GB1121668A - Method for the production of etch-resist masks on substrates - Google Patents

Method for the production of etch-resist masks on substrates

Info

Publication number
GB1121668A
GB1121668A GB5186165A GB5186165A GB1121668A GB 1121668 A GB1121668 A GB 1121668A GB 5186165 A GB5186165 A GB 5186165A GB 5186165 A GB5186165 A GB 5186165A GB 1121668 A GB1121668 A GB 1121668A
Authority
GB
United Kingdom
Prior art keywords
substrate
layer
electron
lacquer
masking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5186165A
Inventor
Manfred Neumann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HERMSDORF KERAMIK VEB
Keramische Werke Hermsdorf VEB
Original Assignee
HERMSDORF KERAMIK VEB
Keramische Werke Hermsdorf VEB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HERMSDORF KERAMIK VEB, Keramische Werke Hermsdorf VEB filed Critical HERMSDORF KERAMIK VEB
Priority to GB5186165A priority Critical patent/GB1121668A/en
Publication of GB1121668A publication Critical patent/GB1121668A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/064Photoresists
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/02Local etching
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09Treatments involving charged particles
    • H05K2203/092Particle beam, e.g. using an electron beam or an ion beam
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

1,121,668. Etching. KERAMISCHE WERKE HERMSDORF VEB. 7 Dec., 1965, No. 51861/65. Heading B6J. [Also in Division H1] An etch-resistant mask is produced on a substrate by subjecting a substrate-masking layer of nitrocellulose lacquer to the action of an electron beam at regions of the layer which are not required to exert a masking action on the substrate, and treating the exposed regions with a chemical reagent e.g. ferric chloride or ammonium peroxydisulphate, to remove the lacquer selectively at the said regions. The electron beam charge density is between 5 and 10 microamp seconds per square millimetre. The exposure may be made through an electron-permeable stencil by direct masking or electron-optical image projection therethrough. Alternatively an electron probe may be guided over the layer by a programme controlled deflection system. The substrate may be a copper layer on a glass base, the abovementioned reagents attacking the copper after selective removal of the lacquer.
GB5186165A 1965-12-07 1965-12-07 Method for the production of etch-resist masks on substrates Expired GB1121668A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB5186165A GB1121668A (en) 1965-12-07 1965-12-07 Method for the production of etch-resist masks on substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5186165A GB1121668A (en) 1965-12-07 1965-12-07 Method for the production of etch-resist masks on substrates

Publications (1)

Publication Number Publication Date
GB1121668A true GB1121668A (en) 1968-07-31

Family

ID=10461678

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5186165A Expired GB1121668A (en) 1965-12-07 1965-12-07 Method for the production of etch-resist masks on substrates

Country Status (1)

Country Link
GB (1) GB1121668A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2122450A1 (en) * 1971-01-19 1972-09-01 Siemens Ag

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2122450A1 (en) * 1971-01-19 1972-09-01 Siemens Ag

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