critical patent/DE2102421C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Ceramic Products (AREA)
  • Chemically Coating (AREA)
DE2102421A 1971-01-19 1971-01-19 Verfahren zur Herstellung einer strukturierten metallischen Schicht auf einem keramischen Grundkörper Expired DE2102421C3 (de)

Priority Applications (10)

Application Number Priority Date Filing Date Title
DE2102421A DE2102421C3 (de) 1971-01-19 1971-01-19 Verfahren zur Herstellung einer strukturierten metallischen Schicht auf einem keramischen Grundkörper
CH1291471A CH576003A5 (OSRAM) 1971-01-19 1971-09-03
AT852171A AT317337B (de) 1971-01-19 1971-10-01 Verfahren zur Herstellung von mindestens einer strukturierten metallischen Schicht auf einem Grundkörper
GB5150371A GB1327670A (en) 1971-01-19 1971-11-05 Production of metallising layers on substrate bodies
US00213427A US3829316A (en) 1971-01-19 1971-12-29 Method for the preparation of metallic layers on a substrate
IT19320/72A IT946536B (it) 1971-01-19 1972-01-13 Procedimento per formare strati metallici su un substrato
FR7201383A FR2122450B1 (OSRAM) 1971-01-19 1972-01-17
CA132,663A CA985606A (en) 1971-01-19 1972-01-18 Process for the production of a metallic layer having a predetermined structure on a substrate body
NL7200742A NL7200742A (OSRAM) 1971-01-19 1972-01-19
JP754272A JPS5535468B1 (OSRAM) 1971-01-19 1972-01-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2102421A DE2102421C3 (de) 1971-01-19 1971-01-19 Verfahren zur Herstellung einer strukturierten metallischen Schicht auf einem keramischen Grundkörper

Publications (3)

Publication Number Publication Date
DE2102421A1 DE2102421A1 (de) 1973-06-14
DE2102421B2 DE2102421B2 (de) 1979-01-11
DE2102421C3 true DE2102421C3 (de) 1979-09-06

Family

ID=5796328

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2102421A Expired DE2102421C3 (de) 1971-01-19 1971-01-19 Verfahren zur Herstellung einer strukturierten metallischen Schicht auf einem keramischen Grundkörper

Country Status (10)

Country Link
US (1) US3829316A (OSRAM)
JP (1) JPS5535468B1 (OSRAM)
AT (1) AT317337B (OSRAM)
CA (1) CA985606A (OSRAM)
CH (1) CH576003A5 (OSRAM)
DE (1) DE2102421C3 (OSRAM)
FR (1) FR2122450B1 (OSRAM)
GB (1) GB1327670A (OSRAM)
IT (1) IT946536B (OSRAM)
NL (1) NL7200742A (OSRAM)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5293963A (en) * 1976-02-03 1977-08-08 Nippon Electric Co Method of producing thick film wiring circuit substrate
US4376815A (en) * 1979-10-22 1983-03-15 Oddi Michael J Method of applying photoresist by screening in the formation of printed circuits
US4352714A (en) * 1980-09-29 1982-10-05 Union Carbide Corporation Method for making a metal-to-ceramic insulator seal for electrochemical cells
DE3235675A1 (de) * 1982-09-27 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von halbleiterchip-filmtraegern
DE3235702C2 (de) * 1982-09-27 1985-01-17 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von Filmträgern für Halbleiterchips
JPH074995B2 (ja) * 1986-05-20 1995-01-25 株式会社東芝 Ｉｃカ−ド及びその製造方法
DE3907004A1 (de) * 1989-03-04 1990-09-06 Contraves Ag Verfahren zum herstellen von duennschichtschaltungen
US5345529A (en) * 1993-07-06 1994-09-06 At&T Bell Laboratories Method for assembly of an optical fiber connective device
US5416872A (en) * 1993-07-06 1995-05-16 At&T Corp. Arrangement for interconnecting an optical fiber an optoelectronic component
JPH0714597U (ja) * 1993-08-17 1995-03-10 ワデン工業株式会社 発熱体

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1121668A (en) * 1965-12-07 1968-07-31 Hermsdorf Keramik Veb Method for the production of etch-resist masks on substrates

Also Published As

Publication number Publication date
US3829316A (en) 1974-08-13
DE2102421B2 (de) 1979-01-11
IT946536B (it) 1973-05-21
FR2122450A1 (OSRAM) 1972-09-01
CA985606A (en) 1976-03-16
CH576003A5 (OSRAM) 1976-05-31
DE2102421A1 (de) 1973-06-14
JPS5535468B1 (OSRAM) 1980-09-13
NL7200742A (OSRAM) 1972-07-21
AT317337B (de) 1974-08-26
FR2122450B1 (OSRAM) 1975-06-13
GB1327670A (en) 1973-08-22

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee