DE2046750A1 - Kuhlsystem fur Modulbausteine - Google Patents

Kuhlsystem fur Modulbausteine

Info

Publication number
DE2046750A1
DE2046750A1 DE19702046750 DE2046750A DE2046750A1 DE 2046750 A1 DE2046750 A1 DE 2046750A1 DE 19702046750 DE19702046750 DE 19702046750 DE 2046750 A DE2046750 A DE 2046750A DE 2046750 A1 DE2046750 A1 DE 2046750A1
Authority
DE
Germany
Prior art keywords
reservoir
fluid
coolant
cooling
cooling system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19702046750
Other languages
German (de)
English (en)
Inventor
Richard Chao San Hwang Un Pah Poughkeepsie NY Chu (V St A )
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE2046750A1 publication Critical patent/DE2046750A1/de
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Details Of Measuring And Other Instruments (AREA)
DE19702046750 1969-10-13 1970-09-23 Kuhlsystem fur Modulbausteine Pending DE2046750A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86571069A 1969-10-13 1969-10-13

Publications (1)

Publication Number Publication Date
DE2046750A1 true DE2046750A1 (de) 1971-04-22

Family

ID=25346070

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19702046750 Pending DE2046750A1 (de) 1969-10-13 1970-09-23 Kuhlsystem fur Modulbausteine

Country Status (5)

Country Link
US (1) US3609991A (enExample)
JP (1) JPS508550B1 (enExample)
DE (1) DE2046750A1 (enExample)
FR (1) FR2065892A5 (enExample)
GB (1) GB1314536A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3044314A1 (de) * 1980-11-25 1982-06-24 Kabel- und Metallwerke Gutehoffnungshütte AG, 3000 Hannover Gehaeuse zur aufnahme von mit waerme erzeugenden elektronischen bauteilen bestueckten gedruckten schaltungen
EP0231456A1 (de) * 1985-12-13 1987-08-12 Ascom Hasler AG Verfahren und Vorrichtung zum Abführen der Verlustwärme wenigstens einer Baugruppe elektrischer Elemente
EP0298372A3 (en) * 1987-07-10 1989-03-08 Hitachi, Ltd. Semiconductor cooling apparatus and cooling method thereof
FR2659426A1 (fr) * 1990-03-08 1991-09-13 Bull Sa Dispositif de recuperation et de transfert de chaleur.
DE19826733A1 (de) * 1998-06-16 1999-12-23 Isad Electronic Sys Gmbh & Co Kühlsystem für eine Leistungselektronik zum Betreiben wenigstens eines elektrischen Aggregats eines Kraftfahrzeugs
DE10053258A1 (de) * 2000-10-26 2002-05-16 Guenther Engineering Gmbh Enthitzungseinrichtung für elektronische Geräte
EP1793422A2 (en) 2005-11-30 2007-06-06 Raython Company System and method of enhanced boiling heat transfer using pin fins
EP1860695A3 (en) * 2006-05-24 2010-06-16 Raytheon Company System and method of jet impingement cooling with extended surfaces
US9383145B2 (en) 2005-11-30 2016-07-05 Raytheon Company System and method of boiling heat transfer using self-induced coolant transport and impingements

Families Citing this family (101)

* Cited by examiner, † Cited by third party
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US3962529A (en) * 1970-10-07 1976-06-08 Sumitomo Electric Industries, Ltd. Evaporative cooling power cable line
DE2102254B2 (de) * 1971-01-19 1973-05-30 Robert Bosch Gmbh, 7000 Stuttgart Kuehlvorrichtung fuer leistungshalbleiterbauelemente
US3818983A (en) * 1972-09-18 1974-06-25 Borg Warner Cooled enclosure
US3848988A (en) * 1973-06-11 1974-11-19 Xerox Corp Moisture control device
US3906261A (en) * 1973-06-12 1975-09-16 Mitsubishi Electric Corp Linear acceleration apparatus with cooling system
US4040478A (en) * 1973-10-01 1977-08-09 The Boeing Company External tube artery flexible heat pipe
JPS5512740B2 (enExample) * 1974-03-15 1980-04-03
JPS5241149B2 (enExample) * 1974-03-16 1977-10-17
JPS5241193B2 (enExample) * 1974-03-16 1977-10-17
JPS51101252A (ja) * 1975-03-04 1976-09-07 Mitsubishi Electric Corp Futsutoreikyakusochi
US4172243A (en) * 1977-06-10 1979-10-23 Westinghouse Electric Corp. Transformer with a liquid cooled case and a method for making the liquid cooled case
US4149134A (en) * 1977-08-01 1979-04-10 Elect Power Research Institute, Inc. Vaporization-cooled electrical apparatus
US4230173A (en) * 1978-09-05 1980-10-28 Thermacore, Inc. Closely coupled two phase heat exchanger
JPS57122271A (en) * 1981-01-23 1982-07-30 Tokyo Electric Power Co Defrosting of air cooler
US4393663A (en) * 1981-04-13 1983-07-19 Gas Research Institute Two-phase thermosyphon heater
DE3236612A1 (de) * 1982-10-02 1984-04-05 Brown, Boveri & Cie Ag, 6800 Mannheim Kuehlanordnung, bei der die zu kuehlenden stromrichter oder andere halbleiter in siedefluessigkeit eintauchen
JPS5960480U (ja) * 1982-10-13 1984-04-20 大阪瓦斯株式会社 空気冷却器
US4493010A (en) * 1982-11-05 1985-01-08 Lockheed Corporation Electronic packaging module utilizing phase-change conductive cooling
US4757690A (en) * 1987-11-19 1988-07-19 Carrier Corporation Water freezing enhancement for thermal storage brine tube
FR2628193B1 (fr) * 1988-03-07 1990-06-15 Comp Generale Electricite Dispositif pour le refroidissement des composants electroniques de puissance
DE68922061T2 (de) * 1988-10-03 1995-08-31 Canon Kk Vorrichtung zum Regeln der Temperatur.
US5195577A (en) * 1989-10-26 1993-03-23 Mitsubishi Denki Kabushiki Kaisha Cooling device for power semiconductor switching elements
AU629761B2 (en) * 1989-10-26 1992-10-08 Mitsubishi Denki Kabushiki Kaisha Boiling and condensing heat transfer type cooler device for power semiconductor switching elements
US5168919A (en) * 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
DE4033383C2 (de) * 1990-10-20 1994-05-11 Fraunhofer Ges Forschung Kühlvorrichtung für elektronische Bauelemente
US5131233A (en) * 1991-03-08 1992-07-21 Cray Computer Corporation Gas-liquid forced turbulence cooling
JPH05136305A (ja) * 1991-11-08 1993-06-01 Hitachi Ltd 発熱体の冷却装置
DE4320803C2 (de) * 1993-06-23 2001-06-28 Inst Luft & Kaeltetechnik Ggmbh Lageunabhängiges Sensor-Kühlsystem
US5365749A (en) * 1993-12-23 1994-11-22 Ncr Corporation Computer component cooling system with local evaporation of refrigerant
US5473508A (en) * 1994-05-31 1995-12-05 At&T Global Information Solutions Company Focused CPU air cooling system including high efficiency heat exchanger
US5529115A (en) * 1994-07-14 1996-06-25 At&T Global Information Solutions Company Integrated circuit cooling device having internal cooling conduit
DE4441162A1 (de) * 1994-11-18 1996-06-05 Daimler Benz Ag Kühleinrichtung für eine aus mehreren Zellen aufgebaute Batterie
SE9500944L (sv) * 1995-03-17 1996-05-28 Ericsson Telefon Ab L M Kylsystem för elektronik
US5940270A (en) * 1998-07-08 1999-08-17 Puckett; John Christopher Two-phase constant-pressure closed-loop water cooling system for a heat producing device
JP3964580B2 (ja) * 1999-09-03 2007-08-22 富士通株式会社 冷却ユニット
US6408937B1 (en) * 2000-11-15 2002-06-25 Sanjay K. Roy Active cold plate/heat sink
JP2002168547A (ja) * 2000-11-20 2002-06-14 Global Cooling Bv 熱サイホンによるｃｐｕ冷却装置
US6700396B1 (en) 2001-05-16 2004-03-02 Ltx Corporation Integrated micromachine relay for automated test equipment applications
US6611071B2 (en) 2001-08-17 2003-08-26 Siemens Automotive Inc. Embedded electronics for high convection cooling in an engine cooling motor application
DE10141261A1 (de) * 2001-08-23 2003-03-13 Bayerische Motoren Werke Ag Verfahren zur Kühlung elektromagnetischer Aktuatoren
US6904968B2 (en) * 2001-09-14 2005-06-14 Hewlett-Packard Development Company, L.P. Method and apparatus for individually cooling components of electronic systems
US6856037B2 (en) * 2001-11-26 2005-02-15 Sony Corporation Method and apparatus for converting dissipated heat to work energy
DE10210480B4 (de) * 2002-03-11 2005-07-21 Rittal Gmbh & Co. Kg Kühlanordnung
GB2389174B (en) * 2002-05-01 2005-10-26 Rolls Royce Plc Cooling systems
US7000691B1 (en) 2002-07-11 2006-02-21 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
US6937471B1 (en) 2002-07-11 2005-08-30 Raytheon Company Method and apparatus for removing heat from a circuit
US7035104B2 (en) * 2002-08-06 2006-04-25 Mudawar Thermal Systems Inc. Apparatus for heat transfer and critical heat flux enhancement
JP4214881B2 (ja) * 2003-01-21 2009-01-28 三菱電機株式会社 気泡ポンプ型熱輸送機器
US20080066889A1 (en) * 2003-02-19 2008-03-20 Isothermal Systems Research Heat exchanging fluid return manifold for a liquid cooling system
US6957550B2 (en) * 2003-05-19 2005-10-25 Raytheon Company Method and apparatus for extracting non-condensable gases in a cooling system
US7508672B2 (en) * 2003-09-10 2009-03-24 Qnx Cooling Systems Inc. Cooling system
WO2005055319A2 (en) * 2003-12-08 2005-06-16 Noise Limit Aps A cooling system with a bubble pump
JP2005195226A (ja) 2004-01-06 2005-07-21 Mitsubishi Electric Corp ポンプレス水冷システム
DE102004020642A1 (de) * 2004-04-22 2005-11-10 Höhne, Sven, Dipl.-Ing (FH) Schwerkraftkühlung für elektronische Bauteile
US20050262861A1 (en) * 2004-05-25 2005-12-01 Weber Richard M Method and apparatus for controlling cooling with coolant at a subambient pressure
US20050274139A1 (en) * 2004-06-14 2005-12-15 Wyatt William G Sub-ambient refrigerating cycle
US8341965B2 (en) 2004-06-24 2013-01-01 Raytheon Company Method and system for cooling
US7212403B2 (en) * 2004-10-25 2007-05-01 Rocky Research Apparatus and method for cooling electronics and computer components with managed and prioritized directional air flow heat rejection
US7254957B2 (en) * 2005-02-15 2007-08-14 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
US8978741B2 (en) * 2006-02-17 2015-03-17 Hewlett-Packard Development Company, L.P. Device for reducing temperature variations in plenums
US20070209782A1 (en) * 2006-03-08 2007-09-13 Raytheon Company System and method for cooling a server-based data center with sub-ambient cooling
US7908874B2 (en) 2006-05-02 2011-03-22 Raytheon Company Method and apparatus for cooling electronics with a coolant at a subambient pressure
TW200821801A (en) 2006-11-08 2008-05-16 Jiun-Guang Luo Case having phase-change heat dissipating device
CN101184381A (zh) 2006-11-14 2008-05-21 诺亚公司 具有相变散热装置的机壳
US20080173427A1 (en) * 2007-01-23 2008-07-24 Richard Schumacher Electronic component cooling
US8651172B2 (en) 2007-03-22 2014-02-18 Raytheon Company System and method for separating components of a fluid coolant for cooling a structure
US20080283221A1 (en) * 2007-05-15 2008-11-20 Christian Blicher Terp Direct Air Contact Liquid Cooling System Heat Exchanger Assembly
US7921655B2 (en) * 2007-09-21 2011-04-12 Raytheon Company Topping cycle for a sub-ambient cooling system
US9074825B2 (en) * 2007-09-28 2015-07-07 Panasonic Intellectual Property Management Co., Ltd. Heatsink apparatus and electronic device having the same
US7934386B2 (en) * 2008-02-25 2011-05-03 Raytheon Company System and method for cooling a heat generating structure
US7907409B2 (en) 2008-03-25 2011-03-15 Raytheon Company Systems and methods for cooling a computing component in a computing rack
US8517085B2 (en) * 2008-09-03 2013-08-27 Lenovo (Singapore) Pte. Ltd. Vapor flow in heat pipe using centrifugal blower
WO2010037829A1 (de) 2008-10-01 2010-04-08 Magna Steyr Fahrzeugtechnik Ag & Co Kg Entlüftungsvorrichtung für getriebe mit wasser enthaltendem schmierstoff
US7944694B2 (en) * 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
US7916483B2 (en) * 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
US7885070B2 (en) * 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
US7983040B2 (en) * 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US7961475B2 (en) * 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
GB2471865B (en) 2009-07-15 2011-06-29 Bright Light Solar Ltd Refrigeration apparatus
US8035972B2 (en) * 2009-07-31 2011-10-11 Oracle America, Inc. Method and apparatus for liquid cooling computer equipment
US9605907B2 (en) * 2010-03-29 2017-03-28 Nec Corporation Phase change cooler and electronic equipment provided with same
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
JP2012132661A (ja) * 2010-12-01 2012-07-12 Fujitsu Ltd 冷却装置及び電子装置
JP2013130332A (ja) * 2011-12-21 2013-07-04 Toshiba Corp 気泡駆動冷却装置
EA201491428A1 (ru) 2012-01-27 2014-11-28 Зе Шуэ Чил Компани Лимитед Холодильный аппарат
US20140138058A1 (en) * 2012-11-20 2014-05-22 Elwha Llc Heat pipe having a channeled heat transfer array
GB201301494D0 (en) 2013-01-28 2013-03-13 True Energy Ltd Refrigeration apparatus
US9464854B2 (en) 2013-02-01 2016-10-11 Dell Products, Lp Techniques for controlling vapor pressure in an immersion cooling tank
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GB2518727B (en) 2013-07-23 2017-05-24 The Sure Chill Company Ltd Refrigeration apparatus and method
EP3341665B1 (en) 2015-09-11 2024-07-10 The Sure Chill Company Limited Portable refrigeration system and chilling panel
GB201619987D0 (en) 2016-11-25 2017-01-11 Iceotope Ltd Fluid cooling system
US12101911B2 (en) * 2019-10-24 2024-09-24 Sanhua (Hangzhou) Micro Channel Heat Exchanger Co., Ltd. Heat exchange system used for heat dissipation of electronic control assembly and computer host
US11578476B2 (en) * 2020-03-25 2023-02-14 John Saavedra Evaporative cooler and moisture condenser with vapor recovery and method
US10966349B1 (en) 2020-07-27 2021-03-30 Bitfury Ip B.V. Two-phase immersion cooling apparatus with active vapor management
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CN115551302B (zh) * 2022-09-28 2025-08-12 华为数字能源技术有限公司 散热系统及电子设备

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3044314A1 (de) * 1980-11-25 1982-06-24 Kabel- und Metallwerke Gutehoffnungshütte AG, 3000 Hannover Gehaeuse zur aufnahme von mit waerme erzeugenden elektronischen bauteilen bestueckten gedruckten schaltungen
EP0231456A1 (de) * 1985-12-13 1987-08-12 Ascom Hasler AG Verfahren und Vorrichtung zum Abführen der Verlustwärme wenigstens einer Baugruppe elektrischer Elemente
EP0298372A3 (en) * 1987-07-10 1989-03-08 Hitachi, Ltd. Semiconductor cooling apparatus and cooling method thereof
FR2659426A1 (fr) * 1990-03-08 1991-09-13 Bull Sa Dispositif de recuperation et de transfert de chaleur.
DE19826733A1 (de) * 1998-06-16 1999-12-23 Isad Electronic Sys Gmbh & Co Kühlsystem für eine Leistungselektronik zum Betreiben wenigstens eines elektrischen Aggregats eines Kraftfahrzeugs
WO1999066774A1 (de) * 1998-06-16 1999-12-23 Continental Isad Electronic Systems Gmbh & Co. Ohg Kühlsystem für eine leistungselektronik zum betreiben wenigstens eines elektrischen aggregates eines kraftfahrzeugs
DE10053258A1 (de) * 2000-10-26 2002-05-16 Guenther Engineering Gmbh Enthitzungseinrichtung für elektronische Geräte
EP1793422A2 (en) 2005-11-30 2007-06-06 Raython Company System and method of enhanced boiling heat transfer using pin fins
EP1793422A3 (en) * 2005-11-30 2010-05-26 Raython Company System and method of enhanced boiling heat transfer using pin fins
US9383145B2 (en) 2005-11-30 2016-07-05 Raytheon Company System and method of boiling heat transfer using self-induced coolant transport and impingements
EP1860695A3 (en) * 2006-05-24 2010-06-16 Raytheon Company System and method of jet impingement cooling with extended surfaces

Also Published As

Publication number Publication date
US3609991A (en) 1971-10-05
GB1314536A (en) 1973-04-26
JPS508550B1 (enExample) 1975-04-04
FR2065892A5 (enExample) 1971-08-06

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